Semiconductor device for heat discharge
First Claim
1. A semiconductor device, comprising;
- a substrate including a plurality of layers, an inner portion having at least one inner layer, a concave area exposing an inner ground layer of the substrate, a first side and a second side opposing the first side;
a plurality of vacant thermal via holes formed in the inner ground layer of the substrate, the thermal via holes intersecting a conductor pattern of at least one layer of the substrate;
an electronic component mounted over the thermal via holes on the first side of the substrate;
a bonding agent attaching the electronic component to a surface of the inner ground layer;
a heat discharging element disposed on the second side of the substrate; and
a high heat conductive material located between the heat discharging element and the substrate and adjacent the thermal via holes.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor device comprising a low-heat-resistance heat discharging route suitable for small semiconductor devices, such as an IC card, is disclosed. Heat arising from electronic parts is efficiently dispersed to the outside, thereby accomplishing a decrease in size and a heightening of function. In a specific embodiment, a CPU is mounted on a substrate in a position of thermal via holes. A high-heat-conducting material such as semifluid silicone rubber is placed between a CPU mounting face of the substrate and lower panel located on the opposite side of the substrate. The high-heat-conducting material is a filler having the ability to change shape and the property of electrical nonconductivity. A greater part of the heat arising from the CPU is transmitted through the thermal via holes from the CPU mounting face of the substrate to the opposite side, and further to the high-heat-conducting material which conveys the heat to the lower panel. The heat is dispersed from the lower panel surface directly into the atmosphere.
-
Citations
43 Claims
-
1. A semiconductor device, comprising;
-
a substrate including a plurality of layers, an inner portion having at least one inner layer, a concave area exposing an inner ground layer of the substrate, a first side and a second side opposing the first side; a plurality of vacant thermal via holes formed in the inner ground layer of the substrate, the thermal via holes intersecting a conductor pattern of at least one layer of the substrate; an electronic component mounted over the thermal via holes on the first side of the substrate; a bonding agent attaching the electronic component to a surface of the inner ground layer; a heat discharging element disposed on the second side of the substrate; and a high heat conductive material located between the heat discharging element and the substrate and adjacent the thermal via holes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
-
-
19. A semiconductor device, comprising:
-
a substrate having a first side and a second side opposing the first side; a plurality of vacant thermal via holes formed in the substrate; an electronic component mounted over the thermal via holes on the first side of the substrate; a heat discharging element disposed on the second side of the substrate; a metallic substrate disposed between the substrate and the heat discharging element; and a high heat conductive material laminated to opposite sides of the metallic substrate, the high heat conductive material being located (i) between the substrate and the metallic substrate and adjacent the thermal via holes, and (ii) between the metallic substrate and the heat discharging element. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
-
-
35. A semiconductor device, comprising:
-
a substrate including a first side, a second side opposing the first side, multiple layers, at least one layer being a ground layer disposed inside a concave area at the first side; a plurality of vacant thermal via holes formed in the substrate and being electrically connected to the ground layer; an electronic component mounted on the ground layer inside of the concave area of the substrate and over the thermal via holes; a heat discharging element disposed on the second side of the substrate, the heat discharging element including a protruding part; and a high heat conductive material located between the heat discharging element and the substrate and adjacent the thermal via holes. - View Dependent Claims (36)
-
-
37. A semiconductor device, comprising:
-
a substrate having a first side and a second side opposing the first side; a plurality of vacant thermal via holes formed in the substrate; a semiconductor chip surface-mounted on the first side of the substrate over the thermal via holes by a bonding agent, the semiconductor chip being sealed by a resin having a surface; a first heat discharging element disposed on the first side of the substrate; a second heat discharging element disposed on the second side of the substrate; and a high heat conductive material located (i) between the second heat discharging element and the substrate and adjacent the thermal via holes, and (ii) between the surface of the resin and the first heat discharging element. - View Dependent Claims (38, 39)
-
-
40. A semiconductor device, comprising:
-
a substrate including a first side and a second side opposing the first side; a plurality of vacant thermal via holes formed in the substrate; a first electronic component mounted over the thermal via holes on the first surface of the substrate; a second electronic component mounted on the second side of the substrate; a heat discharging element disposed on the second side of the substrate, the heat discharging element comprises an integrally formed protruding part on the second side of the substrate; and a high heat conductive material connecting the protruding part of the heat discharging element and the substrate and being located adjacent the thermal via holes. - View Dependent Claims (41)
-
-
42. A semiconductor device, comprising:
-
a substrate including first side and a second side opposing the first side; a plurality of thermal via holes formed in the substrate, the thermal via holes being vacant; a first electronic component mounted over the thermal via holes on the first surface of the substrate; a second electronic component mounted on the second side of the substrate; a heat discharging element disposed on the second side of the substrate, the heat discharging element including an integrally formed protruding part attached to the substrate, a depression on a side of the heat discharging element facing away from the second side of the substrate, and a heat radiating fin integrally formed in the depression; and a high heat conductive material connecting the protruding part of the heat discharging element and the substrate and being located adjacent the thermal via holes. - View Dependent Claims (43)
-
Specification