Method of making a flip-chip bonded GaAs-based opto-electronic device

• US 5,923,951 A
• Filed: 07/29/1996
• Issued: 07/13/1999
• Est. Priority Date: 07/29/1996
• Status: Expired due to Term

• Current Assignee: Hanger Solutions, LLC (IP Investments Group LLC)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Goossen, Keith Wayne, Wang, Yu-Chi, Kuo, Jenn-Ming
• Primary Examiner(s): CHAUDHURI, OLIK
• Assistant Examiner(s): CHAUDHURI, OLIK
• Application Number:
  US08/688,131
• Time in Patent Office: 1,079 Days
• Field of Search: 438/29, 438/32, 438/47, 257/777, 372/45, 372/46, 372/47
• US Class Current: 438/47
• CPC Class Codes: H01L 21/02395 Arsenides
• CPC Class Codes: H01L 21/02461 Phosphides
• CPC Class Codes: H01L 21/02546 Arsenides
• CPC Class Codes: H01L 21/30612 Etching of AIIIBV compounds
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

In a method of making a flip-chip bonded GaAs-based opto-electronic device, removal of the GaAs substrate is facilitated by provision of a lattice matched (Al_x Ga_1-x)InP etch stop layer, exemplarily a Ga₀.51 In₀.49 P layer, and use of an etchant that isotropically etches GaAs such that an essentially mirror-like etch stop layer surface results, and that preferably exhibits an etch rate ratio of at least 200:1 for GaAs and the etch stop layer, respectively. Use of the novel substrate removal method can substantially increase device yield, and facilitate manufacture of large device arrays, e.g., arrays of detector/modulator diodes flip-chip bonded to Si CMOS chips.

Claims

1. Method of making an article that comprises an opto-electronic device flip-chip bonded to a circuitry-bearing Si body, the method comprising

a) forming a device-bearing substrate by providing a GaAs substrate and forming the opto-electronic device on a first major surface of the GaAs substrate, including forming an etch-stop layer on the first major surface;

b) providing the circuitry-bearing Si body;

c) flip-chip bonding the device-bearing GaAs substrate to the circuitry-bearing Si body;

d) removing by etching the GaAs substrate, leaving the opto-electronic device operatively connected to the circuitry-bearing Si body;

CHARACTERIZED IN THAT

e) the etch-stop layer is an AlGaInP-layer essentially lattice matched to GaAs;

f) step d) comprises contacting the GaAs substrate with an etchant selected to etch GaAs essentially isotropically to produce a substantially mirror-like etch-stop layer surface, and to exhibit an etch rate ratio of at least 100;

1 for GaAs and the etch stop layer, respectively.

2. Method according to claim 1, wherein the etch stop layer has nominal composition (Al_x Ga_1-x)₀.51 In₀.49 P, 0≦

x<

1, and the etchant is selected from the group consisting of NH₄ OH;

H₂ O₂ etchants and H₃ PO₄ ;

H₂ O₂ ;

H₂ O etchants.

3. Method according to claim 2, wherein the etch stop layer has nominal composition Ga₀.51 In₀.49 P, and the etchant is selected from the group consisting of 5H₃ PO₄ :

3H₂ O₂ ;

3H₂ O and 1NH₄ OH;

35H₂ O₂.

4. Method according to claim 1, wherein an array of detector/modulator diodes is flip-chip bonded to a Si CMOS chip.

5. Method according to claim 1, wherein step d) comprises thinning the substrate by mechanical polishing prior to contacting the thinned GaAs substrate with the etchant.

6. Method according to claim 5, wherein the thinned GaAs substrate has a thickness of at least 100 μ

m.