Method and apparatus for a modular integrated apparatus for multi-function components

• US 5,926,370 A
• Filed: 10/29/1998
• Issued: 07/20/1999
• Est. Priority Date: 10/29/1998
• Status: Expired due to Term

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Cromwell, S. Daniel
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Datskousky, Michael
• Application Number:
  US09/182,939
• Time in Patent Office: 264 Days
• Field of Search: 361/683, 361/685, 361/687, 361/699, 361/695, 361/697, 361/676, 361/700, 361/818, 361/829, 257/713, 257/715, 257/714, 257/700, 257/707, 257/723, 257/683, 257/704, 165/80.2, 165/80.3, 165/80.4, 165/104.21, 165/104.14, 165/104.33
• US Class Current: 361/700
• CPC Class Codes: G06F 1/18 Packaging or power distribution
• CPC Class Codes: H05K 7/1411 for securing or extracting box-type drawers
• CPC Class Codes: H05K 7/1429 for circuits carrying a CPU and adapted to receive expansion cards

Abstract

A modular integrated computer apparatus that includes a CPU or VLSI module connected to a printed circuit board, a power converter, and one or more associated electric power cables; and is a supporting infrastructure that ensures ease of use. The field replaceable apparatus may also function as an EMI enclosure and a heat management device. The field replaceable apparatus may be inserted and removed from a computer system by handles that are attached to the modular integrated apparatus. The installed field replaceable apparatus is positioned to ensure that the CPU module is properly connected to the printed circuit board.

Claims

1. A modular integrated apparatus for a computer system having primary electric power and a printed circuit board, said modular integrated apparatus comprising;

a CPU module operably connected to said printed circuit board at a pre-determined location;

a power converter for transforming said primary electric power into a form suitable for said CPU module, said power converter having at least one input electric power connection for connection to and transmission of said primary electric power, and at least one output electric power connection for connection to and transmission of said transformed electric power;

an isothermal plate physically attached to said CPU module and to said power converter for managing heat in said computer system; and

an alignment frame attached to said isothermal plate at a pre-determined location for aligning the relative positions of said CPU module, said power converter, and said isothermal plate to said computer system, thereby causing said modular integrated apparatus to be operably connected to said computer system.

2. A modular integrated apparatus for a computer system having primary electric power and a printed circuit board, said modular integrated apparatus comprising;

a field replaceable apparatus having;

a CPU module operably connected to said printed circuit board at a predetermined location;

a power converter for transforming said primary electric power into a form suitable for said CPU module, said power converter having at least one input electric power connection for transmission of said primary electric power, and at least one output electric power connection for transmission of said transformed electric power;

an isothermal plate physically attached to said CPU module and to said power converter for managing heat in said computer system; and

an alignment frame attached to said isothermal plate at a pre-determined location facilitating insertion and removal of said field replaceable apparatus from and to said computer system and for aligning the relative positions of said CPU module, said power converter, and said isothermal plate to said computer system, thereby causing said modular integrated apparatus to be operably connected to said computer system;

a receiving apparatus having;

a CPU module sleeve between said printed circuit board and said CPU module, wherein said CPU module sleeve aligns said CPU module to said printed circuit board for operable connection of said CPU module to said computer system; and

said printed circuit board being attached to said CPU module sleeve; and

said receiving apparatus being attached to said field replaceable apparatus for forming said modular integrated apparatus.

3. A modular integrated apparatus as set forth in claim 2, further comprising at least one insertion-extraction handle that attaches to said alignment frame and that movably pivots to insert said field replaceable apparatus from and to said computer system.

4. A modular integrated apparatus as set forth in claim 2, said field replaceable apparatus further comprising a heat management device having at least one heat pipe attached to said isothermal plate thereby diverting heat away from said isothermal plate.

5. A modular integrated apparatus as set forth in claim 2, said field replaceable apparatus further comprising a heat management device including at least one heat pipe attached to said isothermal plate thereby directing heat toward said isothermal plate.

6. A modular integrated apparatus as set forth in claim 2, said field replaceable apparatus further comprising a heat management device including at least one heat fin located adjacent to said power converter and said isothermal plate, thereby said heat fin absorbs heat from said isothermal plate.

7. A modular integrated apparatus as set forth in claim 4, said heat management device having at least one heat fin located adjacent to said power converter and said isothermal plate, thereby said heat fin absorbs heat away from said isothermal plate and said heat pipes.

8. A modular integrated apparatus as set forth in claim 4, wherein said heat pipe extends into said isothermal plate for eliminating dry out of said isothermal plate.

9. A modular integrated apparatus as set forth in claim 2, wherein said isothermal plate includes an isothermal plate slot forming a passageway for said input electric power connection and said output electric power connection, for facilitating transmission of said primary electric power and said transformed electric power.

10. A modular integrated apparatus as set forth in claim 2, wherein said alignment frame includes;

a top plate that is the top of said alignment frame;

a pair of alignment brackets that surround said isothermal plate and said power converter; and

an alignment rim that is between said alignment brackets for forming an alignment flange, and locating said alignment flange at a pre-determined location for facilitating insertion and removal of said field replaceable apparatus from and to said computer system.

11. A modular integrated apparatus as set forth in claim 10, wherein said alignment rim includes a handle for facilitating insertion and removal of said field replaceable apparatus from and to said computer system.

12. A modular integrated apparatus as set forth in claim 10, wherein said alignment rim includes at least one tab for aligning said alignment rim with said top plate.

13. A modular integrated apparatus as set forth in claim 10, wherein said alignment frame includes at least one EMI screw that attaches to said pair of alignment brackets for tightening said alignment frame and for attenuating EMI.

14. A modular integrated apparatus as set forth in claim 10, wherein said alignment frame includes at least one anchor screw that enters said top plate, that extends throughout said field replaceable apparatus, and that is secured into said printed circuit board, for attenuating EMI.

15. A modular integrated apparatus as set forth in claim 10, wherein said alignment frame includes at least one anchor screw that enters said top plate, that extends throughout said field replaceable apparatus, and that is secured into said CPU module sleeve, for attenuating EMI.

16. A modular integrated apparatus as set forth in claim 2, further comprising an EMI containment enclosure having;

an EMI sleeve that fits over said power converter and that is attached to said isothermal plate, for attenuating EMI from said power converter;

a first EMI sub-cell having said EMI sleeve, said alignment frame, and said isothermal plate and that encloses said power converter, said input electric power connection, and said output electric power connection;

for attenuating EMI from said power converter, said input electric power connection, and said output electric power connection;

a second EMI sub-cell having said isothermal plate, said CPU module sleeve, and said printed circuit board and that encloses said CPU module, said input electric power connection, and said output electric power connection;

for attenuating EMI from said CPU module, said input electric power connection, and said output electric power connection; and

said first EMI sub-cell and said second EMI sub-cell being connected via a shared slot in said isothermal plate for attenuation of EMI.

17. A modular integrated apparatus as set forth in claim 16, wherein said isothermal plate includes at least one isothermal plate screw that securely attaches said EMI sleeve to said isothermal plate for attenuating EMI.

18. A field replaceable apparatus for a computer system, said computer system having primary electric power and a printed circuit board, said field replaceable apparatus comprising;

a CPU module for connection to said printed circuit board at a pre-determined location;

a power converter for transforming said primary electric power into a form suitable for said CPU module, said power converter having at least one input electric power connection for transmission of said primary electric power, and at least one output electric power connection for transmission of said transformed electric power;

an isothermal plate physically attached to said CPU module and to said power converter for managing heat in said computer system; and

an alignment frame attached to said isothermal plate at a pre-determined location facilitating insertion and removal of said field replaceable apparatus from and to said computer system and for aligning the relative positions of said CPU module, said power converter, and said isothermal plate to said computer system, thereby causing said modular integrated apparatus to be operably connected to said computer system.

19. A modular integrated apparatus for a computer system;

said computer system having primary electric power and a printed circuit board, said modular integrated apparatus comprising;

a field replaceable apparatus having;

a CPU module operably connected to said printed circuit board at a predetermined location;

a power converter for transforming said primary electric power into a form suitable for said CPU module, said power converter having at least one input electric power connection for transmission of said primary electric power and at least one output electric power connection for transmission of said transformed electric power;

a heat management device, having;

an isothermal plate physically attached to said CPU module and to said power converter for managing heat in said computer system;

an isothermal plate slot in said isothermal plate forming a passageway for said input electric power connection and for said output electric power connection, for facilitating transmission of said primary electric power and said transformed electric power;

at least one heat pipe being attached to said isothermal plate for diverting heat away from said isothermal plate; and

at least one heat fin located adjacent to said power converter and said isothermal plate for absorbing heat from said isothermal plate and said heat pipes; and

an alignment frame attached to said isothermal plate at a pre-determined location for aligning the relative positions of said CPU module, said power converter, and said isothermal plate to said computer system, thereby causing said modular integrated apparatus to be operably connected to said computer system, said alignment frame having;

a top plate that is the top of said alignment frame;

a pair of alignment brackets that surround said isothermal plate and said power converter; and

an alignment rim that is between said alignment brackets for forming an alignment flange, and locating said alignment flange at a pre-determined location for facilitating insertion and removal of said field replaceable apparatus from and to said computer system;

a receiving apparatus having;

a CPU module sleeve between said printed circuit board and said CPU module, wherein said CPU module sleeve aligns said CPU module to said printed circuit board for operable connection of said CPU module to said computer system; and

said printed circuit board being attached to said CPU module sleeve; and

said field replaceable apparatus and said receiving apparatus being attached, for forming said modular integrated apparatus.

20. A method for creating a modular integrated apparatus for a computer system having primary electric power and a printed circuit board, said method comprising;

connecting a CPU module to said printed circuit board at a pre-determined location;

including a power converter for transforming said primary electric power into a form suitable for said CPU module, transmitting said primary electric power by at least one input electric power connection, and transmitting said transformed electric power by at least one output electric power connection;

attaching an isothermal plate to said CPU module and to said power converter, for managing heat in said computer system; and

attaching an alignment frame to said isothermal plate at a pre-determined location for aligning the relative positions of said CPU module, said power converter, and said isothermal plate to said computer system, thereby causing said modular integrated apparatus to be operably connected to said computer system.

22. A method as set forth in claim 20, wherein said attaching an alignment frame step includes;

including a top plate of said alignment frame;

surrounding said isothermal plate and said power converter with a pair of alignment brackets; and

including an alignment rim between said alignment brackets for forming an alignment flange, and locating said alignment flange at a pre-determined location for facilitating insertion and removal of said field replaceable apparatus from and to said computer system.

23. A method as set forth in claim 20 further comprising, establishing a heat management device, including the following steps;

including an isothermal plate slot in said isothermal plate forming a passageway for said input electric power connection and for said output electric power connection, for facilitating transmission of said primary electric power and said transformed electric power;

attaching at least one heat pipe to said isothermal plate for diverting heat away from said isothermal plate; and

positioning at least one heat fin adjacent to said power converter and said isothermal plate for absorbing heat from said isothermal plate and said heat pipes.

21. A method for creating a modular integrated apparatus for a computer system having primary electric power and a printed circuit board, said method comprising;

including a field replaceable apparatus having the following steps;

connecting a CPU module to said printed circuit board at a pre-determined location;

including a power converter for transforming said primary electric power into a form suitable for said CPU module, transmitting said primary electric power by at least one input electric power connection, and transmitting said transformed electric power by at least one output electric power connection;

attaching an isothermal plate to said CPU module and to said power converter for managing heat in said computer system; and

attaching an alignment frame to said isothermal plate at a pre-determined location facilitating insertion and removal of said field replaceable apparatus from and to said computer system and for aligning the relative positions of said CPU module, said power converter, and said isothermal plate to said computer system, thereby causing said field replaceable apparatus to be operably connected to said computer system;

including a receiving apparatus having the following steps;

including a CPU module sleeve located between said printed circuit board and said CPU module that aligns said CPU module to said printed circuit board for operable connection of said CPU module to said computer system; and

including said printed circuit board being attached to CPU module sleeve; and

attaching said field replaceable apparatus to said receiving apparatus for forming said modular integrated apparatus.

24. A method as set forth in claim 21 further comprising, establishing an EMI containment enclosure having the following steps;

fitting an EMI sleeve over said power converter and attaching said EMI sleeve to said isothermal plate, for attenuating EMI;

establishing a first EMI sub-cell by including said EMI sleeve, said alignment frame, and said isothermal plate that encloses said power converter, said input electric power connection, and said output electric power connection, for attenuating EMI from said power converter, said input electric power connection, and said output electric power connection;

establishing a second EMI sub-cell by including said isothermal plate, said CPU module sleeve, and said printed circuit board that encloses said CPU module, said input electric power connection, and said output electric power connection, for attenuating EMI from said CPU module, said input electric power connection, and said output electric power connection; and

connecting said first EMI sub-cell and said second EMI sub-cell via a shared slot in said isothermal plate for attenuating EMI.

25. A modular integrated apparatus for a computer system having primary electric power and a printed circuit board, said field replaceable apparatus comprising;

a CPU module operably connected to said printed circuit board at a pre-determined location;

a power converter having at least one input electric connection and at least one output electric power connection;

an isothermal plate attached to said CPU module and said power converter;

an alignment frame attached to said isothermal plate;

means for transmitting said primary electric power to said power converter;

means for transforming and transmitting said primary electric power into a form suitable for said CPU module so that said CPU module suitably executes in said computer system;

means for managing heat in said computer system; and

means for aligning the relative positions of said CPU module, said power converter, and said isothermal plate to said computer system so that said modular integrated apparatus is operably connected to said computer system.

29. A modular integrated apparatus as set forth in claim 25, further comprising;

an EMI sleeve that covers said power converter and that is attached to said isothermal plate;

an isothermal plate slot in said isothermal plate;

a first EMI sub-cell including said EMI sleeve, said alignment frame, and said isothermal plate;

a second EMI sub-cell including said isothermal plate, said CPU module sleeve, and said printed circuit board;

means for enclosing said first EMI sub-cell around said power converter, said input electric power connection, and said output electric power connection so that EMI is shielded;

means for enclosing said CPU module, said input electric power connection, and said output electric power connection so that EMI is shielded; and

means for connecting said first EMI sub-cell and said second EMI sub-cell via said isothermal plate slot so that EMI is attenuated.

26. A modular integrated apparatus for a computer system having primary electric power and a printed circuit board, said field replaceable apparatus comprising;

a field replaceable apparatus having;

a CPU module operably connected to said printed circuit board at a predetermined location;

a power converter having at least one input electric connection and at least one output electric power connection;

an isothermal plate attached to said CPU module and said power converter;

an alignment frame attached to said isothermal plate;

a receiving apparatus having;

a CPU module sleeve between said printed circuit board and said CPU module; and

said printed circuit board attached to said CPU module sleeve;

means for transmitting said primary electric power to said power converter;

means for transforming and transmitting said primary electric power into a form suitable for said CPU module so that said CPU module suitably executes in said computer system;

means for managing heat in said computer system;

means for aligning the relative positions of said CPU module, said power converter, and said isothermal plate to said computer system so that said modular integrated apparatus is operably connected to said computer system;

means for facilitating insertion and removal of said field replaceable apparatus from and to said computer system;

means for aligning said CPU module to said printed circuit board for operable connection of said CPU module to said computer system; and

means for attaching said field replaceable apparatus and said receiving apparatus for forming said modular integrated apparatus.

27. A field replaceable apparatus for a computer system as set forth in claim 26, said alignment frame further having;

a top plate of said alignment frame;

a pair of alignment brackets that surround said isothermal plate and said power converter;

an alignment rim between said pair of alignment brackets for forming an alignment flange; and

means for locating said alignment flange so that insertion and removal of said field replaceable apparatus from and to said computer system is facilitated.

28. An field replaceable apparatus as set forth in claim 26 further comprising;

a heat management device, having;

an isothermal plate slot in said isothermal plate;

at least one heat pipe attached to said isothermal plate;

at least one heat fin located adjacent to said isothermal plate and said power converter;

means for creating said passageway in said isothermal plate slot so that said transformed electric power is connected from said power converter to said CPU module;

means for diverting heat from said isothermal plate; and

means for absorbing heat from said isothermal plate and said heat pipes.