Encapsulated, board-mountable power supply and method of manufacture
First Claim
1. A power supply, comprising:
- a circuit board containing conductors interconnecting electrical components of said power supply;
a thermally-conductive case having an integral electrically insulating layer, said thermally-conductive case forming a reservoir to receive said circuit board therein;
a power semiconductor device having a body connected in thermal communication with said thermally-conductive case and terminals coupled to said conductors of said circuit board;
an encapsulant, located within said reservoir, said encapsulant ensconcing said power semiconductor device and said electrical components; and
electrical leads extending from said power supply that allow said power supply to be coupled to a print wiring board.
5 Assignments
0 Petitions
Accused Products
Abstract
A power supply and a method of manufacture therefor. The power supply includes: (1) a circuit board containing conductors for interconnecting electrical components of the power supply, (2) a thermally-conductive case having an integral electrically insulating layer, the thermally-conductive case forming a reservoir to receive the circuit board therein, (3) a power semiconductor device having a body connected in thermal communication with the thermally-conductive case and terminals coupled to the conductors of the circuit board, (4) an encapsulant, located within the reservoir, the encapsulant ensconcing the power semiconductor device and the electrical components and (5) electrical leads extending from the power supply that allow the power supply to be coupled to a printed wiring board.
61 Citations
21 Claims
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1. A power supply, comprising:
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a circuit board containing conductors interconnecting electrical components of said power supply; a thermally-conductive case having an integral electrically insulating layer, said thermally-conductive case forming a reservoir to receive said circuit board therein; a power semiconductor device having a body connected in thermal communication with said thermally-conductive case and terminals coupled to said conductors of said circuit board; an encapsulant, located within said reservoir, said encapsulant ensconcing said power semiconductor device and said electrical components; and electrical leads extending from said power supply that allow said power supply to be coupled to a print wiring board. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A power supply, comprising:
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a circuit board containing conductors interconnecting electrical components of said power supply, one of said conductors forming a winding of a power magnetic device of said power supply; a metal case having an integral electrically insulating middle layer and an integral electrically conductive inner circuit layer, portions of said inner circuit layer capable of being removed to form electrically conductive traces therein, said metal case forming a five-sided reservoir to receive said circuit board therein; a power semiconductor device having a body connected in thermal communication with said metal case and terminals coupled to said conductors of said circuit board, an encapsulant, located within said reservoir, said encapsulant ensconcing said power semiconductor device and said electrical components; and electrical leads extending from said power supply that allow said power supply to be coupled to a printed wiring board. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of manufacturing a power supply, comprising the steps of:
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providing a circuit board containing conductors interconnecting electrical components of said power supply; mounting ones of said electrical components to said circuit board; placing a body of a power semiconductor device in thermal communication with a thermally-conductive case, said thermally-conductive case having an integral electrically insulating layer; placing said circuit board within a reservoir of said thermally-conductive case; coupling terminals of said power semiconductor device to said conductors of said circuit board; and placing an encapsulant within said reservoir, said encapsulant ensconcing said power semiconductor device and said electrical components, electrical leads extending from said power supply to allow said power supply to be coupled to a printed wiring board. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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Specification