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Semiconductor device and a manufacturing method thereof

  • US 5,926,694 A
  • Filed: 07/11/1997
  • Issued: 07/20/1999
  • Est. Priority Date: 07/11/1996
  • Status: Expired due to Term
First Claim
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1. A manufacturing method of a semiconductor device comprising a bare chip having a plurality of chip pads and a substrate having a plurality of substrate pads, said method comprising:

  • a recess forming step for forming a recess by exerting a pushing force at a location of a substrate pad of said substrate corresponding to one or a plurality of chip pads of said bare chip;

    an adhesive coating step for applying adhesive to a location of said substrate at which said bare chip is disposed;

    a bare chip mounting step for placing said bare chip on said substrate by positioning bumps formed on said chip pads of said bare chip on said substrate pad of said substrate; and

    an adhesive hardening step for hardening said applied adhesive.

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