Semiconductor device and a manufacturing method thereof
First Claim
1. A manufacturing method of a semiconductor device comprising a bare chip having a plurality of chip pads and a substrate having a plurality of substrate pads, said method comprising:
- a recess forming step for forming a recess by exerting a pushing force at a location of a substrate pad of said substrate corresponding to one or a plurality of chip pads of said bare chip;
an adhesive coating step for applying adhesive to a location of said substrate at which said bare chip is disposed;
a bare chip mounting step for placing said bare chip on said substrate by positioning bumps formed on said chip pads of said bare chip on said substrate pad of said substrate; and
an adhesive hardening step for hardening said applied adhesive.
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Accused Products
Abstract
A manufacturing method of a semiconductor device for mounting an LSI bare-chip component, or a bare chip, on a printed circuit board, or a substrate, with flip-chip bonding technology, that includes a recess forming step of forming recesses on substrate pads of the substrate, an adhesive coating step of applying adhesive to a location on the substrate at which the bare chip is to be placed, a chip mounting step of placing the bare chip on the substrate while aligning positions of the bumps formed on the chip pads of the bare chip and the substrate pads of the substrate, and an adhesive hardening step of hardening the applied adhesive.
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Citations
24 Claims
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1. A manufacturing method of a semiconductor device comprising a bare chip having a plurality of chip pads and a substrate having a plurality of substrate pads, said method comprising:
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a recess forming step for forming a recess by exerting a pushing force at a location of a substrate pad of said substrate corresponding to one or a plurality of chip pads of said bare chip; an adhesive coating step for applying adhesive to a location of said substrate at which said bare chip is disposed; a bare chip mounting step for placing said bare chip on said substrate by positioning bumps formed on said chip pads of said bare chip on said substrate pad of said substrate; and an adhesive hardening step for hardening said applied adhesive. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification