Method and apparatus for molding thermosetting polymers onto substrates

• US 5,928,593 A
• Filed: 08/25/1997
• Issued: 07/27/1999
• Est. Priority Date: 11/30/1995
• Status: Expired due to Fees

• Current Assignee: Kiazen Design Lab, Inc.
• Original Assignee: Ubertech Products Incorporated (PVH Corp.)
• Inventors: Harrison, Donald G.
• Primary Examiner(s): DAVIS, ROBERT B
• Application Number:
  US08/920,214
• Time in Patent Office: 701 Days
• Field of Search: 425/120, 425/121, 425/125, 425/127, 425/130, 425/543, 425/548, 425/549, 425/557, 425/571, 425/572, 425/149, 425/150, 425/552, 264/251, 264/260, 264/328.18, 264/259, 264/328.1, 264/328.2, 264/328.4, 264/328.15, 264/328.5, 264/328.16, 264/328.6, 264/328.81 , 264/328.17, 264/328.19
• US Class Current: 264/251
• CPC Class Codes: A41D 27/08 Trimmings; Ornaments
• CPC Class Codes: B29C 45/14 incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles B29C45/1671 takes precedence
• CPC Class Codes: B29C 45/164 The moulding materials being injected simultaneously
• CPC Class Codes: B29K 2083/005 LSR, i.e. liquid silicone rubbers, or derivatives thereof
• CPC Class Codes: B29K 2713/00 Use of textile products or fabrics for preformed parts, e.g. for inserts B29K2105/06 takes precedence

Abstract

An apparatus and method for molding thermosetting polymers onto clothing. The apparatus includes at least one molding device, at least one polymer supply and a control system for controlling the operation of the molding devices and polymer supplies. The molding devices include die sets having an input member and a mold. The polymer supplies supply polymers for injection into the input members of the molding devices for use in molding three dimensional bodies of polymers onto substrates such as clothing.

Claims

1. A molding device for molding thermosetting polymer bodies onto substrates, comprising:

a die set adapted to mold at least one of said bodies onto at least one of said substrates;

a platen adapted to support and position said at least one substrate relative to said die set;

an actuator adapted to move said die set into and out of engagement with said at least one substrate wherein said actuator controllably actuates said die set into engagement with said at least one substrate as a function of a contact pressure between said die set and said substrate; and

a control system operably coupled to said die set, said platen and said actuator and adapted to control the operation of said molding device.

2. The molding device of claim 1, wherein said die set is adapted to receive a plurality of supplies of said polymer.

3. The molding device of claim 1, wherein said die set includes a heating element adapted to controllably maintain a portion of said die set within a predetermined range of temperatures.

4. The molding device of claim 1, wherein said die set includes a cooling element adapted to maintain a portion of said die set within a predetermined range of temperatures.

5. The molding device of claim 1, wherein said die set includes:

a heating element adapted to controllably maintain a portion of said die set within a predetermined range of temperatures; and

a cooling element adapted to controllably maintain another portion of said die set within another predetermined range of temperatures.

6. The molding device of claim 1, wherein said platen includes a heating element adapted to controllably maintain a portion of said platen within a predetermined range of temperatures.

7. The molding device of claim 6, wherein said heating element of said platen is in opposing relation to said die set during engagement of said die set with said one of said at least one substrate.

26. The molding device of claim 1, wherein said at least one supply of polymer comprises a supply of a first polymer and a supply of a second polymer.

27. The molding device of claim 1, wherein said apparatus is adapted to mold a plurality of three dimensional bodies of thermosetting polymer onto a plurality of substrates substantially simultaneously.

28. The molding device of claim 1, wherein said apparatus is adapted to mold a plurality of three dimensional bodies of thermosetting polymer onto a substrate using a plurality of different types of thermosetting polymers.

8. A molding device for molding thermosetting polymer bodies onto substrates, comprising:

a die set adapted to mold at least one of said bodies onto at least one of said substrates;

a platen adapted to support and position said at least one substrate relative to said die set wherein said platen includes a cooling element adapted to controllably maintain a portion of said platen within a predetermined range of temperatures;

an actuator adapted to move said die set into and out of engagement with said at least one substrate; and

a control system operably coupled to said die set, said platen and said actuator and adapted to control the operation of said molding device.

9. A molding device for molding thermosetting polymer bodies onto substrates, comprising:

a die set adapted to mold at least one of said bodies onto at least one of said substrates;

a platen adapted to support and position said at least one substrate relative to said die set wherein said platen includes;

a heating element adapted to controllably maintain a portion of said platen within a predetermined range of temperatures; and

a cooling element adapted to controllably maintain another portion of said platen within another predetermined range of temperatures; and

an actuator adapted to move said die set into and out of engagement with said at least one substrate; and

a control system operably coupled to said die set, said platen and said actuator and adapted to control the operation of said molding device.

10. A molding device for molding thermosetting polymer bodies onto substrates, comprising:

a die set adapted to mold at least one of said bodies onto at least one of said substrates;

a platen adapted to support and position said at least one substrate relative to said die set wherein said platen further includes a guiding member adapted to guide said platen into and out of a position in opposing relation to said die set;

an actuator adapted to move said die set into and out of engagement with said at least one substrate; and

a control system operably coupled to said die set, said platen and said actuator and adapted to control the operation of said molding device.

11. A molding device for molding thermosetting polymer bodies onto substrates, comprising:

a die set adapted to mold at least one of said bodies onto at least one of said substrates wherein said die set includes;

an input member adapted to receive and distribute said at least one supply of said polymer;

a mold including at least one cavity coupled to said input member and adapted to receive said distribution of said at least one supply of said polymer and mold said at least one supply of said polymer onto said at least one substrate to form at least one three dimensional body of said polymer; and

at least one resilient member coupled between said input member and said mold; and

a platen adapted to support and position said at least one substrate relative to said die set;

an actuator adapted to move said die set into and out of engagement with said at least one substrate; and

a control system operably coupled to said die set, said platen and said actuator and adapted to control the operation of said molding device.

12. The molding device of claim 11, wherein said input member is adapted to receive and distribute a plurality of supplies of said polymer, and wherein said mold includes a plurality of cavities and is adapted to receive said distribution of said plurality of supplies of said polymer and mold said plurality of supplies of said polymer onto said at least one substrate to form a plurality of three dimensional bodies of said polymer.

13. The molding device of claim 11, wherein said die set further includes at least one thermal isolation element coupled between said input member and said mold.

14. The molding device of claim 11, wherein said die set further includes a thermal insulating plate coupled between said input member and said mold.

15. The molding device of claim 11, wherein said input member includes a cooling element adapted to maintain a temperature of said input member within a predetermined range of temperatures.

16. The molding device of claim 11, wherein said input member includes at least one flow control valve adapted to controllably couple said input member to one of said at least one supplies of said polymer.

17. The molding device of claim 16, wherein said flow control valve is a rotary valve.

18. The molding device of claim 11, wherein said input member includes at least one selection valve adapted to controllably couple said input member to either one of said at least one supplies of said polymer or a pressure sink.

19. The molding device of claim 11, wherein said input member includes at least one selection valve adapted to controllably couple said input member to a vacuum source.

20. The molding device of claim 11, wherein said input member includes at least one nozzle adapted to cooperatively interact with and distribute said at least one supply of said polymer to said mold.

21. The molding device of claim 20, wherein said at least one nozzle includes a thermal insulating member.

22. The molding device of claim 11, wherein said die set further includes a thermal insulating plate coupled between said input member and said mold.

23. The molding device of claim 11, wherein said mold includes a heating member adapted to controllably maintain a temperature of said mold within a predetermined range of temperatures.

24. The molding device of claim 11, wherein said at least one mold cavity is at least partially defined by a portion extending outward from said mold.

25. The molding device of claim 11, wherein said input member comprises:

a manifold adapted to receive said at least one supply of said polymer; and

a runner plate coupled to said manifold and adapted to distribute said at least one supply of said polymer.

29. A platen for use in a molding device for molding at least one three dimensional body of a thermosetting polymer onto a substrate, said platen adapted to support said substrate during molding of said at least one three dimensional body onto said substrate, said platen comprising:

a platen body including;

a supporting member adapted to support said substrate;

a positioning member coupled to said supporting member and adapted to position said substrate;

a heating element coupled to said supporting member and adapted to heat a region of said substrate; and

a cooling element coupled to said supporting member and adapted to cool another region of said substrate.

30. The platen of claim 29, further comprising a temperature sensor operably coupled to said heating element adapted to generate a signal representative of an operating temperature of said heating element.

31. The platen of claim 29, wherein said heating element comprises an electric heating element and wherein said cooling element comprises a fluidic cooling element.

32. The platen of claim 29, wherein said cooling element substantially surrounds said heating element.

33. The platen of claim 32, wherein said platen further includes an insulating member coupled between said heating element and said cooling element.

34. The platen of claim 29, wherein said platen further comprises:

a guiding member adapted to permit said platen to be moved into and out of a reference position for molding.

35. A method for molding thermosetting polymer bodies onto substrates, comprising:

adapting a die set to mold at least one of said bodies onto at least one of said substrates;

adapting a platen to support and position said at least one substrate relative to said die set;

adapting an actuator to move said die set into and out of engagement with said at least one substrate wherein said actuator controllably actuates said die set into engagement with said at least one substrate as a function of a contact pressure between said die set and said substrate;

coupling a control system operably to the die set, said platen and said actuator wherein said control system is adapted to control the operation of said die set, said platen and said actuator;

positioning said at least one substrate on said platen;

injecting said polymer into a mold of said die set to form at least one of said polymer bodies; and

curing said polymer on said substrate.

36. The method of claim 35, further comprising:

adapting said die set to receive a plurality of supplies of said polymer.

37. The method of claim 35, further comprising:

adapting a heating element to controllably maintain a portion of said die set within a predetermined range of temperatures.

38. The method of claim 35, further comprising:

adapting a cooling element to controllably maintain a portion of said die set within a predetermined range of temperatures.

39. The method of claim 35, further comprising:

adapting a heating element to controllably maintain a portion of said platen within a predetermined range of temperatures.

40. A method for molding thermosetting polymer bodies onto substrates, comprising:

adapting a die set to mold at least one of said bodies onto at least one of said substrates;

adapting a platen to support and position said at least one substrate relative to said die set, including;

adapting a cooling element to controllably maintain a portion of said platen within a predetermined range of temperatures;

adapting an actuator to move said die set into and out of engagement with said at least one substrate;

coupling a control system operably to the die set, said platen and said actuator wherein said control system is adapted to control the operation of said die set, said platen and said actuator;

positioning said at least one substrate on said platen;

injecting said polymer into a mold of said die set to form at least one of said polymer bodies; and

curing said polymer on said substrate.

41. A method for molding thermosetting polymer bodies onto substrates, comprising:

adapting a die set to mold at least one of said bodies onto at least one of said substrates;

adapting a platen to support and position said at least one substrate relative to said die set, including;

adapting a heating element to controllably maintain a portion of said platen within a predetermined range of temperatures; and

adapting a cooling element to controllably maintain another portion of said platen within a predetermined range of temperatures;

adapting an actuator to move said die set into and out of engagement with said at least one substrate;

coupling a control system operably to the die set, said platen and said actuator wherein said control system is adapted to control the operation of said die set, said platen and said actuator;

positioning said at least one substrate on said platen;

injecting said polymer into a mold of said die set to form at least one of said polymer bodies; and

curing said polymer on said substrate.

42. A method for molding thermosetting polymer bodies onto substrates, comprising:

adapting a die set to mold at least one of said bodies onto at least one of said substrates;

adapting a platen to support and position said at least one substrate relative to said die set;

adapting a guiding member to guide said platen into and out of a position in opposing relation to said die set;

adapting an actuator to move said die set into and out of engagement with said at least one substrate;

coupling a control system operably to said die set, said platen and said actuator wherein said control system is adapted to control the operation of said die set, said platen and said actuator;

positioning said at least one substrate on said platen;

injecting said polymer into a mold of said die set to form at least one of said polymer bodies; and

curing said polymer on said substrate.