Low mass optical coating for thin film detectors

• US 5,929,441 A
• Filed: 06/27/1997
• Issued: 07/27/1999
• Est. Priority Date: 06/27/1997
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Cho, Chih-Chen, Beratan, Howard R.
• Primary Examiner(s): Hannaher, Constantine
• Application Number:
  US08/883,736
• Time in Patent Office: 760 Days
• Field of Search: 250/338.4, 250/338.3, 250/332
• US Class Current: 250/338.3
• CPC Class Codes: G01J 5/023 Particular leg structure or construction or shape; Nanotubes
• CPC Class Codes: G01J 5/0235 Spacers, e.g. for avoidance of stiction
• CPC Class Codes: G01J 5/024 Special manufacturing steps or sacrificial layers or layer structures
• CPC Class Codes: G01J 5/046 Materials; Selection of thermal materials
• CPC Class Codes: G01J 5/08 Optical arrangements
• CPC Class Codes: G01J 5/0853 having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid
• CPC Class Codes: G01J 5/10 using electric radiation detectors

Abstract

A thermal detector having an optical coating comprising a porous film 64. The porous film preferably comprises a xerogel or aerogel and is greater than 80% porous. An optional optical impedance matching layer 66 may be deposited over the porous film 64. Advantages include decreased thickness of the thermal sensor, improved acuity of the image produced by the system, lower manufacturing temperatures, and the ability to use electrodes that are opaque to infrared energy.

Claims

1. A thermal detector comprising:

a substrate;

a support means;

a first electrode above said substrate and said support means;

a thermally sensitive element over said first electrode;

a second electrode over said thermally sensitive element; and

an optical coating comprising a porous film over said second electrode;

wherein said support means provides thermal isolation and electrical connectivity between at least said first electrode, said second electrode and said substrate, wherein said thermally sensitive element comprises a self-supporting means.

2. The thermal detector of claim 1 wherein said support means comprises:

at least two posts disposed on said substrate adjacent said first and second electrodes, wherein said support posts are attached to said first and second electrodes.

3. The detector of claim 1, wherein said porous film is a material selected from the group consisting of xerogels and aerogels.

4. The detector of claim 3, wherein said porous film comprises silicon.

5. The detector of claim 1, wherein said porous film has a porosity greater than 80%.

6. The detector of claim 5, wherein said porous film has a porosity greater than 99.9%.

7. The detector of claim 1 wherein said first and second electrodes are opaque to infrared wavelengths.

8. The detector of claim 1, wherein said thermally sensitive element is greater than zero and less than 1.0 micrometers thick.

9. The thermal detector of claim 1 wherein said first and second electrodes each comprise:

a sensing electrode;

a support arm comprising first and second ends, wherein said first end of said support arm is attached to said sensing electrode; and

a contact pad attached to said second end of said support arm;

wherein said support means is adjacent said contact pad of each of said first and second electrodes.

10. A thermal detector comprising:

a substrate;

a support means;

a first electrode above said substrate and said support means;

a thermally sensitive element over said first electrode;

a second electrode over said thermally sensitive element;

an optical coating comprising a porous film over said second electrode; and

an optical impedance matching layer over said porous film,

wherein said support means provides thermal isolation and electrical connectivity between at least said first electrode, said second electrode and said substrate.

11. A method for fabricating a thermal detector, comprising the steps of:

providing a substrate;

depositing a spacer-insulator material on said substrate;

providing a support means;

depositing a first conductor layer over said spacer-insulator layer and said support means;

patterning said first conductor layer to form a bottom array of electrodes;

depositing a thermally sensitive layer over said electrodes;

patterning said thermally sensitive layer to form thermally sensitive elements;

depositing a second conductor layer over said thermally sensitive elements;

patterning said second conductor layer to form a top array of electrodes;

depositing a precursor film on said second conductive layer;

gelling said precursor film to form a porous film; and

depositing an optical impedance matching layer over said porous film.

12. The method of claim 11, wherein said step of gelling said precursor film results in a porous film having a porosity greater than 80%.

13. The method of claim 12, wherein said step of gelling said precursor film results in a porous film having a porosity greater than 99.9%.

14. The method of claim 11, further comprising the step of removing said spacer-insulator material after said gelling step.

15. A method for fabricating a thermal detector, comprising the steps of:

providing a substrate;

depositing a spacer-insulator material on said substrate;

providing a support means;

depositing a first conductor layer over said spacer-insulator layer and said support means;

patterning said first conductor layer to form a bottom array of electrodes;

depositing a first temporary filler material over said bottom array of electrodes;

depositing a thermally sensitive layer over said electrodes;

patterning said thermally sensitive layer to form thermally sensitive elements;

depositing a second conductor layer over said thermally sensitive elements;

patterning said second conductor layer to form a top array of electrodes;

depositing a second temporary filler material over said top array of electrodes;

depositing a precursor film on said second conductive layer; and

gelling said precursor film to form a porous film.