Semiconductor floating gate sensor device

• US 5,929,472 A
• Filed: 04/07/1997
• Issued: 07/27/1999
• Est. Priority Date: 04/07/1997
• Status: Expired due to Fees

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Kniffin, Margaret L.
• Primary Examiner(s): Guay, John
• Application Number:
  US08/834,965
• Time in Patent Office: 841 Days
• Field of Search: 257/415, 257/417, 257/316, 257/254, 73/514.32, 73/724, 73/754, 438/52
• US Class Current: 257/254
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: H01L 29/84 controllable by variation of applied mechanical force, e.g. of pressure

Abstract

A sensor device (40) is formed in a semiconductor substrate (41). The sensor device (40) includes a microstructure (60) that is free to move in response to a force. The microstructure (60) is overlying a floating gate structure (51) and a channel region (44). A guard ring (52) is formed around the floating gate structure (51) to retard the migration of charge onto the floating gate structure (51). This in turn stabilizes the operational performance of the sensor device (40) over time.

Claims

1. A semiconductor device comprising:

a semiconductor substrate;

a first doped region in the semiconductor substrate;

a second doped region in the semiconductor substrate, wherein the second doped region is separated from the first doped region to provide a first channel region having a length;

a gate structure overlying at least the first channel region;

a guard ring overlying the semiconductor substrate and encompassing the gate structure; and

a moveable conductive plate overlying at least a portion of the gate structure, wherein the moveable conductive plate is free to move in a direction with respect to the gate structure.

2. The semiconductor device of claim 1 further comprising a third doped region in the semiconductor substrate, wherein a portion of the gate structure and a portion of the guard ring are overlying the third doped region.

3. The semiconductor device of claim 1 further comprising a third doped region and a fourth doped region that in the semiconductor substrate, wherein the third doped region is separated from the fourth doped region to provide a second channel region and a portion of the guard ring is overlying the second channel region.

4. The semiconductor device of claim 3 wherein the second channel region has a length that is essentially equal to the length of the first channel region.

5. The semiconductor device of claim 3 further comprising a fifth doped region in the semiconductor substrate, wherein a portion of the gate structure and a portion of the guard ring are overlying the fifth doped region.

6. The semiconductor device of claim 3 wherein the gate structure is electrically floating and there is a first current flow between the first doped region and the second doped region and when a first voltage potential is placed on the guard ring, a second current flow passes from the third doped region to the fourth doped region that is essentially equal to the first current flow.

7. The semiconductor device of claim 6 wherein the first current flow increases when a second voltage potential is placed on the moveable conductive plate and the moveable conductive plate moves as a result of an acceleration force.

8. The semiconductor device of claim 7 wherein the gate structure comprises a layer of conductive material overlying a layer of dielectric material, and the layer of dielectric material comprises silicon nitride.

9. The semiconductor device of claim 8 wherein the layer of conductive material comprises polysilicon and is electrically isolated from the semiconductor substrate.

10. A sensor device comprising:

a semiconductor substrate;

a first doped region in the semiconductor substrate;

a second doped region in the semiconductor substrate, wherein the second doped region is separated from the first doped region to provide a first channel region having a length;

a first conductive plate overlying at least the first channel region;

a second conductive plate overlying the first channel region and the first conductive plate, wherein the second conductive plate is moveable; and

a guard ring overlying the semiconductor substrate and encircling the first conductive plate.

11. The sensor device of claim 10 further comprising a third doped region and a fourth doped region in the semiconductor substrate, wherein the third doped region is separated from the fourth doped region to provide a second channel region and a portion of the guard ring is overlying the second channel region.

12. The sensor device of claim 11 wherein the second channel region has a length that is essentially equal to the length of the first channel region.

13. The sensor device of claim 11 further comprising a fifth doped region in the semiconductor substrate, wherein a portion of the first conductive plate and a portion of the guard ring are overlying the fifth doped region.

14. The sensor device of claim 11 wherein there is a first current flow between the first doped region and the second doped region and when a voltage potential is placed on the guard ring, a second current flow passes from the third doped region to the fourth doped region that is essentially equal to the first current flow.

15. The sensor device of claim 10 wherein the sensor device is an accelerometer.