Reduced area imaging devices incorporated within surgical instruments

• US 5,929,901 A
• Filed: 10/06/1997
• Issued: 07/27/1999
• Est. Priority Date: 10/06/1997
• Status: Expired due to Term

• Current Assignee: Micro Imaging Medical Solutions, LLC (d/b/a Micro-Imaging Solutions LLC)
• Original Assignee: Edwin L. Adair, Jeffrey L. Adair, Randall S. Adair
• Inventors: Adair, Edwin L., Adair, Randall S., Adair, Jeffrey L.
• Primary Examiner(s): RAO, ANAND SHASHIKANT
• Application Number:
  US08/944,322
• Time in Patent Office: 659 Days
• Field of Search: 348/65, 348/66, 348/68, 348/70, 348/72, 348/76, 600/109, 600/110, 600/112, 600/173, 600/118, 358/98
• US Class Current: 348/76
• CPC Class Codes: A61B 1/00135 Oversleeves mounted on the endoscope prior to insertion
• CPC Class Codes: A61B 1/0051 with controlled bending of insertion part
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: A61B 1/0607 for annular illumination
• CPC Class Codes: A61B 1/07 using light-conductive means, e.g. optical fibres
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Abstract

A reduced area imaging device is provided for use in medical or dental instruments such as an endoscope. In one configuration of the imaging device, the image sensor is placed remote from the remaining circuitry. In another configuration, all of the circuitry to include the image sensor is placed in a stacked fashion at the same location. In a first embodiment of the invention, the entire imaging device can be placed at the distal tip of an endoscope. In a second embodiment, the image sensor is remote from the remaining circuitry according to the first configuration, and wherein a control box can be provided which communicates with the image sensor and is placed remotely from the endoscope. In yet another embodiment, the imaging device can be incorporated in the housing of a standard medical camera which is adapted for use with traditional rod lens endoscopes. In any of the embodiments, the image sensor may be placed alone on a first circuit board, or timing and control circuits may be included on the first circuit board containing the image sensor. One or more video processing boards can be stacked in a longitudinal fashion with respect to the first board, or the video processing boards may be placed in the control box.

Claims

1. A reduced area imaging device comprising:

a first circuit board defining a profile area and lying in a first plane, said first circuit board including an array of CMOS pixels on said first plane for receiving images thereon and wherein individual CMOS pixels within said array of CMOS pixels each include an amplifier, said first circuit board further including circuitry means on said first plane and coupled to said array of CMOS pixels for timing and control of said array of CMOS pixels, said first circuit board producing an analog pre-video signal;

a pre-video conductor for transmitting said pre-video signal, said conductor having first and second ends, said first end connected to said first circuit board;

a second circuit board lying in a second plane and longitudinally aligned with said first circuit board, said second circuit board being connected to said conductor at said second end thereof, said second circuit board including circuitry means for converting said pre-video signal to a post-video signal for reception by a standard video device; and

a power supply electrically coupled with said first circuit board for driving said array of CMOS pixels, and said timing and control means, and electrically coupled to said second circuit board for driving said second circuit board.

2. A reduced area imaging device, as claimed in claim 1, further including:

a supplementary circuit board electrically coupled with said first and second circuit boards for enhancing said pre-video signal prior to reception by said second circuit board, said supplementary circuit board being longitudinally aligned with said first and second circuit boards and being positioned so as not to substantially extend beyond said profile area.

10. A device, as claimed in claim 1, wherein:

said first plane is offset from and substantially parallel to said second plane.

11. A device, as claimed in claim 1, wherein:

said second circuit board is positioned so as not to extend substantially beyond said profile area of said first circuit board.

12. A device, as claimed in claim 1, wherein:

said means for converting said pre-video signal to a post-video signal is located on said second plane of said second circuit board.

3. A reduced imaging device comprising:

an array of CMOS pixels defining a profile area and lying in a first plane, said array of CMOS pixels for receiving images thereon;

a circuit board longitudinally aligned with and electrically coupled to said array of CMOS pixels, said circuit board lying in a second plane which is offset from said first plane and substantially parallel to said first plane, said circuit board including circuitry means for timing and control of said array of CMOS pixels, said timing and control means producing an analog pre-video signal, said circuit board further including circuitry means for receiving said analog pre-video signal from said timing and control means and converting said pre-video signal to a post-video output signal for reception by a video device; and

a power supply electrically coupled to said array of CMOS pixels, and said circuit board.

4. A device, as claimed in claim 3, further including:

a supplementary circuit board communicating with said array of CMOS pixels and said circuit board for enhancing said analog pre-video signal, said supplementary circuit board being longitudinally aligned with said array of CMOS pixels and said circuit board and being positioned so as not extend substantially beyond said profile area.

5. An endoscope with integral imaging capability comprising:

a tubular portion including a distal end, a proximal end and a central passageway extending therethrough;

a handle connected to said proximal end of said tubular portion for grasping by a surgeon;

at least one light fiber positioned around a periphery of said distal end for illuminating a surgical site;

a CMOS image sensor lying in a first plane and positioned at said distal end of said tubular portion for receiving images of the surgical site, said CMOS image sensor defining a profile area, and said CMOS image sensor producing an image signal;

circuitry means electrically coupled to said CMOS image sensor for timing and control of said CMOS image sensor, said circuitry means for timing and control placed within said tubular portion;

a video processor board spaced from and longitudinally aligned with said CMOS image sensor within said tubular portion and adjacent said distal end thereof, said video processor board lying in a second plane, said video processor board including circuitry means for processing said image signal and converting said image signal to a post-video signal, said video processor board being positioned so as not to extend substantially beyond said profile area;

a conductor connected between said CMOS image sensor and said video processor board for transmitting said image signal to said video processor board; and

a power supply electrically coupled to said CMOS image sensor and said video processor board.

6. An endoscope, as claimed in claim 5, wherein:

said conductor includes a single conducting element.

7. An endoscope, as claimed in claim 5, wherein:

said timing and control means is placed adjacent said image sensor and on said first plane with said image sensor; and

wherein said image signal is a pre-video signal.

8. An endoscope, as claimed in claim 5, wherein:

said timing and control means is placed on said second plane with said video processor board.

9. An endoscope, as claimed in claim 5, wherein:

said power supply is a battery attached to said handle.

13. An endoscope, as claimed in claim 5, further including:

a lens positioned at said distal end of said tubular portion and distally of said CMOS image sensor for producing a modified image on said CMOS image sensor.

14. An endoscope, as claimed in claim 5, wherein:

said CMOS image sensor lies in a first plane, and said video processor board lies in a second plane offset from and substantially parallel to said first plane.

15. An endoscope, as claimed in claim 5, wherein:

said video processor board is positioned in longitudinal alignment with said CMOS image sensor so that said video processor board does not extend substantially beyond said profile area.