High resolution, low voltage flat-panel radiation imaging sensors

• US 5,930,591 A
• Filed: 04/23/1997
• Issued: 07/27/1999
• Est. Priority Date: 04/23/1997
• Status: Expired due to Term

• Current Assignee: Hanger Solutions, LLC (IP Investments Group LLC)
• Original Assignee: L3 Technologies ESS, Inc. (L3Harris Technologies, Inc.)
• Inventors: Huang, Zhong Shou
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): Lebentritt, Michael S.
• Application Number:
  US08/841,492
• Time in Patent Office: 825 Days
• Field of Search: 438/166, 438/160, 438/36, 438/589, 250/208.1, 257/443, 257/445, 257/428, 257/440
• US Class Current: 438/36
• CPC Class Codes: H01L 27/14658 X-ray, gamma-ray or corpuscular radiation imagers measuring X-, gamma- or corpuscular radiation G01T1/00
• CPC Class Codes: H01L 27/14676 X-ray, gamma-ray or corpuscular radiation imagers measuring X-, gamma- or corpuscular radiation G01T1/00

Abstract

In a method of fabricating a high resolution low voltage flat panel radiation imaging sensor having a radiation transducer having a radiation conversion layer of amorphous semiconductor and an electrode on one side thereof and an array of pixels arranged in rows and columns on an opposite side thereof, each pixel including a pixel electrode and storage capacitor and a charge readout device connected to the pixel electrode and the storage capacitor, the improvement comprising the step of shining light on selected regions of the radiation conversion layer which are aligned with the pixel electrodes to thereby crystallize the regions, resulting in a plurality of low resistivity and high charge mobility crystallized regions where the semiconductor material has been exposed to the light surrounded by high resistivity and low charge mobility regions where the semiconductor material has not been exposed to the light, for preventing lateral charge diffusion between respective ones of the low resistivity and high charge mobility regions.

Claims

1. In a method of fabricating a high resolution low voltage flat panel radiation imaging sensor having a radiation transducer having a radiation conversion layer of amorphous semiconductor and an electrode on one side thereof and an array of pixels arranged in rows and columns on an opposite side thereof, each pixel including a pixel electrode and storage capacitor and a charge readout device connected to said pixel electrode and said storage capacitor, the improvement comprising the step of irradiating selected regions of said radiation conversion layer which are aligned with said pixel electrodes to thereby crystallize said regions, resulting in a plurality of low resistivity and high charge mobility crystallized regions where said semiconductor material has been exposed to said irradiation surrounded by high resistivity and low charge mobility regions where said semiconductor material has not been exposed to said irradiation, for preventing lateral charge diffusion between respective ones of said low resistivity and high charge mobility regions.

2. The improvement of claim 1, wherein said pixel electrode and said storage capacitor are transparent to said irradiation, said charge read-out device is opaque to said irradiation, and said irradiation is performed on said radiation conversion layer from said opposite side such that said high resistivity and low charge mobility regions are masked from said irradiation.

3. The improvement of claim 1, wherein said electrode is transparent, a high reflectivity mask is applied to said electrode on said one side, and said irradiation is performed on said radiation conversion layer from said one side such that said high resistivity and low charge mobility regions are masked from said irradiation by said a high reflectivity mask.

4. The improvement of claim 1, wherein a high reflectivity mask is applied to said electrode on said one side prior to depositing said electrode, and said irradiation is performed on said radiation conversion layer from said one side such that said high resistivity and low charge mobility regions are masked from said irradiation by said a high reflectivity mask.

5. The improvement of claim 1, wherein said amorphous semiconductor material is fabricated from one of either amorphous selenium, amorphous silicon, polycrystal or amorphous cadmium selenite, polycrystal or amorphous zinc sulphite and zinc selenite, polycrystal or amorphous cadmium zinc telluride.

6. The improvement of claim 2, wherein said charge read-out device is one of either a thin film transistor or thin film diode having metal portions which are opaque to said irradiation.

7. The improvement of claim 1, wherein said irradiation is characterized by a wavelength longer than the intrinsic absorbed edge of the absorption spectra of said crystallized regions as determined by the energy band gaps of said crystallized regions.