Mechanical fastener to hold a polishing pad on a platen in a chemical mechanical polishing system

• US 5,931,724 A
• Filed: 07/11/1997
• Issued: 08/03/1999
• Est. Priority Date: 07/11/1997
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Gantvarg, Eugene, Perlov, Ilya
• Primary Examiner(s): Rose, Robert A.
• Assistant Examiner(s): NGUYEN, GEORGE BINH MINH
• Application Number:
  US08/891,549
• Time in Patent Office: 753 Days
• Field of Search: 451/41, 451/288, 451/921, 451/60, 451/285, 451/522, 451/512, 403/83-95, 403/321, 403/338, 403/373, 285/320
• US Class Current: 451/285
• CPC Class Codes: B24B 37/12 Lapping plates for working plane surfaces
• CPC Class Codes: B24B 45/006 Quick mount and release means for disc-like wheels, e.g. on power tools
• CPC Class Codes: Y10S 451/921 Pad for lens shaping tool
• CPC Class Codes: Y10T 403/59 Manually releaseable latch type

Abstract

A chemical mechanical polishing apparatus includes a rotatable platen for receiving a polishing pad. The polishing pad is attached to a polishing pad support plate. The polishing pad support plate is removably secured to the platen by a fastening assembly.

Claims

1. A chemical mechanical polishing apparatus, comprising:

a pad support plate having a projection extending from a bottom surface thereof;

a polishing pad attachable to a top surface of the pad support plate;

a rotatable platen configured to support the pad support pad plate, the platen including an aperture to receive the projection; and

a fastener coined to the rotatable platen, the fastener configured to engage the projection and secure the pad support plate to the platen.

2. The apparatus of claim 1, further comprising a slurry supply, a passage through the platen, and a pump to pump slurry from the slurry supply through the passage to a top surface of the platen.

3. The apparatus of claim 1 wherein the platen includes a cavity, and the fastener is at least partially disposed in the cavity.

4. The apparatus of claim 3, wherein the aperture provides a passage between a top surface of the platen and the cavity, and the projection extends into the cavity.

5. The apparatus of claim 4, wherein the fastener includes an arm pivotally movable between a first position in which the arm engages the projection and a second position in which the arm does not engage the projection.

6. The apparatus of claim 5 wherein the arm includes two finger portions forming a gap therebetween, and wherein in the first position a shank of the projection is located in the gap between the two finger portions.

7. The apparatus of claim 6 wherein the projection includes a head having a diameter greater than the distance across said gap such that in the first position, a top surface of the head contacts a bottom surface of the arm.

8. A chemical mechanical polishing apparatus, comprising:

a rotatable platen having a recess in a surface thereof; and

an arm positionable at least partially in the recess and pivotally movable between a first position in which the arm engages a projection of a pad support plate and a second position in which the arm does not engage the projection.

9. The apparatus of claim 8 wherein the arm includes two finger portions forming a gap therebetween, and wherein in the first position the projection is located in the gap between the two finger portions.

10. The apparatus of claim 8 wherein the recess is located on an outer cylindrical surface of the platen.

11. The apparatus of claim 10, wherein the platen includes a passage between a top surface of the platen and the recess.

12. An article for use with a chemical mechanical polishing apparatus, comprising:

a substantially rigid disk-shaped member;

a plurality of pins projecting from a bottom surface of the disk-shaped member, the pins positioned and configured to fit into apertures in a top surface of a platen; and

a polishing pad attachable to a top surface of the disk-shaped member.

13. A chemical mechanical polishing apparatus, comprising:

a pad support plate having a plurality of pins extending from a bottom surface thereof;

a polishing pad attached to a top surface of the pad support plate;

a rotatable platen having a top surface to support the pad support pad plate, the platen having a plurality of cavities and a plurality of apertures connecting the top surface to the cavities and configured to receive the pins; and

a plurality of fasteners connected to the platen, each fastener disposed at least partially in one of the cavities and movable between a first position in which the fastener engages one of the pins to secure the pad support plate to the platen and a second position in which the fastener does not engage that pin.

14. The apparatus of claim 13, wherein the platen includes a platen top having a plurality of recesses formed in a bottom surface thereof, and a platen base secured to the bottom surface of the platen top, the recesses between the platen top and platen base forming the cavities.

15. The apparatus of claim 13, wherein the apparatus includes three cavities, three fasteners and three pins.

16. The apparatus of claim 13 wherein the plurality of fasteners are disposed at equal angular intervals about the periphery of the platen.

17. The apparatus of claim 13 wherein each fastener includes an arm pivotally attached to the platen, the arm including two finger portions forming a gap therebetween, and wherein in the first position the projection is located in the gap between the two finger portions.

18. A method of securing a polishing pad to a platen, comprising:

attaching the polishing pad to a pad support plate having a projection extending from a bottom surface thereof;

positioning the pad support plate on a platen so that the projection extends at least partially into an aperture in the platen; and

moving a fastener connected to the platen to engage the projection.