Low temperature encapsulation system

• US 5,932,113 A
• Filed: 09/04/1997
• Issued: 08/03/1999
• Est. Priority Date: 09/04/1997
• Status: Expired due to Fees

• Current Assignee: Hitachi Global Storage Technologies Netherlands BV (Western Digital Corporation)
• Original Assignee: International Business Machines Corporation
• Inventors: McKean, Dennis R., Kurdi, Bulent Nihat, Wong, Eric Keith
• Primary Examiner(s): POWELL, WILLIAM A
• Application Number:
  US08/923,360
• Time in Patent Office: 698 Days
• Field of Search: 216/11, 216/22, 216/27, 216/33, 216/36, 216/39, 216/41
• US Class Current: 216/22
• CPC Class Codes: C23F 1/02 Local etching
• CPC Class Codes: G11B 21/21 with provision for maintaining desired spacing of head from record carrier, e.g. fluid-dynamic spacing, slider
• CPC Class Codes: G11B 5/3106 where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination G11B5/3133 takes precedence
• CPC Class Codes: G11B 5/3116 Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks G11B5/3113, G11B5/245 take precedence
• CPC Class Codes: G11B 5/6005 Specially adapted for spacing from a rotating disc using a fluid cushion

Abstract

A method for preparing the air bearing surface of a slider for etch patterning including the steps of applying a first thin film to a carrier, applying a second thin film to the carrier, the first thin film and the second thin film separated by a recess, each of the first and second thin films having respective first and second air bearing surfaces, applying an adhesive film over the first and second thin films, depositing a fluid in the recess, the fluid held in the recess by the adhesive film, curing the fluid, and removing the adhesive film. The method of the invention may also include coating the first and second air bearing surfaces with an etch mask, developing the etch mask, and patterning the first and second air bearing surfaces.

Claims

1. A method of processing a thin film surface to prepare said surface for etching, said thin film surface comprising at least one raised portion bordered by at least one adjacent recess, said method comprising the steps of:

a) applying an adhesive film to said raised portion;

b) depositing a fluid into said recess, said fluid held in said recess by said film;

c) curing said fluid; and

d) removing said film.

2. The method of claim 1, wherein said adhesive film comprises a laminate of an adhesive layer and a flexible substrate layer.

3. The method of claim 2, wherein said adhesive layer is pressure sensitive.

4. The method of claim 3, wherein said adhesive layer comprises and acrylate adhesive.

5. The method of claim 1, wherein said fluid is cured with actinic radiation.

6. The method of claim 2, wherein said flexible substrate layer is transparent to actinic radiation.

7. The method of claim 1, wherein said thin film surface comprises a first raised portion and a second raised portion, said first and second raised portions separated by at least one recess, said fluid deposited into said recess.

8. The method of claim 7, wherein said recess is filled with said fluid substantially to the level of said first and second raised portions.

9. The method of claim 1, wherein said fluid comprises a photosensitizer and one or more acrylate monomers.

10. The method of claim 1, wherein said fluid is selected from the group consisting of a thiol-ene composition, an acrylic composition, an epoxy composition, and mixtures thereof.

11. The method of claim 1, further comprising the steps of:

a) coating said thin film surface with an etch mask;

b) developing said etch mask; and

c) etch patterning said thin film surface.

12. A patterned thin film surface resulting from the method of claim 11.

13. The method of claim 11, wherein said thin film surface comprises a transducer.

14. A patterned air bearing slider surface resulting from the method of claim 13.

15. The method of claim 11, wherein said etch mask has a thickness of from about 1 micron to 5 microns.

16. A method for preparing the air bearing surface of a slider for etch patterning, said method comprising the steps of:

a) applying a first thin film to a carrier;

b) applying a second thin film to said carrier, said first thin film and said second thin film separated by a recess, each of said first and second thin films comprising respective first and second air bearing surfaces;

c) applying an adhesive film over said first and second thin films adjacent said first and second air bearing surfaces;

d) depositing a fluid in said recess, said fluid held in said recess by said adhesive film;

e) curing said fluid; and

f) removing said adhesive film.

17. The method of claim 16, wherein said adhesive film comprises a laminate of an adhesive layer and a flexible substrate layer.

18. The method of claim 17, wherein said adhesive layer is pressure sensitive.

19. The method of claim 17, wherein said adhesive layer comprises an acrylate adhesive.

20. The method of claim 16, wherein said fluid is cured with actinic radiation.

21. The method of claim 17, wherein said flexible substrate layer is transparent to actinic radiation.

22. The method of claim 16, wherein said recess is filled with said fluid to the level of said respective first and second in bearing surfaces.

23. The method of claim 16, wherein said fluid comprises a photosensitizer and one or more acrylate monomers.

24. The method of claim 16, further comprising the steps of:

a) coating said first and second air bearing surfaces with an etch mask;

b) developing said etch mask; and

c) patterning said first and second air bearing surfaces.

25. A patterned air bearing surface resulting from the method of claim 24.

26. The method of claim 24, wherein each of said first and second air bearing surfaces comprise one or more transducers.

27. A slider resulting from the method of claim 26.

28. The method of claim 24 wherein the etch mask has a thickness ranging from about 1 to 5 microns.