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Low temperature encapsulation system

  • US 5,932,113 A
  • Filed: 09/04/1997
  • Issued: 08/03/1999
  • Est. Priority Date: 09/04/1997
  • Status: Expired due to Fees
First Claim
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1. A method of processing a thin film surface to prepare said surface for etching, said thin film surface comprising at least one raised portion bordered by at least one adjacent recess, said method comprising the steps of:

  • a) applying an adhesive film to said raised portion;

    b) depositing a fluid into said recess, said fluid held in said recess by said film;

    c) curing said fluid; and

    d) removing said film.

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