Sensor with silicon strain gage

• US 5,932,809 A
• Filed: 02/17/1998
• Issued: 08/03/1999
• Est. Priority Date: 02/17/1998
• Status: Expired due to Term

• Current Assignee: Google LLC (Alphabet Inc.)
• Original Assignee: Delco Electronics Corporation (Motors Liquidation Co. GUC Trust)
• Inventors: Sparks, Douglas Ray, Kearney, Mark Billings
• Primary Examiner(s): FELBER, JOSEPH LEON
• Application Number:
  US09/024,379
• Time in Patent Office: 532 Days
• Field of Search: 73/726, 73/727, 338/42
• US Class Current: 73/727
• CPC Class Codes: G01L 9/0055 bonded on a diaphragm

Abstract

A media-compatible sensing structure (210) that employs strain-sensing elements (222) formed in or on a silicon chip (212). The sensor (210) generally includes a metal body (214) having a diaphragm (216) and an edge (226) formed by an abrupt change in the thickness of the metal body (214) in a direction normal to the diaphragm (216). The silicon chip (212) is secured directly to the metal diaphragm (216) and has at least one strain-sensing element (222) aligned with the edge (226) of the body (214) in the direction normal to the diaphragm (216), such that movement of the diaphragm (216) induces strain in the silicon chip (212) that is localized at the strain-sensing element (222). The chip (212) preferably includes a groove (234) in its surface (212) facing the diaphragm (216) and between the strain-sensing element (222) and the metal body (214), such that strain induced in the chip (212) by movement of the diaphragm (216) is further concentrated in the region of the chip (212) containing the strain-sensing element (222). The chip (212) is preferably attached to the metal diaphragm (216) with a bonding material (236). To promote adhesion of the chip (212) to the diaphragm (216), the chip (212) preferably has recesses (240) in its surface facing the diaphragm (216) to create an interlocking effect between the bonding material (236) and the chip (212).

Claims

1. A sensing structure comprising:

a metal body having a diaphragm, the metal body having an edge formed by an abrupt change in thickness of the metal body in a direction normal to the diaphragm, the edge defining a boundary of the diaphragm;

a silicon chip secured to the metal diaphragm, the silicon chip comprising a strain-sensing element aligned with the edge of the body in the direction normal to the diaphragm, whereby movement of the diaphragm induces strain in the silicon chip that is concentrated at the strain-sensing element of the silicon chip; and

the silicon chip having a surface facing the metal body, the silicon chip having a groove in the surface so as to be between the strain-sensing element and the metal body, the groove causing the strain induced in the silicon chip by movement of the diaphragm to be further concentrated at the strain-sensing element of the silicon chip.

2. A sensing structure as recited in claim 1, wherein the strain-sensing element is defined by at least one doped surface region of the silicon chip.

3. A sensing structure as recited in claim 1, wherein the strain-sensing element is defined by at least one thin-film piezoresistive element on the silicon chip.

4. A sensing structure as recited in claim 1, further comprising signal conditioning circuitry electrically interconnected with the strain-sensing element.

5. A sensing structure as recited in claim 1, wherein the metal body comprises a rim portion surrounding the diaphragm, the edge of the metal body being defined between the diaphragm and the rim portion.

6. A sensing structure as recited in claim 1, wherein the metal body comprises a boss centrally located on the diaphragm, the edge of the metal body being defined between the diaphragm and the boss.

7. A sensing structure as recited in claim 6, wherein the metal body comprises a rim portion surrounding the diaphragm, a second edge of the metal body being defined between the diaphragm and the rim portion, the silicon chip further comprising a second strain-sensing element aligned with the second edge of the body in the direction normal to the diaphragm.

8. A sensing structure comprising:

a metal body having a diaphragm, the metal body having an edge formed by an abrupt change in thickness of the metal body in a direction normal to the diaphragm, the edge defining a boundary of the diaphragm;

a silicon chip secured to the metal diaphragm, the silicon chip comprising a strain-sensing element aligned with the edge of the body in the direction normal to the diaphragm, whereby movement of the diaphragm induces strain in the silicon chip that is concentrated at the strain-sensing element of the silicon chip, the silicon chip having a surface facing the metal body, the silicon chip having a plurality of recesses in the surface.

9. A sensing structure as recited in claim 8, the silicon chip having a groove in the surface so as to be between the strain-sensing element and the metal body, the groove causing the strain induced in the silicon chip by movement of the diaphragm to be further concentrated at the strain-sensing element of the silicon chip.

10. A sensing structure as recited in claim 9, wherein the silicon chip is attached to the metal body with a bonding material, the bonding material extending at least partially into the plurality of recesses in the surface of the silicon chip.

11. A pressure sensor assembly comprising:

a stainless steel body comprising a diaphragm, a rim surrounding the diaphragm, a boss centrally located on the diaphragm, a first edge formed by an abrupt change in thickness of the metal body in a direction normal to the diaphragm between the diaphragm and the rim, and a second edge formed by an abrupt change in thickness of the metal body in the direction normal to the diaphragm between the diaphragm and the boss;

a single-crystal silicon chip secured to the metal diaphragm, the silicon chip comprising a plurality of piezoresistive strain-sensing elements, each of the strain-sensing elements being aligned over at least one of the first and second edges of the body in the direction normal to the diaphragm, whereby movement of the diaphragm induces strain in the silicon chip that is concentrated at the strain-sensing elements of the silicon chip.

12. A pressure sensor assembly as recited in claim 11, wherein at least one of the strain-sensing elements is defined by at least one doped surface region of the silicon chip.

13. A pressure sensor assembly as recited in claim 11, wherein at least one of the strain-sensing elements is defined by at least one thin-film piezoresistive element on the silicon chip.

14. A pressure sensor assembly as recited in claim 11, further comprising signal conditioning circuitry electrically interconnected with the strain-sensing elements.

15. A pressure sensor assembly as recited in claim 11, wherein at least one of the strain-sensing elements is aligned over the first edge of the metal body in the direction normal to the diaphragm.

16. A pressure sensor assembly as recited in claim 15, wherein at least one of the strain-sensing elements is aligned over the second edge of the metal body in the direction normal to the diaphragm.

17. A pressure sensor assembly as recited in claim 11, wherein all of the strain-sensing elements are aligned over the first and second edges of the metal body.

18. A pressure sensor assembly as recited in claim 11, the silicon chip having a surface facing the metal body, the silicon chip having a U-shaped groove in the surface so as to be between at least one of the strain-sensing elements and the metal body, the groove causing the strain induced in the silicon chip by movement of the diaphragm to be further concentrated at the at least one strain-sensing element of the silicon chip.

19. A pressure sensor assembly as recited in claim 11, the silicon chip having a surface facing the metal body, the silicon chip having a plurality of recesses in the surface.

20. A pressure sensor assembly as recited in claim 19, wherein the recesses are undercut in the surface of the silicon chip and wherein the silicon chip is attached to the metal body with a bonding material, the boding material extending at least partially into the plurality of recesses in the surface of the silicon chip.