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Method for dissipating heat away from a heat sensitive device using bicarbonate compositions

  • US 5,932,839 A
  • Filed: 11/04/1997
  • Issued: 08/03/1999
  • Est. Priority Date: 11/04/1997
  • Status: Expired due to Term
First Claim
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1. An enclosure for thermally protecting one or more heat sensitive devices from a high temperature environment, said enclosure comprising:

  • an outer housing having interior surfaces defining an interior cavity, said interior cavity for containing said one or more heat sensitive devices; and

    a composition comprising;

    a) between about 10 percent and about 99 percent by weight of a bicarbonate compound; and

    b) between about 90 percent and about 1 percent by weight of a binder;

    wherein said composition occupies at least a portion of said interior cavity and substantially encloses said one or more heat sensitive devices;

    wherein said bicarbonate compound exhibits endothermic decomposition when said enclosure is subjected to said high temperature environment, and wherein said composition absorbs heat from said high temperature environment during said endothermic decomposition of said bicarbonate compound.

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