Antenna array for sensing signals on conductors

• US 5,933,121 A
• Filed: 04/07/1998
• Issued: 08/03/1999
• Est. Priority Date: 04/07/1998
• Status: Expired due to Term

• Current Assignee: Hanger Solutions, LLC (IP Investments Group LLC)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Davis, Larry, Newton, Charles M., Blumstein, Theodore R., Rainhart, Robert L.
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): Malos, Jennifer H.
• Application Number:
  US09/056,482
• Time in Patent Office: 483 Days
• Field of Search: 343/873, 343/872, 343/895, 343/700 MS, 343/841, 343/853, 343/789, 324/127, 324/522
• US Class Current: 343/873
• CPC Class Codes: G01R 29/0878 Sensors; antennas; probes; detectors wave guide measuring sections G01R1/24
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 21/0087 Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00
• CPC Class Codes: H01Q 21/061 Two dimensional planar arrays
• CPC Class Codes: H01Q 21/062 using dipole aerials; H01Q21/067, H01Q21/068 take precedence
• CPC Class Codes: H01Q 9/30 with feed to end of elongated active element, e.g. unipole H01Q9/44 takes precedence
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/0222 for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

An apparatus senses signals on conductors and includes a ceramic sensor body. A plurality of antenna elements are formed in the ceramic sensor body. Each antenna element includes a conductor sensing end and forms an array having a substantially planar face that is to be placed adjacent to conductors to be sensed. Each of the antenna elements further comprises a central electrode and a surrounding shield electrode spaced from the central electrode. A signal processor is connected to each antenna element and receives the signal output from each antenna element and processes the received signals for determining the presence of signals passing to the conductors. The central electrode and surrounding shield electrode are formed of a hardened, conductive paste received within the ceramic sensor body.

Claims

1. An apparatus for sensing signals on conductors comprising:

a ceramic sensor body;

a plurality of antenna elements formed in the ceramic sensor body, wherein each antenna element includes a conductor sensing end and is positioned to each other to form an antenna array having a substantially planar sensor face that is to be placed adjacent to the conductors to be sensed, each of said antenna elements further comprising,

a central electrode, and

a surrounding shield electrode spaced from the central electrode; and

signal processing means connected to each antenna element for receiving the signal output from each antenna element and processing the received signals for determining the presence of signals passing through the conductors.

2. An apparatus according to claim 1, wherein said central electrode and surrounding shield electrode are formed of a hardened, conductive paste received within the ceramic sensor body.

3. The apparatus according to claim 1, wherein said signal processing means further comprises a signal processing integrated circuit.

4. The apparatus according to claim 3 and further comprising means for mounting said signal processing integrated circuit on the sensor body.

5. The apparatus according to claim 4, wherein said sensor body further comprises a substantially planar mounting surface on which said signal processing integrated circuit is mounted.

6. The apparatus according to claim 1, wherein said central electrode of each antenna element includes first and second ends, wherein said first end has an enlarged diameter to be placed adjacent to the conductors to be sensed.

7. The apparatus according to claim 1, wherein said signal processing means further comprises a spectrum analyzer.

8. The apparatus according to claim 1, wherein said ceramic sensor body is formed from a plurality of green tape ceramic stacked sheets that have been cured by heating.

9. An apparatus according to claim 1, and further comprising means for grounding said surrounding shield electrode.

10. An apparatus according to claim 1, wherein said antenna elements are positioned in linear rows, with each row offset from each other.

11. An apparatus according to claim 1, wherein said central electrode is spiral configured.

12. An apparatus for sensing signals on conductors comprising:

a ceramic sensor body having a substantially planar sensor face that is to be placed adjacent to the conductors to be sensed, and an opposing circuit supporting end;

a plurality of antenna elements formed in the ceramic sensor body, wherein each antenna element is positioned to form an antenna array, wherein each antenna element has a signal sensing end positioned at the planar sensor face for sensing signals on conductors, each of said antenna elements further comprising,

a central electrode, and

a surrounding shield electrode spaced from the central electrode; and

signal processing means mounted on the circuit supporting end of said sensor body and connected to each antenna element for receiving the signal output from each antenna element and processing the received signals for determining the presence of signals passing through the conductors.

13. The apparatus according to claim 12, wherein said central electrode and said surrounding shield electrode are formed of a hardened, conductive paste received within the ceramic sensor body.

14. The apparatus according to claim 12, wherein said signal processing means further comprises a signal processing integrated circuit.

15. The apparatus according to claim 12, wherein said central electrode of each antenna element includes first and second ends, said first end having an enlarged diameter at the signal sensing end of said antenna element.

16. The apparatus according to claim 12, wherein said sensor body is formed from a plurality of green tape ceramic stacked sheets that have been cured by heating.

17. An apparatus according to claim 12 and further comprising means for grounding said surrounding shield electrode.

18. An apparatus according to claim 12, wherein said antenna elements are positioned in linear rows, with each row offset from each other.

19. An apparatus according to claim 12, wherein said central electrode is spiral configured.

20. An apparatus for sensing signals on conductors comprising:

a plurality of antenna elements positioned to form an array that is to be placed adjacent to the conductors to be sensed, each antenna element further comprising,

a central electrode, and

a surrounding shield electrode spaced from the central electrode; and

at least one signal processing integrated circuit connected to said antenna elements for receiving the signal output from each antenna element and processing the received signals for determining the presence of signals passing through the conductors.

21. The apparatus according to claim 20 and further comprising means for mounting said signal processing integrated circuit on the formed array and means connecting said signal processing integrated circuit to each of the antenna elements.

22. The apparatus according to claim 20, wherein said central electrode of each antenna element includes first and second ends, said first end having an enlarged diameter to be placed adjacent to the conductors to be sensed.

23. The apparatus according to claim 20, wherein said signal processing means further comprises a spectrum analyzer.

24. The apparatus according to claim 20 and further comprising a ceramic sensor body, and wherein each of said antenna elements is formed from a hardened, conductive paste received within said ceramic sensor body.

25. The apparatus according to claim 24, wherein said ceramic sensor body is initially formed from a plurality of green tape ceramic stacked sheets.

26. The apparatus according to claim 20, wherein said central electrodes and surrounding shield electrodes have ends forming a substantially coplanar face that is to be positioned adjacent to the conductors to be sensed.

27. An apparatus according to claim 20 and further comprising means for grounding said surrounding shield electrode.

28. An apparatus according to claim 20, wherein said antenna elements are positioned in linear rows, with each row offset from each other.

29. An apparatus according to claim 20, wherein said central electrode is spiral configured.

30. A sensor for sensing signals on conductors comprising:

a ceramic sensor body;

a plurality of antenna elements formed in the ceramic sensor body, wherein each antenna element is positioned to form an array and has a conductor sensing end forming a substantially coplanar sensor face that is to be placed adjacent to the conductors to be sensed, said antenna elements further comprising,

a central electrode, and

a surrounding shield electrode spaced from the central electrode.

31. A sensor according to claim 30, wherein said central electrode and surrounding shield electrode are formed of a hardened, conductive paste received within the ceramic sensor body.

32. A sensor according to claim 30 and further comprising means for connecting each of said antenna elements to a signal processor for forwarding the signal output from each antenna element to a signal processor to determine the presence of signals passing through the conductors.

33. A sensor according to claim 30, wherein said sensor body further comprises means for mounting a signal processing integrated circuit.

34. A sensor according to claim 30, wherein said central electrode of each antenna element includes first and second ends, said first end having an enlarged diameter to be placed adjacent to the conductors to be sensed.

35. A sensor according to claim 30, wherein said ceramic sensor body is formed from a plurality of green tape ceramic stacked sheets that are initially secured together and cured by heating.

36. A sensor according to claim 30, wherein said central electrode and surrounding shield electrode have ends forming a substantially coplanar face that is to be positioned adjacent to the conductors to be sensed.

37. A sensor according to claim 30 and further comprising means mounted on said sensor body for grounding said surrounding shield electrode.

38. A sensor according to claim 30, wherein said antenna elements are positioned in linear rows, with each row offset from each other.

39. A sensor according to claim 30, wherein said central electrode is spiral configured.

40. A sensor for sensing signals on conductors comprising:

a ceramic sensor body;

a plurality of antenna elements formed in the ceramic sensor body, wherein each antenna element is positioned to form an array and has a conductor sensing end that is to be placed adjacent to the conductors to be sensed, said antenna elements further comprising,

a central electrode, and

a surrounding shield electrode spaced from the central electrode; and

means for connecting each of said antenna elements to a signal processor to determine the presence of signals passing through the conductors.

41. A sensor according to claim 40, wherein said central electrode and surrounding shield electrode are formed of a hardened, conductive paste received within the ceramic sensor body.

42. A sensor according to claim 40, wherein said sensor body further comprises means for mounting a signal processing integrated circuit.

43. A sensor according to claim 40, wherein said central electrode of each antenna element includes first and second ends, said first end having an enlarged diameter to be placed adjacent to the conductors to be sensed.

44. A sensor according to claim 40, wherein said signal processing means further comprises a spectrum analyzer.

45. A sensor according to claim 40, wherein said ceramic sensor body is formed from a plurality of green tape ceramic stacked sheets that are initially secured together and cured by heating.

46. A sensor according to claim 40, wherein said central electrode and surrounding shield electrode have ends forming a substantially coplanar face that is to be positioned adjacent to the conductors to be sensed.

47. A sensor according to claim 40 and further comprising means mounted on said sensor body for grounding said surrounding shield electrode.

48. A sensor according to claim 40, wherein said antenna elements are positioned in linear rows, with each row offset from each other.

49. A sensor according to claim 40, wherein said central electrode is spiral configured.

50. A method for sensing signals on conductors comprising the steps of:

passing a plurality of antenna elements over the conductors to be sensed, wherein each of the antenna elements are positioned to form an array, and have a central electrode and surrounding electrode;

receiving the signal output within a signal processor from each antenna element as the antenna elements pass over the conductors; and

processing the received signal output from each antenna element to determine the presence of signals passing through the conductors.

51. A method of claim 50 and further comprising the step of correlating the processed signal output from each antenna element to determine the data passing through each conductor.