Multi-deck power converter module

• US 5,933,343 A
• Filed: 09/22/1998
• Issued: 08/03/1999
• Est. Priority Date: 02/21/1997
• Status: Expired due to Fees

• Current Assignee: Power-One Incorporated (ABB Limited)
• Original Assignee: International Power Devices, Inc. (ABB Limited)
• Inventors: Liu, Shih-Chang, Grandmont, Paul E., Lu, Qun
• Primary Examiner(s): Wong, Peter S.
• Assistant Examiner(s): Vu, Bao Q.
• Application Number:
  US09/158,221
• Time in Patent Office: 315 Days
• Field of Search: 363/144, 361/742, 361/758, 361/784, 361/790
• US Class Current: 363/144
• CPC Class Codes: H02M 3/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards

Abstract

A multi-deck power converter module assembly for connection with a substrate (e.g., a host board) having connection regions disposed on its surface includes a second circuit board positioned over a first circuit board, the second circuit board having apertures extending from an upper surface to a lower surface of the second circuit board. At least two rail members are positioned over the second circuit board, each rail member having a first and a second plurality of holes. A pair of spacers are disposed between the first and second circuit boards, each spacer extending through one of the apertures of the second circuit board and received within one of the first plurality of holes of one of the rail members. Terminal pins are attached to the first circuit board, at least one terminal pin extending through the second circuit board and a corresponding one of the second plurality of holes for connection to one of the connection regions on the substrate. Each of the second plurality of holes is sized to allow the rail members to be slidably positioned over the terminal pins during assembly of the power converter module.

Claims

1. A multi-deck power converter module assembly for connection with a substrate having connection regions disposed on a surface of the substrate, the power converter comprising:

a first circuit board;

a second circuit board positioned over the first circuit board, the second circuit board having apertures extending from an upper surface to a lower surface of the second circuit board;

a member positioned over the second circuit board and having a first plurality of holes and a second plurality of holes, the member including a sidewall having an opening which provides an airflow path to the first and second circuit boards;

a pair of spacers disposed between the first and second circuit boards, each spacer extending through one of the apertures of the second circuit board and received within one of the first plurality of holes of the member; and

terminal pins attached to the first circuit board for connection to one of the connection regions on the substrate, wherein each of the second plurality of holes is sized to allow the member to be slidably positioned over the terminal pins during assembly of the power converter module.

2. The multi-deck power converter module assembly of claim 1 wherein the member includes standoffs which contact and space the module from the surface of the substrate when the module assembly is mounted to the substrate.

3. The multi-deck power converter module assembly of claim 1 wherein the member includes a sidewall having an opening which provides an airflow path to the first and second circuit boards.

4. The multi-deck power converter module assembly of claim 1 wherein each of the spacers have shoulders for accurate positioning of boards.

5. The multi-deck power converter module assembly of claim 1 wherein each spacer includes an end extending through one the first plurality of holes of the member, the end being knurled to capture the circuit board.

6. The multi-deck power converter module assembly of claim 1 wherein the first circuit board includes a heat sink attached thereto.

7. The multi-deck power converter module assembly of claim 1 wherein the first and second circuit boards are electrically interconnected.

8. The multi-deck power converter module assembly of claim 1 wherein the multi-deck power converter module assembly is a DC--DC converter.

9. The multi-deck power converter module assembly of claim 1 wherein the first circuit board includes power components and the second circuit board includes control components.

10. The multi-deck power converter module assembly of claim 1 wherein the second circuit board has a surface area smaller than a surface area of the first circuit board.

11. The multi-deck power converter module assembly of claim 2 wherein the member includes a sidewall having an opening which provides an airflow path to the first and second circuit boards.

14. The multi-deck power converter module assembly of claim 11 wherein each of the spacers have shoulders for accurate positioning of boards.

15. The multi-deck power converter module assembly of claim 11 wherein each spacer includes and end extending through one the first plurality of holes of the member, the end being knurled to capture the circuit board.

16. The multi-deck power converter module assembly of claim 11 wherein the first circuit board includes a heat sink attached thereto.

17. The multi-deck power converter module assembly of claim 11 wherein the first and second circuit boards are electrically interconnected.

12. A multi-deck DC--DC converter module assembly for connection with a substrate having connection regions disposed on a surface of the substrate, the power converter comprising:

a first circuit board;

a second circuit board positioned over the first circuit board, the second circuit board having apertures extending from an upper surface to a lower surface of the second circuit board;

at least one member positioned over the second circuit board and having a first plurality of holes and a second plurality of holes, the member including;

a sidewall having an opening which provides an airflow path to the first and second circuit boards;

standoffs which contact and space the module assembly from the surface of the substrate when the module assembly is mounted to the substrate;

a pair of spacers disposed between the first and second circuit boards, each spacer extending through one of the apertures of the second circuit board and received within one of the first plurality of holes of the member; and

terminal pins attached to the first circuit board, at least one terminal pin extending through the second circuit board and a corresponding one of the second plurality of holes for connection to one of the connection regions on the substrate, wherein each of the second plurality of holes of the member sized to allow the member to be slidably positioned over the terminal pins.

13. The multi-deck DC--DC converter module assembly of claim 12 wherein the member has a rectangular shape and the first plurality of holes are disposed at ends of the member.