All-silicon capacitive pressure sensor

• US 5,936,164 A
• Filed: 08/27/1997
• Issued: 08/10/1999
• Est. Priority Date: 08/27/1997
• Status: Expired due to Term

• Current Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Original Assignee: Delco Electronics Corporation (Motors Liquidation Co. GUC Trust)
• Inventors: Staller, Steven Edward, Baney, William J, Siekkinen, James Werstler, Sparks, Douglas Ray, Chilcott, Dan Wesley
• Primary Examiner(s): OEN, WILLIAM L
• Application Number:
  US08/917,974
• Time in Patent Office: 713 Days
• Field of Search: 73/718, 73/724, 29/25.41, 29/25.42, 361/283.4
• US Class Current: 73/724
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm

Abstract

An all-silicon monolithic capacitive absolute pressure-sensing device and method for making the same. The device employs a single-crystal silicon diaphragm that serves at a flexible capacitor plate of a variable capacitor. The diaphragm is bonded to a single-crystal silicon wafer to overlie a cavity etched into the wafer. A fixed capacitor plate of the variable capacitor is formed by a heavily-doped region at the bottom of the cavity. A thin dielectric layer is grown on the fixed capacitor plate to complete the capacitor. The cavity has a minimal depth such that the fixed capacitor plate provides overpressure protection for the diaphragm. At least a portion of the operating range of the pressure sensor occurs while the diaphragm is contacting the doped region. As a result, the capacitive output signal of the pressure sensor is produced by changes in contact area between the diaphragm and a thin dielectric situated on the doped region in response to pressure applied to the diaphragm.

Claims

1. A capacitive pressure sensor comprising:

a semiconductor wafer, at least a portion of the semiconductor wafer being characterized by a first electrical conductivity type;

a doped region of the first electrical conductivity type in a surface of the semiconductor wafer, the doped region being a fixed capacitor plate of the capacitive pressure sensor; and

a diaphragm bonded to the semiconductor wafer such that the diaphragm overlies the fixed capacitor plate and forms a hermetic seal around the fixed capacitor plate, the diaphragm being of the first electrical conductivity type and electrically insulated from the fixed capacitor plates, the diaphragm being a flexible capacitor plate of the capacitive pressure sensor;

wherein the flexible capacitor plate forms a gap with the fixed capacitor plate of up to about ten micrometers, and a capacitive output signal of the capacitive pressure sensor is produced by changes in contact area between the diaphragm and the semiconductor wafer in response to pressure applied to the diaphragm.

2. A capacitive pressure sensor as recited in claim 1 wherein the diaphragm overlies a limited portion of the semiconductor wafer to yield an exposed surface portion of the semiconductor wafer.

3. A capacitive pressure sensor as recited in claim 2 further comprising a contact to the fixed capacitor plate formed in the exposed surface portion of the semiconductor wafer.

4. A capacitive pressure sensor as recited in claim 1 wherein the diaphragm is formed of single-crystal silicon doped with boron and germanium.

5. A capacitive pressure sensor as recited in claim 1 wherein the capacitive pressure sensor is an all-silicon monolithic absolute pressure sensor.

6. A capacitive pressure sensor as recited in claim 1 further comprising a cavity in the surface of the semiconductor wafer, the doped region being in the cavity such that the gap between the flexible and fixed capacitor plates is about two to seven micrometers.

7. A capacitive pressure sensor as recited in claim 1 wherein:

the semiconductor wafer comprises a heavily-doped substrate and an overlying layer formed by a lightly-doped epitaxy or an oxide;

an opening is present in the overlying layer so as to expose a portion of the heavily-doped substrate, the portion exposed by the opening constituting the doped region; and

the diaphragm is bonded to the overlying layer and overlies the opening in the overlying layer, such that the opening establishes a cavity between the diaphragm and the doped region.

8. A capacitive pressure sensor as recited in claim 1 further comprising a dielectric layer between the doped region and the diaphragm so as to electrically insulate the flexible and fixed capacitor plates.