Method for realizing magnetic circuits in an integrated circuit

• US 5,936,298 A
• Filed: 12/06/1996
• Issued: 08/10/1999
• Est. Priority Date: 12/07/1995
• Status: Expired due to Term

• Current Assignee: Co.Ri.M.Me - Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, SGS-Thomson Microelectronics, S.R.L. (STMicroelectronics NV)
• Original Assignee: Co.Ri.M.Me-Consorzio Per La Ricera Sulla Microelectronia Nel., SGS-Thomson Microelectronics, S.R.L. (STMicroelectronics NV)
• Inventors: Zambrano, Raffaele, Capocelli, Piero, Riva, Carlo, Pio, Federico
• Primary Examiner(s): Prenty, Mark V.
• Application Number:
  US08/761,185
• Time in Patent Office: 977 Days
• Field of Search: 257/758, 257/531
• US Class Current: 257/531
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 2017/0086 on semiconductor substrate
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Inductive structures make highly efficient use of the magnetic flux generd, and are consistent with integrated circuit manufacturing techniques. The structures include electrically conductive layers and interconnecting conductor filled vias to define a helical winding surrounding a closed magnetic core. The magnetic core may also be formed by semiconductor manufacturing techinuqes. A method of making the structures on a semiconductor substrate concurrently with the formation of the integrated circuit itself is also disclosed.

Claims

1. An integrated circuit comprising:

a substrate;

one or more semiconductor components on said substrate;

a first electrically conductive layer on said substrate;

a first insulating layer on said first electrically conductive layer;

a layer of magnetic material on said first insulating layer and defining a closed-loop magnetic component positioned laterally adjacent said one or more semiconductor components;

a second insulating layer on said closed-loop magnetic component;

a second electrically conductive layer on said second insulating layer; and

a first plurality of vertical electrical conductors connecting portions of said first and said second electrically conductive layers to define a first three-dimensional helical conductive structure surrounding at least a portion of said closed loop magnetic component laterally adjacent said one or more semiconductor components;

at least one of said first and second electrically conductive layers also connecting the one or more semiconductor components.

2. An integrated circuit according to claim 1 further comprising a second plurality of vertical conductors connecting portions of said first and second electrically conductive layers to define a second helical structure surrounding at least a portion of said closed-loop magnetic component.

3. An integrated circuit according to claim 2 wherein said first and second helical structures define a transformer in cooperation with said closed-loop magnetic component.

4. An integrated circuit according to claim 1, further comprising at least one other electrically conductive layer;

and wherein said first electrically conductive layer is a lowermost electrically conductive layer, and said second electrically conductive layer is an uppermost electrically conductive layer.

5. An integrated circuit according to claim 1, wherein the magnetic material has a magnetic permeability of higher than about one.

6. An integrated circuit according to claim 1, wherein the magnetic material comprises a ferronickel alloy.

7. An integrated circuit according to claim 1, wherein the magnetic material comprises an aluminum-based alloy.

8. An integrated circuit comprising:

a substrate;

one or more semiconductor components on said substrate;

a first electrically conductive layer on said substrate;

a first insulating layer on said first electrically conductive layer;

a layer of magnetic material on said first insulating layer and defining a closed-loop magnetic component positioned laterally adjacent said one or more semiconductor components;

a second insulating layer on said closed-loop magnetic component;

a second electrically conductive layer on said second insulating layer;

a first plurality of vertical electrical conductors connecting portions of said first and said second electrically conductive layers to define a first three-dimensional helical conductive structure surrounding a portion of said closed-loop magnetic component laterally adjacent said one or more semiconductor components; and

a second plurality of vertical conductors connecting portions of said first and second electrically conductive layers to define a second three-dimensional helical conductive structure surrounding a portion of said closed-loop magnetic component so that said first and second helical conductive structures define a transformer in cooperation with said closed-loop magnetic component laterally adjacent said one or more semiconductor components;

at least one of said first and second electrically conductive layers also connecting the one or more semiconductor components.

9. An integrated circuit according to claim 8, further comprising at least one other electrically conductive layer;

and wherein said first electrically conductive layer is a lowermost electrically conductive layer, and said second electrically conductive layer is an uppermost electrically conductive layer.

10. An integrated circuit according to claim 8, wherein the magnetic material has a magnetic permeability of higher than about one.

11. An integrated circuit according to claim 8, wherein the magnetic material comprises a ferronickel alloy.

12. An integrated circuit according to claim 8, wherein the magnetic material comprises an aluminum-based alloy.

13. An integrated circuit comprising:

a substrate;

one or more semiconductor components on said substrate;

a first electrically conductive layer on said substrate being a lowermost electrically conductive layer;

a first insulating layer on said first electrically conductive layer;

a second electrically conductive layer on said first insulating layer being an uppermost electrically conductive layer;

at least one other electrically conductive layer;

a first plurality of vertical electrical conductors connecting portions of said first and said second electrically conductive layers to define a first three-dimensional helical conductive structure defining an inductor positioned laterally adjacent said one or more semiconductor components; and

at least one of said first and second electrically conductive layers also connecting the one or more semiconductor components.

14. An integrated circuit comprising:

a substrate;

one or more semiconductor components on said substrate;

a first electrically conductive layer on said substrate;

a first insulating layer on said first electrically conductive layer;

a layer of magnetic material on said first insulating layer and defining a first magnetic component;

a second insulating layer on said magnetic component;

a second electrically conductive layer on said second insulating layer;

a first plurality of vertical electrical conductors connecting portions of said first and said second electrically conductive layers to define a first helical structure surrounding at least a portion of said first magnetic component; and

at least one other electrically conductive layer;

at least one of said first and second electrically conductive layers also connecting the one or more semiconductor components, said first electrically conductive layer being a lowermost electrically conductive layer and said second electrically conductive layer being an uppermost electrically conductive layer.

15. An integrated circuit according to claim 14, wherein said first magnetic component has a closed-loop configuration.

16. An integrated circuit according to claim 14, wherein said magnetic layer defines a second magnetic component, and further comprising a second plurality of vertical conductors connecting portions of said first and second electrically conductive layers to define a second helical structure surrounding at least a portion of said second magnetic component.

17. An integrated circuit according to claim 16, wherein said magnetic layer also comprises connecting means for magnetically connecting said first and second magnetic components.

18. An integrated circuit according to claim 17, wherein said connecting means and said first and second magnetic components define a closed-loop configuration so that said first and second helical structures define a transformer in cooperation with said connecting means and said first and second magnetic components.

19. An integrated circuit according to claim 14, wherein the magnetic material has a magnetic permeability of higher than about one.

20. An integrated circuit according to claim 14, wherein the magnetic material comprises a ferronickel alloy.

21. An integrated circuit according to claim 14, wherein the magnetic material comprises an aluminum-based alloy.