Stacked leads-over chip multi-chip module

• US 5,936,305 A
• Filed: 09/22/1998
• Issued: 08/10/1999
• Est. Priority Date: 11/20/1997
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Akram, Salman
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US09/158,467
• Time in Patent Office: 322 Days
• Field of Search: 257/723, 257/777, 257/778, 257/786, 257/713, 257/706, 257/698, 257/692, 257/704, 257/737, 257/679, 257/680
• US Class Current: 257/723
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/06135 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/06136 Covering only the central area of the surface to be connected, i.e. central arrangements
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/80 : Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01076 : Osmium [Os]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: Y10T 408/5635 : Oppositely moving lateral clamps

Abstract

A multi-chip module (MCM) and method of manufacturing is disclosed that provides for attachment of semiconductor dice to both sides of the MCM printed circuit board (PCB). Semiconductor dice attached to the top surface of the PCB may be attached by conventional wire bonding, TAB or flip chip methods whereas those semiconductor dice attached to the bottom surface of the PCB are wire bonded or TAB connected to the top surface through openings in the PCB. The openings provide a lead-over-chip (LOC) arrangement for those semiconductor dice attached to the bottom surface resulting in shortened wire bonds. The bottom surface of the PCB may be provided with die recesses into which the openings extend, to receive the dice and bring their active surfaces even closer to the top surface of the PCB for wire bonding.

Claims

1. A multi-chip module, comprising:

a carrier substrate including at least one opening defined therethrough bounded by a periphery and a surface including a plurality of conductive areas thereon, at least one conductive area lying laterally adjacent said at least one opening;

at least one semiconductor die including a plurality of bond pads, said at least one semiconductor die secured to another surface of said substrate with said plurality of bond pads exposed through said at least one opening;

at least one discrete, elongated intermediate conductive element connected to at least one of said plurality of conductive areas and to at least one of said plurality of bond pads, extending through said at least one opening and spaced apart from said periphery; and

at least one other semiconductor die including a plurality of bond pads adjacent said surface and connected to at least another of said plurality of conductive areas.

2. The multi-chip module of claim 1, wherein said at least one semiconductor die is partially disposed over said at least one opening.

3. The multi-chip module of claim 1, wherein said at least one other semiconductor die is laterally adjacent said at least one opening.

4. The multi-chip module of claim 1, wherein said at least one semiconductor die is electrically connected to said at least one of said plurality of conductive areas by an intermediate conductive element comprising a TAB connection.

5. The multi-chip module of claim 1, wherein said at least one other semiconductor die is flip-chip bonded to at least one of said plurality of conductive areas.

6. The multi-chip module of claim 1, wherein at least one of said plurality of conductive areas lies over at least a portion of said at least one semiconductor die.

7. The multi-chip module of claim 6, wherein said at least one intermediate conductive element is selected from the group comprising bond wires and TAB connections.

8. The multi-chip module of claim 1, wherein said another surface defines at least one recess sized and shaped to receive at least a portion of said at least one semiconductor die and said at least one semiconductor die is disposed at least partially therein.

9. The multi-chip module of claim 1, further including an adhesive bond between said at least one semiconductor die and said carrier substrate.

10. The multi-chip module of claim 1, wherein said plurality of conductive areas is in electrical communication with edge-connects at a periphery of said carrier substrate.

11. The multi-chip module of claim 1, wherein said at least one opening comprises a plurality of elongated, mutually parallel openings.

12. The multi-chip module of claim 11, further including at least one other elongated opening oriented in non-parallel relationship to said plurality of mutually parallel openings.

13. The multi-chip module of claim 1, wherein said at least one other semiconductor die is positioned at least partially over said at least one opening.

14. The multi-chip module of claim 1, further including an underfill compound disposed between said at least one other die and said surface.

15. The multi-chip module of claim 14, wherein said underfill compound extends at least partially into said at least one opening.

16. The multi-chip module of claim 14, wherein said underfill compound substantially envelops said at least one intermediate conductive element.

17. A semiconductor die assembly, comprising:

a carrier substrate having a plurality of slots therethrough and a plurality of conductors on a first side of said carrier substantially laterally adjacent said plurality of slots, said conductors in electrical communication with a plurality of conductive elements transversely projecting from said first side for electrically connecting said carrier substrate to a higher-level package;

at least one semiconductor die secured to said carrier substrate adjacent a second side thereof and having a plurality of bond pads exposed through said plurality of slots; and

at least one individual, elongated intermediate conductive element connected to at least one of said plurality of bond pads, extending through said plurality of slots and spaced apart from a periphery thereof.

18. The semiconductor die assembly of claim 17, further including at least one recess in said second side.

19. The semiconductor die assembly of claim 18, wherein said at least one recess communicates with said at plurality of slots.

20. The semiconductor die assembly of claim 18, wherein said at least one recess is configured to receive at least a portion of said at least one semiconductor die.