Electronic device having lead terminals coated with resin

• US 5,936,511 A
• Filed: 01/10/1997
• Issued: 08/10/1999
• Est. Priority Date: 01/22/1996
• Status: Expired due to Term

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Yamashita, Yoshiyuki, Kawamoto, Tetsuya, Yoshimura, Tatsuya
• Primary Examiner(s): Walberg, Teresa
• Assistant Examiner(s): PWU, JEFFREY C
• Application Number:
  US08/781,197
• Time in Patent Office: 942 Days
• Field of Search: 338/22 R, 338/22 D, 392/503, 374/185, 310/320, 310/340, 310/348
• US Class Current: 338/22.00R
• CPC Class Codes: H01B 3/421 Polyesters
• CPC Class Codes: H01C 1/034 the housing or enclosure being formed as coating or mould without outer sheath H01C1/032 takes precedence
• CPC Class Codes: H01C 1/1413 Terminals or electrodes formed on resistive elements having negative temperature coefficient

Abstract

An electronic device of a kind having an electronic element with a main body, terminal electrodes on the main body and lead terminals electrically connected individually to the terminal electrodes has at least a portion of the outer surfaces of the lead terminals covered with a coating resin composition containing as its resin component a saturated copolymerized polyester resin which can be dissolved in an organic solvent such that the mechanical strength of the lead terminals is improved and the insulation of the device is not compromised during its manufacture or mounting.

Claims

1. An electronic device comprising:

a planar thermistor main body having mutually parallel outwardly facing principal surfaces, terminal electrodes on said principal surfaces and lead terminals each connected to and in electrically conductive relationship with a corresponding one of said terminal electrodes;

a covering resin material which comprises epoxy resin and covers said thermistor main body; and

a coating resin composition covering at least a portion of outer surfaces of said lead terminals, said coating resin composition containing as resin component thereof a saturated copolymerized polyester resin which can be dissolved in an organic solvent.

2. The electronic device of claim 1 wherein said coating resin composition covers outer surfaces of both said thermistor main body and said lead terminals.

3. The electronic device of claim 1 wherein said lead terminals have at least one bent part, said bent part being covered by said coating resin composition.

4. The electronic device of claim 2 wherein said lead terminals have at least one bent part, said bent part being covered by said coating resin composition.

5. The electronic device of claim 1 wherein said thermistor main body has a negative characteristic.

6. The electronic device of claim 2 wherein said thermistor main body has a negative characteristic.

7. The electronic device of claim 5 adapted to detect the temperature of a secondary battery pack comprising secondary batteries and a pack main body containing said secondary batteries.

8. The electronic device of claim 6 adapted to detect the temperature of a secondary battery pack comprising secondary batteries and a pack main body containing said secondary batteries.

9. The electronic device of claim 1 wherein said saturated copolymerized polyester resin has average numerical molecular weight of 18000-25000, tensile rupture strength 2 MPa-20 MPa, tensile rupture elongation 300%-1400%, and hardness 15 Shore D-60 Shore D.

10. The electronic device of claim 1 wherein said saturated copolymerized polyester resin has average numerical molecular weight of 15000-20000, tensile rupture strength 35 MPa-60 MPa, tensile rupture elongation 1%-10%, and hardness 65 Shore D-90 Shore D.

11. The electronic device of claim 1 wherein said saturated copolymerized polyester resin is a mixture of a first kind and a second kind, said first kind having average numerical molecular weight of 18000-25000, tensile rupture strength 2 MPa-20 MPa, tensile rupture elongation 300%-1400%, and hardness 15 Shore D-60 Shore D, and said second kind having average numerical molecular weight of 15000-20000, tensile rupture strength 35 MPa-60 MPa, tensile rupture elongation 1%-10%, and hardness 65 Shore D-90 Shore D.

12. The electronic device of claim 1 wherein said coating resin composition has tensile rupture strength 12 MPa-20 MPa, tensile elastic modulus 500 MPa-1200 MPa, tensile rupture elongation 3%-40%, and hardness 42 Shore D-50 Shore D.

13. The electronic device of claim 9 wherein said coating resin composition has tensile rupture strength 12 MPa-20 MPa, tensile elastic modulus 500 MPa-1200 MPa, tensile rupture elongation 3%-40%, and hardness 42 Shore D-50 Shore D.

14. The electronic device of claim 10 wherein said coating resin composition has tensile rupture strength 12 MPa-20 MPa, tensile elastic modulus 500 MPa-1200 MPa, tensile rupture elongation 3%-40%, and hardness 42 Shore D-50 Shore D.

15. The electronic device of claim 11 wherein said coating resin composition has tensile rupture strength 12 MPa-20 MPa, tensile elastic modulus 500 MPa-1200 MPa, tensile rupture elongation 3%-40%, and hardness 42 Shore D-50 Shore D.

16. The electronic device of claim 11 wherein said mixture contains 25-75 weight parts of said second kind and 100 weight parts of said first kind.

17. The electronic device of claim 15 wherein said mixture contains 25-75 weight parts of said second kind and 100 weight parts of said first kind.

18. The electronic device of claim 1 wherein said coating resin composition further contains 10-400 weight parts of an inorganic filler for 100 weight parts of said resin component, said inorganic filler containing one or more metallic compounds selected from the group consisting of silicon oxide, titanium oxide, aluminum oxide, talc, antimony trioxide, aluminum hydroxide and magnesium hydroxide.

19. The electronic device of claim 1 wherein said coating resin composition further contains 5-50 weight parts of an organic flame retardant for 100 weight parts of said resin component, said organic flame retardant being selected from hexabromobenzene, pentabromodiphenylethane, ammonium polyphosphate and polyphosphoric amide.

20. The electronic device of claim 18 wherein said coating resin composition further contains 5-50 weight parts of an organic flame retardant for 100 weight parts of said resin component, said organic flame retardant being selected from hexabromobenzene, pentabromodiphenylethane, ammonium polyphosphate and polyphosphoric amide.