Projection exposure method and projection exposure apparatus

• US 5,936,711 A
• Filed: 09/17/1997
• Issued: 08/10/1999
• Est. Priority Date: 09/19/1996
• Status: Expired due to Fees

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Miyai, Tsuneo, Imai, Yuji
• Primary Examiner(s): Mathews, Alan A.
• Application Number:
  US08/931,933
• Time in Patent Office: 692 Days
• Field of Search: 355/53, 355/55, 250/548, 250/559.29, 250/559.31, 250/201.4, 250/201.6, 356/401, 356/400
• US Class Current: 355/55
• CPC Class Codes: G03B 27/42 for automatic sequential copying of the same original G03B27/34, G03B27/53 take precedence
• CPC Class Codes: G03F 7/70 Microphotolithographic exposure; Apparatus therefor photo-masks G03F1/00
• CPC Class Codes: G03F 9/70 for microlithography measuring printed patterns for monitoring overlay G03F7/70633 or focus G03F7/70641; projection system adjustment G03F7/70258; position control G03F7/70775

Abstract

A focusing operation is performed so that the center of an exposure region on a photosensitive substrate coincides with a focal point of a projection optical system, based on setting information of a variable field stop, which sets the exposure region. Even in a case where only a portion of an exposable region of the projection optical system PL is set as the exposure region using the variable field stop, and only the set portion is subjected to exposure, exposure is performed while the set exposure region is brought into accurate focus, thereby improving resolution. Accordingly, an appropriate focusing operation can be always performed so as to achieve high accuracy exposure, irrespective of variations in the shape of the exposure region.

Claims

1. A projection exposure method for illuminating a mask having a pattern formed thereon with exposure light so as to expose an image of the pattern formed on the mask onto a photosensitive substrate through a projection optical system, the method comprising:

providing a variable field stop that is capable of variably setting an exposure region on the photosensitive substrate;

performing a focusing operation prior to exposure for aligning a center of the exposure region on the photosensitive substrate with an imaging position of the projection optical system based on setting information of the variable field stop; and

exposing the pattern onto the exposure region wherein a position on the substrate where exposure of the pattern onto the exposure region is performed is different from a position on the substrate where the focusing operation for the exposure region is performed.

2. A projection exposure method according to claim 1, further comprising, bringing a surface of the photosensitive substrate at the center of the exposure region into a focal plane of the projection optical system at a location different from a predetermined exposure location based on the setting information of the variable field stop, and positioning the photosensitive substrate at the exposure location while maintaining a position in an optical axis direction of the photosensitive substrate.

3. A projection exposure method according to claim 2, further comprising determining the focal plane of the projection optical system in accordance with a calibration signal and a focus position detection signal.

4. A projection exposure method according to claim 3, wherein the calibration signal is determined by emitting an illumination light along a calibration light path through a reference mark plate, through the projection optical system to a pattern surface on the mask, reflecting the illumination light from the pattern surface on the mask along the calibration light path to the reference mark plate, and sensing an amount illumination light reflected through the reference mark plate.

5. A projection exposure method according to claim 4, wherein the focus position detection signal is determined by performing focal point detection using oblique incident light on the photosensitive substrate with an illumination optical system and a light receiving optical system.

6. A projection exposure method according to claim 3, further comprising storing the calibration signal and the focus position detection signal in a series of address areas in a first memory region and a second memory region, respectively, while controlling the position of the photosensitive substrate in the optical axis direction.

7. A projection exposure method according to claim 6, wherein the step of determining the focal plane of the projection optical system comprises determining a deviation amount of a Z-axis coordinate in the optical axis direction by performing predetermined linear transformation with respect to deviation address amount obtained by subtracting the address of a zero-cross point of the focus position detection signal from the address of a concave or convex peak of the calibration signal.

8. A projection exposure method according to claim 7, wherein the step of determining the deviation amount is repeated n times, and wherein the focal plane of the projection optical system is determined in accordance with an average deviation amount.

9. A projection exposure method according to claim 1, wherein the focusing operation is performed at a position where the center of the exposure region is substantially aligned with an optical axis of the projection optical system.

10. A projection exposure method according to claim 1, wherein exposure is performed at a position where the center of the exposure region is offset from an optical axis of the projection optical system.

11. A projection exposure method for illuminating a mask having a pattern formed thereon with exposure light so as to expose an image of the pattern formed on the mask onto a photosensitive substrate through a projection optical system, the method comprising:

(a) measuring curvature of field of the projection optical system;

(b) performing a focusing operation at a center of an exposure region on the photosensitive substrate set by a variable field stop based on data on the curvature of field and setting information of the variable field stop; and

(c) exposing the pattern onto the exposure region in a position on the substrate different from a position on the substrate where the focusing operation for the exposure region is performed.

12. A projection exposure method according to claim 11, wherein steps (a) and (b) are performed during exposure or prior to starting exposure.

13. A projection exposure method according to claim 12, wherein step (a) is performed with respect to at least three locations on the photosensitive substrate.

14. A projection exposure method according to claim 13, further comprising the step of interpolating the data on the curvature of field obtained in step (a) by using a quadratic function to a sixth-order function, wherein step (b) is performed based on the interpolated data on the curvature of field and the setting information of the variable field stop.

15. A projection exposure method according to claim 11, wherein step (a) is performed with respect to at least three locations on the photosensitive substrate.

16. A projection exposure method according to claim 15, further comprising the step of interpolating the data on the curvature of field obtained in step (a) by using a quadratic function to a sixth-order function, wherein step (b) is performed based on the interpolated data on the curvature of field and the setting information of the variable field stop.

17. A projection exposure method according to claim 11, wherein step (b) is performed based on a focus position detecting signal.

18. A projection exposure method according to claim 17, wherein the focus position detection signal is determined by performing focal point detection using oblique incident light on the photosensitive substrate with an illumination optical system and a light receiving optical system.

19. A projection exposure method according to claim 11, further comprising, after step (b), the step of positioning the photosensitive substrate so that the exposure region is positioned at a predetermined exposure location while maintaining the position of the photosensitive substrate in an optical axis direction.

20. A projection exposure method according to claim 11, wherein the focusing operation is performed at a position where the center of the exposure region is substantially aligned with an optical axis of the projection optical system.

21. A projection exposure method according to claim 11, wherein exposure is performed at a position where the center of the exposure region is offset from an optical axis of the projection optical system.

22. A projection exposure apparatus for illuminating a mask having a pattern formed thereon with exposure light so as to expose an image of the pattern formed on the mask onto a photosensitive substrate through a projection optical system, the apparatus comprising:

a specimen support movable in at least three axial directions, the specimen support supporting the photosensitive substrate, wherein the at least three axial directions include an optical axis direction of the projection optical system and mutually orthogonal two axial directions in a plane perpendicular to the optical axis direction;

a position control system operatively coupled with the specimen support, the position control system controlling a position of the specimen support in the at least three axial directions;

a focal point detection system that detects a position in the optical axis direction in the vicinity of the optical axis;

a variable field stop disposed in an exposure region optical path including the photosensitive substrate, the variable field stop setting an exposure region on the photosensitive substrate where the image of the pattern is projected; and

a controller communicating with the variable field stop, the focal point detection system and the position control system, the controller discriminating the exposure region on the photosensitive substrate based on setting information of the variable field stop, and the controller moving the exposure region on the photosensitive substrate to a predetermined exposure location after an approximate center of the exposure region is brought onto a focal point of the projection optical system using the position control system and the focal point detection system, wherein a position on the substrate where exposure of the pattern onto the exposure region is performed is different from a position on the substrate where the discriminating of the exposure region is performed.

23. A projection exposure apparatus for illuminating a mask having a pattern formed thereon with exposure light so as to expose an image of the pattern formed on the mask onto a photosensitive substrate through a projection optical system, the apparatus comprising:

a specimen support movable in at least three axial directions, the specimen support supporting the photosensitive substrate, wherein the at least three axial directions include an optical axis direction of the projection optical system and mutually orthogonal two axial directions in a plane perpendicular to the optical axis direction;

a position control system operatively coupled with the specimen support, the position control system controlling a position of the specimen support in the at least three axial directions;

a focal point detection system that detects a position in the optical axis direction in the vicinity of the optical axis;

a variable field stop disposed in an exposure region optical path including the photosensitive substrate, the variable field stop setting an exposure region on the photosensitive substrate where the image of the pattern is projected;

a memory storing data on curvature of field of the projection optical system measured with respect to at least three locations on the photosensitive substrate;

an operator communicating with the memory, the operator calculating a difference between a focusing position in the exposure region of the projection optical system and a focusing position in the vicinity of the optical axis of the projection optical system based on the data on the curvature of field; and

a controller communicating with the operator, the memory, the variable field stop, the focal point detection system and the position control system, the controller positioning the photosensitive substrate via the position control system so that an approximate center of the exposure region coincides with a detection center of the focal point detection system based on setting information of the variable field stop, wherein the controller performs a focusing operation of the exposure region in accordance with the difference calculated by the operator, and wherein a position on the substrate where exposure of the pattern onto the exposure region is performed is different from a position on the substrate where the focusing operation for the exposure region is performed.

24. A projection exposure apparatus for illuminating a mask having a pattern formed thereon with exposure light so as to expose an image of the pattern formed on the mask onto a photosensitive substrate through a projection optical system, the apparatus comprising:

a substrate stage movable two-dimensionally in a reference plane;

a specimen support mounted on the substrate stage, the specimen support supporting the photosensitive substrate and being movable in an optical axis direction of the projection optical system;

a driving system operatively coupled with the substrate stage and the specimen support, the driving system driving the substrate stage and the specimen support in respective moving directions;

a position measuring section operatively communicating with the specimen support for measuring a position in the reference plane of the specimen support;

a stage control system that controls a position of the substrate stage via the driving system, the stage control system monitoring an output of the position measuring section;

a first focal point detection system that detects a position in the optical axis direction in the vicinity of the optical axis;

a variable field stop for setting an exposure region on the photosensitive substrate where the image of the pattern is projected;

a second focal point detection system disposed in the exposure region optical path, the second focal point detection system discriminating an optimum imaging plane of the projection optical system;

a curvature of field measuring section that measures data on curvature of field of the projection optical system for a plurality of locations within the exposure region using the second focal point detection system based on setting information of the variable field stop;

an operator communicating with the curvature of field measuring section, the operator calculating a difference between a focusing position in the exposure region and a focusing position of the projection optical system in the vicinity of a detection center of the focal point detection system based on the data on curvature of field; and

a controller communicating with the operator, the curvature of field measuring section, the second focal point detection system, the variable field stop, the first focal point detection system, the stage control system, the position measuring section and the driving system, the controller positioning the photosensitive substrate via the stage control system so that a center of the exposure region set by the variable field stop coincides with the detection center of the first focal point detection system, based on the setting information of the variable field stop, wherein the controller adjusts the first focal point detection system using the difference to perform a focusing operation.

25. A projection exposure apparatus for illuminating a mask having a pattern formed thereon with exposure light so as to expose an image of the pattern formed on the mask onto a photosensitive substrate through a projection optical system, the apparatus comprising:

a variable field stop disposed in an exposure region optical path including the photosensitive substrate, the variable field stop setting an exposure region on the photosensitive substrate where the image of the pattern is projected;

a focal point detection system that detects a focus position of the photosensitive substrate in the optical axis direction; and

a controller communicating with the variable field stop and the focal point detection system, the controller discriminating the exposure region on the photosensitive substrate based on setting information of the variable field stop and moving the exposure region on the photosensitive substrate to a predetermined exposure location after an approximate center of the exposure region is brought onto the focus position using the focal point detection system.

26. A projection exposure apparatus according to claim 25, further comprising a memory storing data on curvature of field of the projection optical system, said controller communicating with said memory and performing a focusing operation in accordance with the data on curvature of field.

27. A projection exposure apparatus according to claim 25, further comprising a second focal point detection system disposed in the exposure region optical path, the second focal point detection system discriminating an optimum imaging plane of the projection optical system and measuring data on curvature of field for a plurality of locations within the exposure region based on the setting information of the variable field stop.

28. A projection exposure apparatus according to claim 27, wherein said controller comprises structure that interpolates the data on the curvature of field using a quadratic function to a sixth-order function for locations within the exposure region other than the plurality of locations.