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Method of passivating a micromechanical device within a hermetic package

  • US 5,936,758 A
  • Filed: 05/11/1998
  • Issued: 08/10/1999
  • Est. Priority Date: 04/12/1996
  • Status: Expired due to Term
First Claim
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1. A method rendering passive a surface of a micromechanical device, comprising the steps of:

  • a) placing said micromechanical device in a package;

    b) placing a predetermined quantity of a passivant in said package;

    c) sealing said micromechanical device and said passivant from the ambient; and

    d) activating said passivant to passivate said micromechanical device with said passivant to render said micromechanical device passive.

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