Printed wiring board with mounted circuit element using a terminal density conversion board

• US 5,936,843 A
• Filed: 03/18/1998
• Issued: 08/10/1999
• Est. Priority Date: 10/14/1997
• Status: Expired due to Term

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Suzuki, Masahiro, Nishiyama, Takeshi, Ohshima, Osamu, Udagawa, Yoshiaki
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): FOSTER, DAVID A
• Application Number:
  US09/040,393
• Time in Patent Office: 510 Days
• Field of Search: 361/760, 361/763, 361/762, 361/767, 361/769, 361/744, 361/774, 361/772, 361/777, 361/784, 361/783, 361/790, 361/791, 361/792, 361/803, 361/807, 361/808, 361/809, 361/810, 257/723, 257/724, 257/737, 257/738, 257/773, 257/774, 257/780, 257/686, 257/692, 257/697, 257/698, 174/250, 174/262, 174/263, 174/266, 174/255
• US Class Current: 361/760
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15174 in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15322 being a pin array, e.g. PGA
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/049 PCB for one component, e.g. for mounting onto mother PCB
• CPC Class Codes: H05K 2201/10318 Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10477 Inverted
• CPC Class Codes: H05K 2201/10704 Pin grid array [PGA]
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 3/3426 characterised by the leads
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49208 : by assembling plural parts
• CPC Class Codes: Y10T 29/49218 : with deforming

Abstract

A method and apparatus are provided for mounting circuit elements on a printed wiring board, wherein an integrated circuit having terminals with a first interterminal pitch are mounted onto a first surface of a terminal density conversion board which converts the first interterminal pitch of the integrated circuit to terminals with a second interterminal pitch larger than the first interterminal pitch on a second surface of the terminal density conversion board; and the terminals on the second surface of the terminal density conversion board with the second interterminal pitch are mounted onto the printed wiring board.

Claims

1. A printed wiring board with mounted circuit elements, comprising:

an integrated circuit having terminals with a first interterminal pitch; and

a terminal density conversion board having;

a first surface with conductive pads spaced with the first interterminal pitch on which said integrated circuit is mounted with the terminals of said integrated circuit respectively connected to the conductive pads;

a second surface having conductive pads spaced with a second interterminal pitch larger than the first interterminal pitch; and

internal wiring respectively connecting the conductive pads on the first surface with the conductive pads on the second surface,

said terminal density conversion board being mounted on said printed wiring board with the conductive pads on the second surface of said terminal density conversion board respectively connected to conductive portions spaced with the second interterminal pitch on a surface of said printed wiring board.

2. A printed wiring board with mounted circuit elements as recited in claim 1, further including circuit elements having terminals with the second interterminal pitch mounted onto said printed wiring board at locations other than the location at which said terminal density conversion board is mounted onto said printed wiring board.

3. A printed wiring board with mounted circuit elements as recited in claim 1, further including circuit elements having terminals with the second interterminal pitch mounted onto said terminal density conversion board at locations other than the location at which said integrated circuit is mounted onto said terminal density conversion board and at locations other than the location of the conductive pads on the second surface of said terminal density conversion board connected to said printed wiring board.

4. A printed wiring board with mounted circuit elements as recited in claim 1, further including a metal soldered between the conductive pads of said terminal density conversion board and the respective conductive portions on said printed wiring board.

5. A printed wiring board with mounted circuit elements as recited in claim 1, further including pin joints connected between the conductive pads of said terminal density conversion board and the respective conductive portions on said printed wiring board.

6. A printed wiring board with mounted circuit elements as recited in claim 1, further including Z-shaped contacts disposed over the conductive portions of said printed wiring board on which the conductive pads of said terminal density conversion board are press-fitted.

7. A printed wiring board with mounted circuit elements as recited in claim 1, further including a land grid array securing said terminal density conversion board on said printed wiring board.

8. A printed wiring board with mounted circuit elements as recited in claim 1, further including a cooling device mounted onto a surface of said integrated circuit without the terminals connected to said terminal density conversion board.

9. A printed wiring board with mounted circuit elements as recited in claim 1, wherein said terminal density conversion board has a thermal expansion coefficient value between a thermal expansion coefficient of said integrated circuit and a thermal expansion coefficient of said printed wiring board.

10. A terminal density conversion board for mounting an integrated circuit on a printed wiring board, comprising:

a first surface having conductive pads spaced with a first interterminal pitch on which the integrated circuit is mounted;

a second surface having conductive pads spaced with a second interterminal pitch larger than the first interterminal pitch; and

internal wiring respectively connecting the conductive pads on said first surface with the conductive pads on said second surface,

wherein terminals with the first interterminal pitch of the integrated circuit are respectively connected to the conductive pads on said first surface of said terminal density conversion board and the conductive pads on said second surface of said terminal density conversion board are respectively connected to conductive portions spaced with the second interterminal pitch on a surface of the printed wiring board.

11. A terminal density conversion board as recited in claim 10, further including circuit elements having terminals spaced with the second interterminal pitch mounted onto said terminal density conversion board at locations other than the location at which said integrated circuit is mounted onto said terminal density conversion board and at locations other than the location of the conductive pads on said second surface of said terminal density conversion board connected to the printed wiring board.