Method of efficiently laser marking singulated semiconductor devices

• US 5,937,270 A
• Filed: 01/24/1996
• Issued: 08/10/1999
• Est. Priority Date: 01/24/1996
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micro Electronics Incorporated
• Inventors: Canella, Robert L.
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): Lebentritt, Michael S.
• Application Number:
  US08/590,919
• Time in Patent Office: 1,294 Days
• Field of Search: 437/8, 437/209, 437/925, 414/935, 414/936, 414/947, 219/121.6, 219/121.67, 219/121.68, 219/121.72, 219/121.73, 219/121.77, 219/121.82, 219/121.83, 235/385, 235/375, 438/8, 438/9, 438/15, 438/17, 101/44, 101/35
• US Class Current: 438/14
• CPC Class Codes: B23K 26/0838 by using an endless conveyor belt
• CPC Class Codes: G06K 1/126 by photographic or thermographic registration recording apparatus for measuring instruments G01D15/00
• CPC Class Codes: H01L 21/67282 Marking devices
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A laser marking apparatus and method for marking the surface of a singulated article such as a semiconductor chip are described herein. Semiconductor chips are fed along inclined, parallel tracks to a laser marking field where they are subsequently marked by a laser beam. As the laser beam is marking chips associated with one track, chips associated with other tracks that have already been marked are replaced by unmarked chips. In this manner, the laser is continually being used to mark semiconductor chips without having to wait for unmarked chips to move to the marking location.

Claims

1. A method for marking a surface of a singulated article, comprising:

positioning at least one article at a first marking location to be marked by a laser beam;

marking said at least one article at said first marking location while positioning at least a second article at a second marking location; and

marking said at least a second article at said second marking location while removing said at least one marked article from said first marking location and positioning at least a third unmarked article at said first marking location.

2. The method of claim 1, wherein said singulated article is selected from the group comprising:

a singulated packaged die, a partial wafer, or a bare singulated die.

3. The method of claim 1 further including removing said at least a second marked article from said second marking location and replacing it with at least a fourth unmarked article while said laser beam is marking at least a third article at said first marking location.

4. The method of claim 3 wherein said marking of said articles by said laser beam is alternated between said first marking location and said second marking location.

5. The method of claim 4 further including marking a group of articles positioned at one of a plurality of marking locations while replacing a group of marked articles with a like group of articles to be marked at another of a plurality of marking locations.

6. The method of claim 1 further including staging articles at a first staging location and at a second staging location before positioning said articles at said first marking location and said second marking location, respectively.

7. The method of claim 1 further including supplying articles to be marked from a supply magazine.

8. The method of claim 1 further including placing marked articles in a shipping magazine.

9. The method of claim 4 further including translating said laser beam along a linear group of articles.

10. The method of claim 1 further including removing debris from said surface of said marked article.

11. The method of claim 1 further including inspecting the quality of said marks applied to said articles.

12. The method of claim 11 further including photographing each marked article.

13. The method of claim 12 further including sending an image of each of said marked articles to a microprocessor.

14. The method of claim 13 further including comparing said images to selected marking quality control parameters.

15. The method of claim 14 further including rejecting a said article if said image of said mark thereon is not within said selected quality control parameters.