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Flexible interface structures for electronic devices

  • US 5,938,452 A
  • Filed: 09/02/1997
  • Issued: 08/17/1999
  • Est. Priority Date: 12/23/1996
  • Status: Expired due to Term
First Claim
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1. A flexible film interface comprising:

  • a flexible film;

    flexible material attached to the flexible film;

    surface metallization on the flexible material;

    the flexible film having at least one via extending therethrough to the surface metallization;

    a floating pad structure comprising floating pad metallization patterned over the flexible film opposite the flexible material and the surface metallization, a first portion of the floating pad metallization forming a central pad and a second portion of the floating pad metallization forming at least one extension from the central pad and extending into the at least one via, the floating pad structure capable of accommodating thermal and material stresses and permitting movements of the central pad independent of the surface metallization.

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