Molding thermosetting polymers onto substrates

• US 5,939,004 A
• Filed: 08/25/1997
• Issued: 08/17/1999
• Est. Priority Date: 11/30/1995
• Status: Expired due to Fees

• Current Assignee: Kiazen Design Lab, Inc.
• Original Assignee: Ubertech Products Incorporated (PVH Corp.)
• Inventors: Harrison, Donald G.
• Primary Examiner(s): DAVIS, ROBERT B
• Application Number:
  US08/920,195
• Time in Patent Office: 722 Days
• Field of Search: 425/120, 425/121, 425/125, 425/127, 425/130, 425/543, 425/548, 425/549, 425/557, 425/571, 425/572, 425/149, 425/150, 264/251, 264/257, 264/260, 264/328.6, 264/328.8, 264/328.17, 264/328.18
• US Class Current: 264/251
• CPC Class Codes: A41D 27/08 Trimmings; Ornaments
• CPC Class Codes: B29C 45/14 incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles B29C45/1671 takes precedence
• CPC Class Codes: B29C 45/164 The moulding materials being injected simultaneously
• CPC Class Codes: B29K 2083/005 LSR, i.e. liquid silicone rubbers, or derivatives thereof
• CPC Class Codes: B29K 2713/00 Use of textile products or fabrics for preformed parts, e.g. for inserts B29K2105/06 takes precedence

Abstract

An apparatus and method for molding thermosetting polymers onto clothing. The apparatus includes at least one molding device, at least one polymer supply and a control system for controlling the operation of the molding devices and polymer supplies. The molding devices include die sets having an input member and a mold. The polymer supplies supply polymers for injection into the input members of the molding devices for use in molding three dimensional bodies of polymers onto substrates such as clothing.

Claims

1. An apparatus for molding thermosetting polymers onto substrates, comprising:

at least one molding device adapted to mold at least one three dimensional body of said polymer onto at least one of said substrates;

at least one supply of said polymer adapted to supply a controlled amount of said polymer to said at least one molding device; and

wherein each molding device includes;

a die set adapted to receive said at least one supply of said polymer;

an actuator adapted to actuate said die set into and out of engagement with said at least one substrate wherein said actuator controllably actuates said die set into engagement with said at least one substrate as a function of a contact pressure between said die set and said substrate; and

a platen adapted to support and position said at least one substrate relative to said die set; and

a control system operably coupled to said at least one molding device and said at least one supply of said polymer aid adapted to control the operation of said at least one molding device and said at least one supply of said polymer.

2. The apparatus of claim 1, wherein said apparatus includes a plurality of polymer supplies adapted to provide a plurality of controlled amounts of said polymer to said at least one molding device.

3. The apparatus of claim 2, wherein said plurality of polymer supplies are adapted to provide a plurality of colors of said polymer to said at least one molding device.

4. The apparatus of claim 2, wherein said plurality of polymer supplies are adapted to provide a plurality of types of said polymer to said at least one molding device.

5. The apparatus of claim 1, wherein said apparatus includes:

a plurality of said molding devices; and

a plurality of said polymer supplies adapted to supply a plurality of controlled amounts of said polymer to each of said molding devices.

6. The apparatus of claim 5, wherein said plurality of polymer supplies are adapted to provide a plurality of colors of said polymer to each of said molding devices.

7. The apparatus of claim 5, wherein said plurality of polymer supplies are adapted to provide a plurality of types of said polymer to each of said molding devices.

8. The apparatus of claim 1, wherein said apparatus includes a plurality of molding devices.

9. The apparatus of claim 1, wherein said die set includes a heating element adapted to controllably maintain a portion of said die set within a predetermined range of temperatures.

10. The apparatus of claim 1, wherein said die set includes a cooling element adapted to controllably maintain a portion of said die set within a predetermined range of temperatures.

11. The apparatus of claim 1, wherein said die set includes:

a heating element adapted to maintain a portion of said die set within a predetermined range of temperatures; and

a cooling element adapted to maintain another portion of said die set within another range of predetermined temperatures.

12. The apparatus of claim 1, wherein said platen includes a heating element adapted to maintain a portion of said platen within a range of predetermined temperatures.

13. The apparatus of claim 12, wherein said heating element of said platen is in opposing relation to said die set during engagement of said die set with said one of said substrates.

14. The apparatus of claim 1, wherein said platen includes a cooling element adapted to maintain a portion of said platen within a range of predetermined temperatures.

15. The apparatus of claim 1, wherein said platen includes:

a heating element adapted to maintain a portion of said platen within a predetermined range of temperatures; and

a cooling element adapted to maintain another portion of said platen within another range of predetermined temperatures.

16. The apparatus of claim 1, wherein said platen includes a guide member adapted to permit said platen to be moved into and out of a position in opposing relation to said die set.

17. The apparatus of claim 1, wherein said die set includes:

an input member adapted to receive and distribute said at least one supply of said polymer; and

a mold including at least one cavity coupled to said input member, said mold adapted to receive said distribution of said at least one supply of said polymer and mold said at least one supply of said polymer onto said at least one substrate to form said at least one three dimensional body of said polymer.

18. The apparatus of claim 17, wherein said die set further includes at least one resilient member coupled between said input member and said mold.

19. The apparatus of claim 17, wherein said die set further includes at least one thermal isolation element coupled between said input member and said mold.

20. The apparatus of claim 17, wherein said die set further includes a thermal insulating plate coupled between said input member and said mold.

21. The apparatus of claim 17, wherein said input member includes a cooling element adapted to maintain a temperature of said input member within a predetermined range of temperatures.

22. The apparatus of claim 17, wherein said input member includes at least one flow control valve adapted to controllably couple said input member to one of said at least one supplies of said polymer.

23. The apparatus of claim 17, wherein said input member includes at least one selection valve adapted to controllably couple said input member to either one of said at least one supplies of said polymer or a pressure sink.

24. The apparatus of claim 17, wherein said input member includes at least one selection valve adapted to controllably couple said manifold to a vacuum source.

25. The apparatus of claim 17, wherein said input member includes at least one nozzle adapted to cooperatively interact with and distribute said at least one supply of said polymer to said mold.

26. The apparatus of claim 25, wherein said at least one nozzle includes a thermal insulating element.

27. The apparatus of claim 26, wherein said die set further includes a thermal insulating plate coupled between said input member and said mold.

28. The apparatus of claim 17, wherein said mold includes a heating element adapted to controllably maintain a temperature of said mold within a predetermined range of temperatures.

29. The apparatus of claim 17, wherein said at least one mold cavity is at least partially defined by a portion extending outward from said mold.

30. The apparatus of claim 17, wherein said input member comprise:

a manifold adapted to receive said at least one supply of said polymer; and

a runner plate coupled to said manifold, said runner plate adapted to distribute said at least one supply of said polymer.

31. The apparatus of claim 1, wherein said at least one supply of polymer comprises a supply of a first polymer and a supply of a second polymer.

32. The apparatus of claim 1, wherein said apparatus is adapted to mold a plurality of three dimensional bodies of thermosetting polymer onto a plurality of substrates substantially simultaneously.

33. The apparatus of claim 1, wherein said apparatus is adapted to mold a plurality of three dimensional bodies of thermosetting polymer onto a substrate using a plurality of different thermosetting polymers.

34. A method for molding thermosetting polymers onto substrates, comprising:

molding at least one three dimensional body of said polymer onto at least one of said substrates using at least one molding device;

supplying a controlled amount of said polymer to said at least one molding device using at least one supply of said polymer including;

receiving said at least one supply of said polymer using a die set;

actuating said die set into and out of engagement with said at least one substrate using an actuator wherein said actuator controllably actuates said die set into engagement with said at least one substrate as a function of a contact pressure between said die set and said substrate; and

supporting and positioning said at least one substrate relative to said die set using a platen;

coupling a control system operably to said at least one molding device and said at least one supply of said polymer wherein said control system is adapted to control the operation of said at least one molding device and said at least one supply of said polymer;

positioning said at least one substrate on said platen;

injecting said polymer into a mold of said die set to form said at least one three dimensional body of said polymer; and

curing said at least one three dimensional body of said polymer on said substrate.

35. The method of claim 34, further comprising:

providing a plurality of controlled amounts of said polymer to said at least one molding device using a plurality of polymer supplies.

36. The method of claim 35, further comprising:

providing a plurality of colors of said polymer to said at least one molding device using said plurality of polymer supplies.

37. The method of claim 34, further comprising:

controllably maintaining a portion of said die set within a predetermined range of temperatures using a heating element.

38. The method of claim 34, further comprising:

controllably maintaining a portion of said die set within a predetermined range of temperatures using a cooling element.

39. The method of claim 34, further comprising:

controllably maintaining a portion of said platen within a predetermined range of temperatures using a heating element.

40. The method of claim 34, further comprising:

controllably maintaining a portion of said platen within a predetermined range of temperatures using a cooling element.

41. The method of claim 34, further comprising:

receiving and distributing said at least one supply of said polymer using an input member of said die set;

coupling a mold including at least one cavity to said input member; and

receiving said distribution of said at least one supply of said polymer using said mold and molding said at least one supply of said polymer onto said at least one substrate to form said at least one three dimensional body of said polymer.

42. The method of claim 41, further comprising:

coupling at least one thermal isolation element between said input member and said mold.