Shielded surface acoustical wave package
First Claim
1. A package for an electronic device comprising:
- an electrically insulative substrate, a first surface of said electronic device being attached to a first surface of said substrate;
an electrically conductive layer contacting said substrate;
an electrically conductive adhesive bead overlying said first surface of said substrate, said adhesive bead surrounding said electronic device; and
an electrically conductive lid defiling a free space over a second surface of said electronic device, said lid being electrically connected to said electrically conductive layer by said adhesive bead, wherein said lid has one or more tabs passing through said adhesive bead, said one or more tabs being electrically conductive.
12 Assignments
0 Petitions
Accused Products
Abstract
A package for surface acoustical wave (SAW) device includes an electrically insulative substrate having a first surface with an electrically conductive layer formed thereon. A first surface of the SAW device is attached to the electrically conductive layer. An electrically conductive adhesive bead overlies the substrate first surface and surrounds the SAW device. An electrically conductive lid defines a free space over a second surface of the SAW device, the lid being electrically connected to the electrically conductive layer by the adhesive bead and one or more tabs extending from the lid through the adhesive bead to the electrically conductive layer. The electrically conductive adhesive bead, electrically conductive layer and electrically conductive lid enclose and shield the SAW device.
67 Citations
18 Claims
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1. A package for an electronic device comprising:
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an electrically insulative substrate, a first surface of said electronic device being attached to a first surface of said substrate; an electrically conductive layer contacting said substrate; an electrically conductive adhesive bead overlying said first surface of said substrate, said adhesive bead surrounding said electronic device; and an electrically conductive lid defiling a free space over a second surface of said electronic device, said lid being electrically connected to said electrically conductive layer by said adhesive bead, wherein said lid has one or more tabs passing through said adhesive bead, said one or more tabs being electrically conductive. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A package for an electronic device comprising:
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an electrically insulative substrate, a first surface of said electronic device being attached to a first surface of said substrate; an electrically conductive layer contacting said substrate; an electrically conductive adhesive bead overlying said first surface of said substrate, said adhesive bead surrounding said electronic device; and an electrically conductive lid defining a free space over a second surface of said electronic device, said lid being electrically connected to said electrically conductive layer by said adhesive bead, wherein said lid comprises a raised section integrally connected to a base section and one or more tabs extend from said base section of said lid.
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Specification