Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage

• US 5,940,679 A
• Filed: 12/22/1995
• Issued: 08/17/1999
• Est. Priority Date: 01/06/1995
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Nakamura, Yoshifumi, Tomura, Yoshihiro, Bessho, Yoshihiro
• Primary Examiner(s): Graybill, David E.
• Application Number:
  US08/577,485
• Time in Patent Office: 1,334 Days
• Field of Search: 438/18, 438/119, 438/614, 438/615, 438/15, 438/108, 438/109
• US Class Current: 438/15
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/11822 by dipping, e.g. in a solder bath
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01R 4/04 using electrically conductive adhesives

Abstract

Conductive adhesive for checking electric circuits is formed on contact electrodes of a chip package or a multi-chip module. After contact electrodes of the chip package or the multi-chip module are set on terminal electrodes of a checking device in a correct position, the chip package or the multi-chip module is mounted on the checking device, so that the contact electrodes are electrically connected to the terminal electrodes with the conductive adhesive in-between, and thus the electric circuits of the chip package or the multi-chip module are checked.

Claims

1. A method of checking an electric circuit of a chip package in which an LSI chip is mounted on a chip carrier or of a multi-chip module in which a plurality of LSI chips are mounted on a chip carrier, the chip package or multi-chip module being provided with contact electrodes, the contact electrodes being formed on a surface of the chip carrier opposite to a surface on which the LSI chip or chips is mounted, the method comprising:

forming a layer of conductive adhesive on the contact electrodes of the chip package or multi-chip module;

placing the chip package or multi-chip module in a circuit checking device having terminal electrodes, with the contact electrodes in a position corresponding to the position of the terminal electrodes of the checking device; and

checking operation of the chip package or multi-chip module after electrically connecting the contact electrodes to the terminal electrodes with the conductive adhesive.

2. The method of claim 1, further comprising the steps of:

forming soldering paste on the contact electrodes of the chip package or the multi-chip module by a printing method or a transferring method;

fixing soldering balls having a higher melting point than solder contained in said soldering paste to said contact electrodes; and

melting said soldering paste, thus forming ball-type protruded electrodes and using said ball-type protruded electrodes as said contact electrodes to which the conductive adhesive is applied.

3. The method of claim 1, wherein the conductive adhesive for checking operation is formed by a printing method or a transferring method.

4. The method of claim 1, wherein the conductive adhesive for checking operation is formed by dipping the contact electrodes in a reservoir of the conductive adhesive.

5. The method of claim 1, wherein the conductive adhesive for checking operation contains conductive filler, thermoplastic resin and solvent, the method further comprising the step of heating to drive off the solvent when the contact electrodes are in contact with the terminal electrodes of the checking device.

6. The method of claim 1, wherein the chip carrier comprises at least one substrate material selected from the group consisting of alumina, ceramics and resin.

7. The method of claim 1, wherein terminal electrodes are formed on a surface of the chip carrier for mounting the LSI chip;

wherein the contact electrodes are formed on a surface opposite to a surface formed with the LSI chip for mounting on a circuit substrate; and

wherein circuits of said terminal electrodes of the chip carrier and said contact electrodes are connected at a substrate internal conductor.

8. The method of claim 1, where terminal electrodes are formed on a surface of the chip carrier and the LSI chip is mounted on the terminal electrodes on the chip carrier with a bonding layer in-between, facing said terminal electrodes of the chip carrier.

9. The method of claim 6, wherein the bonding layer comprises at least one material selected from the group consisting of conductive adhesive, solder and anisotropic conductive material.