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Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage

  • US 5,940,679 A
  • Filed: 12/22/1995
  • Issued: 08/17/1999
  • Est. Priority Date: 01/06/1995
  • Status: Expired due to Fees
First Claim
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1. A method of checking an electric circuit of a chip package in which an LSI chip is mounted on a chip carrier or of a multi-chip module in which a plurality of LSI chips are mounted on a chip carrier, the chip package or multi-chip module being provided with contact electrodes, the contact electrodes being formed on a surface of the chip carrier opposite to a surface on which the LSI chip or chips is mounted, the method comprising:

  • forming a layer of conductive adhesive on the contact electrodes of the chip package or multi-chip module;

    placing the chip package or multi-chip module in a circuit checking device having terminal electrodes, with the contact electrodes in a position corresponding to the position of the terminal electrodes of the checking device; and

    checking operation of the chip package or multi-chip module after electrically connecting the contact electrodes to the terminal electrodes with the conductive adhesive.

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