Substrate processing system

• US 5,942,013 A
• Filed: 09/11/1997
• Issued: 08/24/1999
• Est. Priority Date: 09/13/1996
• Status: Expired due to Term

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Akimoto, Masami
• Primary Examiner(s): GRAYBILL, DAVID E
• Application Number:
  US08/928,023
• Time in Patent Office: 712 Days
• Field of Search: 29/25.01, 414/217
• US Class Current: 29/25.01
• CPC Class Codes: B05C 13/00 Means for manipulating or holding work, e.g. for separate articles B05C1/0821 takes precedence
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/67178 vertical arrangement
• CPC Class Codes: H01L 21/67754 horizontal transfer of a batch of workpieces

Abstract

A substrate processing system comprises a cassette mounting section having a plurality of cassettes arranged therein, a sub-arm mechanism for transferring the substrate into and out of the cassette within the cassette mounting section, a first transfer path of the sub-arm mechanism extending along the arrangement of the cassettes in the cassette mounting section, a process section including a heat treating section for heating or cooling the substrate and a liquid treating section in which a process liquid is applied to the substrate, a main arm mechanism for transfer of the substrate from and onto the sub-arm mechanism and from and into the process section, and a second transfer path of the main arm mechanism. The heat treating section is positioned higher than the first transfer path, interposed between the cassette mounting section and the second transfer path in respect of a horizontal plane, and comprises a plurality of compartments stacked one upon the other.

Claims

1. A substrate processing system, comprising:

a cassette mounting section having a plurality of cassettes arranged therein;

a sub-arm mechanism for transferring the substrate into and out of the cassette within said cassette mounting section;

a first transfer path of the sub-arm mechanism extending along the arrangement of the cassettes in the cassette mounting section;

a process section including a heat treating section for heating and cooling the substrate and a liquid treating section in which a process liquid is applied to the substrate;

a main arm mechanism for transferring the substrate from and onto the sub-arm mechanism and for transferring the substrate from and into the process section; and

a second transfer path of the main arm mechanism,

wherein said heat treating section is positioned higher than the first transfer path, interposed between the cassette mounting section and the second transfer path in respect of a horizontal plane, and comprises a plurality of compartments stacked one upon the other.

2. The substrate processing system according to claim 1, wherein said heat treating section is arranged above said first transfer path.

3. The substrate processing system according to claim 1, wherein said first and second transfer paths extend in a horizontal direction and arranged parallel with each other.

4. The substrate processing system according to claim 1, wherein said first transfer path extends in a horizontal direction and said second transfer path extends in a vertical direction.

5. The substrate processing system according to claim 1, wherein each of said first and second transfer paths extends straight.

6. The substrate processing system according to claim 1, wherein said liquid treating section is isolated from said heat treating section by the second transfer path.

7. The substrate processing system according to claim 1, wherein said liquid treating section is isolated from said cassette mounting section by the first and second transfer paths.

8. The substrate processing system according to claim 1, wherein a heating device for heating the substrate is housed within an upper compartment included in said heat treating section, and a cooling device for cooling the substrate is housed in a lower compartment.

9. The substrate processing system according to claim 8, wherein said upper compartments housing the heating devices are positioned higher than said liquid treating section.

10. The substrate processing system according to claim 8, wherein said upper compartments each housing the heating device are arranged adjacent to each other, and said lower compartments each housing the cooling device are arranged adjacent to each other.

11. The substrate processing system according to claim 1, wherein said liquid treating section comprises a plurality of compartments stacked one upon the other and a liquid processing device housed in each compartment for applying the process liquid to the substrate while rotating the substrate.

12. The substrate processing system according to claim 1, further comprising a relay section positioned below said heat treating section and interposed between the first and second transfer paths for assisting the delivery of the substrate from the sub-arm mechanism onto the main arm mechanism.

13. The substrate processing system according to claim 12, wherein a plurality of stages for supporting the substrate are arranged in said relay section in a direction parallel with the arranging direction of the cassettes in the cassette mounting section.

14. The substrate processing system according to claim 12, wherein said relay section is positioned right below the heating section.

15. The substrate processing system according to claim 1, wherein said sub-arm mechanism comprises a holder for holding the substrate, a vertical driving means for driving said holder in a Z-axis direction, a swing means for swinging the holder about the Z-axis, and a horizontal driving means for driving the holder within an XY plane.