Single-piece gas director for plasma reactors
First Claim
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1. Apparatus for plasma processing a workpiece comprising:
- a process chamber for housing the workpiece to be processed comprising at least a bell jar portion and a sleeve portion, the sleeve portion having side walls that define a passage for introducing a process gas into the bell jar portion;
electrodes disposed along the sleeve portion for ionizing the process gas as it flows past; and
a one-piece director for directing the gas radially towards the side walls of the sleeve portion before it flows past the electrodes.
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Abstract
Plasma etching apparatus for use in the manufacture of integrated circuit devices utilizes a one-piece director at an input of a process chamber that includes a sleeve portion and a bell jar portion. The director directs incoming process gas in the sleeve portion radially before the gas flows past electrodes used to establish a radio frequency discharge that ionizes the process gas. The one-piece director is clamped between the cap and the sleeve portion of the process chamber to eliminate the need for screws.
37 Citations
10 Claims
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1. Apparatus for plasma processing a workpiece comprising:
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a process chamber for housing the workpiece to be processed comprising at least a bell jar portion and a sleeve portion, the sleeve portion having side walls that define a passage for introducing a process gas into the bell jar portion; electrodes disposed along the sleeve portion for ionizing the process gas as it flows past; and a one-piece director for directing the gas radially towards the side walls of the sleeve portion before it flows past the electrodes. - View Dependent Claims (2, 3, 4, 5)
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6. A director for incorporation in a plasma processing apparatus that comprises a process chamber comprising at least a bell jar portion and a sleeve portion, the director comprising:
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a single integral piece comprising first, second, and third portions; the first portion being of a diameter larger than the inner diameter of the sleeve portion; the second portion being of a diameter smaller than said inner diameter so as to facilitate a close fit between the second portion and side walls of the sleeve portion; and the third portion being of a diameter smaller than that of the second portion, said third portion defining a plurality of radial openings therethrough extending from and intersecting with a central opening that extends through said first and second portions.
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7. Apparatus for plasma etching of a semiconductive wafer comprising:
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a process chamber for housing the semiconductive wafer to be etched comprising a sleeve portion, a bell jar portion, and load-lock base, the sleeve portion having side walls that define a passage therethrough for introducing an etching gas into the bell jar portion; electrodes disposed along the sleeve portion for ionizing the gas introduced into the sleeve; and one-piece director means, which is supported on a top edge of the side walls of the sleeve portion, for directing radially the process gas in the sleeve portion before it passes the electrodes for more uniform flow when it reaches a semiconductive wafer in the load-lock base. - View Dependent Claims (8, 9, 10)
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Specification