Apparatus and method for detecting defects on silicon dies on a silicon wafer
First Claim
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1. A method for detecting defects on silicon dies on a silicon wafer comprising the steps of:
- obtaining images of a sample of die matrices on said silicon wafer using an image acquisition system;
calculating a statistical die model from said sample of die matrices;
obtaining an analysis image of a die matrix on said silicon wafer using an image acquisition systemcomparing said statistical die model to said analysis image; and
determining whether said silicon dies within said analysis image have surface defects.
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Abstract
An apparatus and method for detecting defects on silicon dies on a silicon wafer (16) comprising an image acquisition system (10) and a computer (32) that determines a statistical die model by analyzing a random selection of dies (42) within a die matrix (37) and compares the statistical die model to matrices of silicon dies (38) to determine which silicon dies (38) have surface defects, is disclosed.
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Citations
11 Claims
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1. A method for detecting defects on silicon dies on a silicon wafer comprising the steps of:
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obtaining images of a sample of die matrices on said silicon wafer using an image acquisition system; calculating a statistical die model from said sample of die matrices; obtaining an analysis image of a die matrix on said silicon wafer using an image acquisition system comparing said statistical die model to said analysis image; and determining whether said silicon dies within said analysis image have surface defects. - View Dependent Claims (2, 3, 4, 5)
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6. A method for detecting defects on a silicon die on a silicon wafer comprising the steps of:
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capturing an image of said silicon die; converting said image into pixels; separating said pixels into neighborhoods; averaging said pixels within each of said neighborhoods to obtain a first average pixel value for each of said neighborhoods; obtaining a second average pixel value for each of said neighborhoods from a standardized die image; and comparing said first average pixel value with said second average pixel value to determine whether said silicon die has surface defects. - View Dependent Claims (7, 8, 9, 10, 11)
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Specification