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Apparatus and method for chamfering wafer with loose abrasive grains

  • US 5,944,584 A
  • Filed: 08/20/1997
  • Issued: 08/31/1999
  • Est. Priority Date: 08/27/1996
  • Status: Expired due to Fees
First Claim
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1. An apparatus for chamfering a periphery of a wafer with loose abrasive grains, which comprises:

  • a polisher including a circular periphery in outward appearance, and a periphery shaping edge formed on the circular periphery, said periphery shaping edge having a desired cross-sectional profile;

    a first relatively moving mechanism which moves the polisher and the wafer relatively away from or toward each other in a radial direction of the wafer so as to move the periphery shaping edge relatively away from or toward the periphery of the wafer;

    a slurry supply mechanism for supplying slurry containing suspended abrasive grains at a closest position between the polisher and the wafer; and

    a second relatively moving mechanism which moves the polisher and the wafer relatively to each other in a tangential direction at the closest position to each other with the slurry being disposed between the polisher and the wafer so as to chamfer the periphery of the wafer with loose abrasive grains.

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