Apparatus and method for chamfering wafer with loose abrasive grains

• US 5,944,584 A
• Filed: 08/20/1997
• Issued: 08/31/1999
• Est. Priority Date: 08/27/1996
• Status: Expired due to Fees

• Current Assignee: Shin-Etsu Handotai Co., Ltd. (Shin-Etsu Chemical Company Limited)
• Original Assignee: Shin-Etsu Handotai Co., Ltd. (Shin-Etsu Chemical Company Limited)
• Inventors: Toyama, Kohei
• Primary Examiner(s): Scherbel, David A.
• Assistant Examiner(s): Banks, Derris Holt
• Application Number:
  US08/914,751
• Time in Patent Office: 741 Days
• Field of Search: 451/28, 451/36, 451/37, 451/41, 451/43, 451/44, 451/60, 451/87, 451/88, 451/285, 451/288, 451/289, 451/286, 451/287, 451/547, 451/548, 125/13, 125/12, 125/11.15, 125/11.18, 125/18, 125/13.01
• US Class Current: 451/41
• CPC Class Codes: B24B 37/02 designed for working surfaces of revolution
• CPC Class Codes: B24B 57/00 Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for abrasive blasting B24C1/00, B24C7/00
• CPC Class Codes: B24B 9/065 of thin, brittle parts, e.g. semiconductors, wafers
• CPC Class Codes: B24D 13/18 with cooling provisions

Abstract

Dispersion of cracks in a crack layer across a ground surface is reduced in chamfering a semiconductor silicon wafer. The semiconductor silicon wafer is clamped by a clamp device, which is freely rotated and a polisher having the shape of a ring built in a polishing device, which is freely rotated, is disposed in a place, the polisher having a periphery shaping edge on a peripheral side surface, wherein the polishing device is moved in a radial direction of the wafer so as to position the periphery shaping edge close to the periphery of the wafer, and the wafer and the polishing device are rotated relatively to each other, while slurry containing suspension of abrasive grains is supplied to a narrow space therebetween from a slurry supply nozzle.

Claims

1. An apparatus for chamfering a periphery of a wafer with loose abrasive grains, which comprises:

a polisher including a circular periphery in outward appearance, and a periphery shaping edge formed on the circular periphery, said periphery shaping edge having a desired cross-sectional profile;

a first relatively moving mechanism which moves the polisher and the wafer relatively away from or toward each other in a radial direction of the wafer so as to move the periphery shaping edge relatively away from or toward the periphery of the wafer;

a slurry supply mechanism for supplying slurry containing suspended abrasive grains at a closest position between the polisher and the wafer; and

a second relatively moving mechanism which moves the polisher and the wafer relatively to each other in a tangential direction at the closest position to each other with the slurry being disposed between the polisher and the wafer so as to chamfer the periphery of the wafer with loose abrasive grains.

2. An apparatus for chamfering a periphery of a wafer with loose abrasive grains according to claim 1, wherein the slurry supply mechanism is a slurry supply nozzle disposed near both of the periphery shaping edge and the periphery of the wafer.

3. An apparatus for chamfering a periphery of a wafer with loose abrasive grains according to claim 1, wherein the slurry supply mechanism comprises slurry paths formed in the polisher and directed toward the periphery shaping edge, and the paths having openings at the periphery shaping edge.

4. An apparatus for chamfering a periphery of a wafer with loose abrasive grains according to claim 1, further comprising an abrasive recovery system that collects used slurry fed from the slurry supply mechanism and recovers loose abrasive grains in a collected slurry by separation to re-cycle the recovered loose abrasive grains as a suspension in a grinding fluid.

5. An apparatus for chamfering a periphery of a wafer with loose abrasive grains according to claim 4, wherein the abrasive recovery system is a fluid cyclone classifier.

6. An apparatus for chamfering a periphery of a wafer with loose abrasive grains according to claim 1, further comprising a third relatively moving mechanism which moves the polisher and the wafer relatively toward or away from each other in a vertical direction.

8. An apparatus for chamfering a periphery of a wafer with loose abrasive grains according to claim 1, wherein the second relatively moving mechanism comprises at least one of a wafer rotating mechanism which rotates the wafer about a central axis of the wafer, and a polisher rotating mechanism which rotates the polisher about a central axis of the polisher.

9. An apparatus for chamfering a periphery of a wafer with loose abrasive grains according to claim 8, wherein a plurality of slits are formed at a constant distance between a pair of adjoining slits of the plurality of slits along the entire outer peripheral length of the periphery shaping edge so as to facilitate escaping off of used slurry on the periphery shaping edge.

12. An apparatus for chamfering a periphery of a wafer with loose abrasive grains according to claim 2, wherein the slurry supply mechanism is a slurry supply nozzle disposed near both of the periphery shaping edge and the periphery of the wafer.

14. An apparatus for chamfering a periphery of a wafer with loose abrasive grains according to claim 2, further comprising an abrasive recovery system that collects used slurry fed from the slurry supply mechanism and recovers loose abrasive grains in a collected slurry by separation to re-cycle the recovered loose abrasive grains as a suspension in a grinding fluid.

15. An apparatus for chamfering a periphery of a wafer with loose abrasive grains according to claim 14, wherein the abrasive recovery system is a fluid cyclone classifier.

7. An apparatus for chamfering a periphery of a wafer with loose abrasive grains, which comprises:

a polisher including an outer periphery, a concave circular arc portion on the outer periphery in conformity with the curvature of a wafer to be chamfered, and a periphery shaping edge formed on an outer peripheral side surface, said peripheral shaping edge has a desired cross-sectional profile;

a first relatively moving mechanism which moves the polisher and the wafer relatively away from or toward each other in a radial direction of the wafer so as to move the periphery shaping edge relatively away from or toward the periphery of the wafer;

a slurry supply mechanism for supplying slurry containing suspended abrasive grains at a closest position between the polisher and the wafer; and

a second relatively moving mechanism which moves the polisher and the wafer relative to each other with the slurry disposed between the polisher and the wafer so as to chamfer the periphery of the wafer with loose abrasive grains.

10. An apparatus for chamfering a periphery of a wafer with loose abrasive grains according to claim 7, wherein the second relatively moving mechanism comprises at least one of a wafer rotating mechanism which rotates the wafer about a central axis of the wafer, and a polisher rotating mechanism which rotates the polisher about a central axis of the polisher.

11. An apparatus for chamfering a periphery of a wafer with loose abrasive grains according to claim 10, wherein a plurality of slits are formed at a constant distance between a pair of adjoining slits of the plurality of slits along the entire outer peripheral length of the periphery shaping edge so as to facilitate escaping off of used slurry on the periphery shaping edge.

13. An apparatus for chamfering a periphery of a wafer with loose abrasive grains according to claim 7, wherein the slurry supply mechanism comprises slurry paths formed in the polisher and directed toward the periphery shaping edge, and the paths having openings at the periphery shaping edge.

16. An apparatus for chamfering a periphery of a wafer with loose abrasive grains according to claim 7, wherein the second relatively moving mechanism moves the polisher and the wafer relatively toward or away from each other in a vertical direction.

17. A method for chamfering a periphery of a wafer with loose abrasive grains, comprising:

moving a wafer so that a periphery of the wafer is positioned close to a periphery shaping edge of a polisher having a desired section profile, the periphery shaping edge being formed on an outer peripheral side surface of the polisher;

supplying a slurry containing suspension of loose abrasive grains to a space between the periphery shaping edge and the periphery of the wafer; and

effecting relative movements between the periphery shaping edge and the periphery of the wafer with the slurry disposed in the space so as to chamfer the periphery of the wafer with loose abrasive grains.

18. A method for chamfering a periphery of a wafer with loose abrasive grains according to claim 17, further comprising positioning a plurality of wafers along the periphery of the polisher in a surrounding relationship and chamfering the plurality of wafers concurrently or one by one in succession.

19. The method for chamfering a periphery of a wafer with loose abrasive grains according to claim 17, wherein the relative movements between the periphery shaping edge and the periphery of the wafer include relative radial movements, relative vertical movements, and relative tangential movements, between the periphery shaping edge and the periphery of the wafer.