Apparatus and method for chamfering wafer with loose abrasive grains
First Claim
1. An apparatus for chamfering a periphery of a wafer with loose abrasive grains, which comprises:
- a polisher including a circular periphery in outward appearance, and a periphery shaping edge formed on the circular periphery, said periphery shaping edge having a desired cross-sectional profile;
a first relatively moving mechanism which moves the polisher and the wafer relatively away from or toward each other in a radial direction of the wafer so as to move the periphery shaping edge relatively away from or toward the periphery of the wafer;
a slurry supply mechanism for supplying slurry containing suspended abrasive grains at a closest position between the polisher and the wafer; and
a second relatively moving mechanism which moves the polisher and the wafer relatively to each other in a tangential direction at the closest position to each other with the slurry being disposed between the polisher and the wafer so as to chamfer the periphery of the wafer with loose abrasive grains.
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Accused Products
Abstract
Dispersion of cracks in a crack layer across a ground surface is reduced in chamfering a semiconductor silicon wafer. The semiconductor silicon wafer is clamped by a clamp device, which is freely rotated and a polisher having the shape of a ring built in a polishing device, which is freely rotated, is disposed in a place, the polisher having a periphery shaping edge on a peripheral side surface, wherein the polishing device is moved in a radial direction of the wafer so as to position the periphery shaping edge close to the periphery of the wafer, and the wafer and the polishing device are rotated relatively to each other, while slurry containing suspension of abrasive grains is supplied to a narrow space therebetween from a slurry supply nozzle.
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Citations
19 Claims
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1. An apparatus for chamfering a periphery of a wafer with loose abrasive grains, which comprises:
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a polisher including a circular periphery in outward appearance, and a periphery shaping edge formed on the circular periphery, said periphery shaping edge having a desired cross-sectional profile; a first relatively moving mechanism which moves the polisher and the wafer relatively away from or toward each other in a radial direction of the wafer so as to move the periphery shaping edge relatively away from or toward the periphery of the wafer; a slurry supply mechanism for supplying slurry containing suspended abrasive grains at a closest position between the polisher and the wafer; and a second relatively moving mechanism which moves the polisher and the wafer relatively to each other in a tangential direction at the closest position to each other with the slurry being disposed between the polisher and the wafer so as to chamfer the periphery of the wafer with loose abrasive grains. - View Dependent Claims (2, 3, 4, 5, 6, 8, 9, 12, 14, 15)
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7. An apparatus for chamfering a periphery of a wafer with loose abrasive grains, which comprises:
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a polisher including an outer periphery, a concave circular arc portion on the outer periphery in conformity with the curvature of a wafer to be chamfered, and a periphery shaping edge formed on an outer peripheral side surface, said peripheral shaping edge has a desired cross-sectional profile; a first relatively moving mechanism which moves the polisher and the wafer relatively away from or toward each other in a radial direction of the wafer so as to move the periphery shaping edge relatively away from or toward the periphery of the wafer; a slurry supply mechanism for supplying slurry containing suspended abrasive grains at a closest position between the polisher and the wafer; and a second relatively moving mechanism which moves the polisher and the wafer relative to each other with the slurry disposed between the polisher and the wafer so as to chamfer the periphery of the wafer with loose abrasive grains. - View Dependent Claims (10, 11, 13, 16)
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17. A method for chamfering a periphery of a wafer with loose abrasive grains, comprising:
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moving a wafer so that a periphery of the wafer is positioned close to a periphery shaping edge of a polisher having a desired section profile, the periphery shaping edge being formed on an outer peripheral side surface of the polisher; supplying a slurry containing suspension of loose abrasive grains to a space between the periphery shaping edge and the periphery of the wafer; and effecting relative movements between the periphery shaping edge and the periphery of the wafer with the slurry disposed in the space so as to chamfer the periphery of the wafer with loose abrasive grains. - View Dependent Claims (18, 19)
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Specification