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Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor

  • US 5,944,857 A
  • Filed: 05/08/1997
  • Issued: 08/31/1999
  • Est. Priority Date: 05/08/1997
  • Status: Expired due to Term
First Claim
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1. A method of transferring wafers between multi-wafer carriers and a high vacuum environment of a transfer chamber of a wafer processing cluster tool, the method comprising the steps of:

  • positioning a first multi-wafer carrier in communication with a clean atmospheric environment adjacent to a robot transfer device that is located in an atmospheric front end of the tool;

    thentransferring a first individual wafer with the robot transfer device from the first carrier and into a first single-wafer loadlock, operating as an inbound loadlock, that is open to the atmospheric environment and sealed from the high vacuum environment of the transfer chamber;

    thensealing the first loadlock from the atmospheric environment;

    thenpumping the first loadlock to a vacuum pressure level;

    thenopening the first loadlock to the high vacuum environment;

    thenremoving the first wafer from the first loadlock with a transfer arm located in the transfer chamber and placing the first wafer into a vacuum processing chamber when in communication with the high vacuum environment;

    thenremoving the first wafer with a transfer arm from a vacuum processing chamber when in communication with the high vacuum environment and placing the first wafer into the first or a second single-wafer loadlock, operating as an outbound loadlock, that is open to the high vacuum environment and sealed from the atmospheric environment;

    thensealing the outbound loadlock from the high vacuum environment;

    thenventing the outbound loadlock to a pressure level of the atmospheric environment;

    thenopening the outbound loadlock to the atmospheric environment;

    thentransferring the first wafer from the outbound loadlock to the carrier.

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