Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor
First Claim
1. A method of transferring wafers between multi-wafer carriers and a high vacuum environment of a transfer chamber of a wafer processing cluster tool, the method comprising the steps of:
- positioning a first multi-wafer carrier in communication with a clean atmospheric environment adjacent to a robot transfer device that is located in an atmospheric front end of the tool;
thentransferring a first individual wafer with the robot transfer device from the first carrier and into a first single-wafer loadlock, operating as an inbound loadlock, that is open to the atmospheric environment and sealed from the high vacuum environment of the transfer chamber;
thensealing the first loadlock from the atmospheric environment;
thenpumping the first loadlock to a vacuum pressure level;
thenopening the first loadlock to the high vacuum environment;
thenremoving the first wafer from the first loadlock with a transfer arm located in the transfer chamber and placing the first wafer into a vacuum processing chamber when in communication with the high vacuum environment;
thenremoving the first wafer with a transfer arm from a vacuum processing chamber when in communication with the high vacuum environment and placing the first wafer into the first or a second single-wafer loadlock, operating as an outbound loadlock, that is open to the high vacuum environment and sealed from the atmospheric environment;
thensealing the outbound loadlock from the high vacuum environment;
thenventing the outbound loadlock to a pressure level of the atmospheric environment;
thenopening the outbound loadlock to the atmospheric environment;
thentransferring the first wafer from the outbound loadlock to the carrier.
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Abstract
Wafers from plural non-vacuum multiple wafer carriers are loaded and unloaded in an atmospheric front end of a wafer processing machine and transferred to and from the high vacuum chamber of a transfer module of a wafer manufacturing cluster tool through a plurality of single wafer loadlocks. Preferably, with the wafers oriented horizontally throughout, wafers are moved inbound to the high vacuum atmosphere through one loadlock and moved outbound through another loadlock, the outbound loadlock also actively cooling the wafer. In both the atmospheric and vacuum environments, transfer arms load and unload the loadlocks as often as possible when the other loadlock or loadlocks are sealed, and transfer wafers within the environments when all loadlocks are sealed. Preferably, the wafers are actively cooled in the outbound loadlock. Preferably also, wafers are passed through a wafer aligner after being removed from a carrier and before placed in a loadlock. When wafers from one of the carriers are being moved to and from loadlocks, another of the carriers of processed wafers is being exchanged with a carrier of unprocessed wafers.
115 Citations
23 Claims
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1. A method of transferring wafers between multi-wafer carriers and a high vacuum environment of a transfer chamber of a wafer processing cluster tool, the method comprising the steps of:
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positioning a first multi-wafer carrier in communication with a clean atmospheric environment adjacent to a robot transfer device that is located in an atmospheric front end of the tool;
thentransferring a first individual wafer with the robot transfer device from the first carrier and into a first single-wafer loadlock, operating as an inbound loadlock, that is open to the atmospheric environment and sealed from the high vacuum environment of the transfer chamber;
thensealing the first loadlock from the atmospheric environment;
thenpumping the first loadlock to a vacuum pressure level;
thenopening the first loadlock to the high vacuum environment;
thenremoving the first wafer from the first loadlock with a transfer arm located in the transfer chamber and placing the first wafer into a vacuum processing chamber when in communication with the high vacuum environment;
thenremoving the first wafer with a transfer arm from a vacuum processing chamber when in communication with the high vacuum environment and placing the first wafer into the first or a second single-wafer loadlock, operating as an outbound loadlock, that is open to the high vacuum environment and sealed from the atmospheric environment;
thensealing the outbound loadlock from the high vacuum environment;
thenventing the outbound loadlock to a pressure level of the atmospheric environment;
thenopening the outbound loadlock to the atmospheric environment;
thentransferring the first wafer from the outbound loadlock to the carrier. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of manufacturing a semiconductor wafer comprising the steps of:
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positioning a first carrier in communication with a clean atmospheric environment adjacent a robot transfer device that is located in an atmospheric front end of a wafer processing tool;
thentransferring a first individual wafer with the robot transfer device from the first carrier and into a first single-wafer loadlock that is open to the atmospheric environment and sealed from the high vacuum environment of the transfer chamber;
thensealing the first loadlock from the atmospheric environment;
thenpumping the first loadlock to a vacuum pressure level;
thenopening the first loadlock to the high vacuum environment;
thenremoving the first wafer from the first loadlock with a transfer arm located in the transfer chamber and placing the first wafer into a vacuum processing chamber when in communication with the high vacuum environment;
thenprocessing the wafer in the processing chamber;
thenremoving the first wafer with a transfer arm from a vacuum processing chamber when in communication with the high vacuum environment and placing the first wafer into the first or a second single-wafer loadlock, operating as an outbound loadlock, that is open to the high vacuum environment and sealed from the atmospheric environment;
thensealing the outbound loadlock from the high pressure environment;
thenventing the outbound loadlock to a pressure level of the atmospheric environment;
thenopening the outbound loadlock to the atmospheric environment;
thentransferring the first wafer from the second loadlock to the carrier. - View Dependent Claims (11)
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12. A high vacuum wafer processing apparatus comprising:
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a plurality of vacuum processing chambers having a port therein for loading and unloading wafers individually there through; a high vacuum transfer chamber having a plurality of ports communicatable with the ports of the processing chambers; an atmospheric front end chamber having at least one carrier loading and unloading door; a plurality of single wafer loadlock chambers, each having an access opening therein between the high vacuum transfer chamber and the front end chamber, each loadlock having a vacuum side closure selectively openable between the opening and the high vacuum transfer chamber and an atmospheric side closure selectively openable between the opening and the front end chamber; a plurality of carrier stations in the front end chamber configured to support a multiple-wafer carrier thereat; a transfer arm in the high vacuum transfer chamber having a single-wafer engaging element thereon moveable to and from each of the processing chambers and loadlocks; and a wafer transfer device in the front end chamber moveable among the loadlocks and the carriers. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification