Polyarylene sulfide and a composition thereof

• US 5,945,490 A
• Filed: 11/10/1997
• Issued: 08/31/1999
• Est. Priority Date: 04/02/1996
• Status: Expired due to Term

• Current Assignee: Dainippon Ink and Chemicals Incorporated
• Original Assignee: Tonen Chemical Corp. (ENEOS Holdings, Inc.)
• Inventors: Tsuda, Takashi, Komiyama, Osamu
• Primary Examiner(s): KRASS, FREDERICK F
• Application Number:
  US08/952,286
• Time in Patent Office: 659 Days
• Field of Search: 525/537, 528/373, 528/388, 528/486, 528/488, 528/489, 528/492, 528/499, 528/502 A
• US Class Current: 525/537
• CPC Class Codes: C08G 75/0254 using metal sulfides
• CPC Class Codes: C08K 5/54 Silicon-containing compounds C08K5/0091 takes precedence
• CPC Class Codes: C08L 81/02 Polythioethers; Polythioether-ethers

Abstract

Polyarylene sulfide (PAS) is disclosed, of which extract with methylene chloride is in an amount of not more than 0.7% by weight, a melt viscosity V₆ is 20 to 15,000 poises and a content of --SX groups is at least 15 micro moles/g, wherein X represents an alkali metal or a hydrogen atom. The PAS is prepared as follows: an alkali metal sulfide is reacted with a dihaloaromatic compound in an organic amide solvent, while a part of a gaseous phase in a reactor is condensed by cooling a gaseous phase part of the reactor to return the condensed liquid to a liquid phase; and the polyarylene sulfide thus prepared is washed with an organic solvent and then with water. The present invention also provides a composition comprising 100 parts by weight of (A) the aforesaid PAS and 0.01 to 5.0 parts by weight of (B) at least a silane compound selected from the group consisting of methacryloxysilane compounds, ureidosilane compounds and epoxy silane compounds.

Claims

1. A composition comprising 100 parts by weight of (A) a polyarylene sulfide and 0.01 to 5.0 parts by weight of (B) at least one silane compound, characterized in that the polyarylene sulfide comprises methylene chloride extractable components in an amount of not more than 0.7% by weight, has a melt viscosity, V₆, of 20 to 15,000 poises and a content of --SX groups of at least 15 micro moles/g, wherein X represents an alkali metal or a hydrogen atom, the silane compound being selected from the group consisting of methacryloxy silane compounds, ureido silane compounds and epoxy silane compounds.

2. The composition claimed in claim 1, wherein the composition further comprises an inorganic filler in an amount of at most 400 parts by weight per 100 parts by weight of the polyarylene sulfide.

3. The composition claimed in claim 2, wherein the amount of the inorganic filler is 0.01 to 200 parts by weight per 100 parts by weight of the polyarylene sulfide.

4. The composition claimed in claim 1, wherein the amount of (B) the silane compound is 0.05 to 3.0 parts by weight.

5. The composition claimed in claim 1, wherein the mount of (B) the silane compound is 0.1 to 2.0 parts by weight.

6. The composition claimed in claim 1, wherein the silane compound (B) is a coupling agent.

7. The composition claimed in claim 1, wherein the silane compound (B) is selected from the group consisting of methacryloxy silane compounds and ureido silane compounds.

8. The composition claimed in claim 1, wherein the methacryloxy silane compounds are selected from the group consisting of gamma-methacryloxypropyltrimethoxysilane, gamma-methacryloxypropyltriethoxysilane, gamma-methacryloxypropylmethyldiethoxysilane and gamma-methacryloxypropylmethyldimethoxysilane.

9. The composition claimed in claim 1, wherein the ureido silane compounds are selected from the group consisting of gamma-ureidopropyltriethoxy silane, gamma-ureidopropyltrimethoxy silane and gamma-(2-ureido ethyl)aminopropyltrimethoxysilane.

10. The composition claimed in claim 1, wherein the epoxy silane compounds are selected from the group consisting of gamma-glycidoxypropyltrimethoxysilane, gamma-glycidoxypropyltriethoxysilane, beta-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, gamma-glycidoxypropylmethyldiethoxysilane and gamma-glycidoxypropylmethyldimethoxysilane.

11. A molded article having a weld part, obtained by injection molding the composition claimed in claim 1, wherein the silane compound (B) is an epoxy silane compound.

12. The molded article claimed in claim 11, wherein the composition further comprises an inorganic filler in an amount of at most 400 parts by weight per 100 parts by weight of the polyarylene sulfide.

13. The molded article claimed in claim 11, wherein the composition further comprises an inorganic filler in an amount of 0.01 to 200 parts by weight per 100 parts by weight of the polyarylene sulfide.

14. The molded article claimed in claim 11, wherein the epoxy silane compounds are selected from the group consisting of gamma-glycidoxypropyltrimethoxysilane, gamma-glycidoxypropyltriethoxysilane, beta-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, gamma-glycidoxypropylmethyldiethoxysilane and gamma-glycidoxypropylmethyldimethoxysilane.

15. The molded article claimed in of claim 11, wherein the injection molding is carried out by injecting the composition into a mold through at least two gates per one molded article.