Sensor assembly with sensor boss mounted on substrate

• US 5,945,605 A
• Filed: 11/19/1997
• Issued: 08/31/1999
• Est. Priority Date: 11/19/1997
• Status: Expired due to Term

• Current Assignee: Honeywell International Inc.
• Original Assignee: Sensym Inc.
• Inventors: Cartsonas, Christos D., Hui, Raymond P., Julian, Francis S., Hoffman, James H.
• Primary Examiner(s): FELBER, JOSEPH LEON
• Application Number:
  US08/974,005
• Time in Patent Office: 650 Days
• Field of Search: 73/727, 73/726, 73/861.47, 73/493, 73/724, 374/147, 374/178, 257/419, 257/420, 438/50, 438/51, 438/52, 438/53, 361/283.4, 338/42
• US Class Current: 73/727
• CPC Class Codes: G01L 19/04 Means for compensating for effects of changes of temperature , i.e. other than electric compensation
• CPC Class Codes: G01L 19/0627 Protection against aggressive medium in general
• CPC Class Codes: G01L 19/145 with stress relieving means
• CPC Class Codes: G01L 19/148 Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A non-invasive sensor assembly device includes a pedestal mounted sensor die for stress isolation of the sensor die from external stresses, a substrate and die porting configuration to limit exposure of the sensor assembly to only the interior of the sensor die and a connecting tube to provide significant isolation of the sensor assembly and its constituent parts from the fluid stream, and an inert coating conformally deposited on the inside surfaces of the die, pedestal, and connecting tube that are in contact with the fluid media to thereby provide complete isolation of the sensor assembly from the media. The pedestal is fabricated on the substrate by screening multiple layers of conductive ink on the substrate, flashing off the solvents, and firing the substrate to burn off the binders to provide a boss of sufficient height such that the sensor die, once mounted on the boss, is substantially isolated from the substrate and, therefore, from included stresses that might otherwise have been transferred to the die from the substrate. The contact area of the boss with the die is optimally selected to provide maximum stress isolation and sufficient mounting strength. A through hole in the substrate and through the longitudinal center of the boss is in cooperative coaxial alignment with a fluid entry port in the die to permit measurement of the physical characteristic of interest within the interior of the die.

Claims

1. A sensor assembly comprising:

a) a substrate having a top surface and a bottom surface;

b) a boss formed on said substrate and bonded to said substrate, said boss extending from said top surface of said substrate to terminate in a planar distal end;

c) a sensor die having a bottom surface, and a top surface, at least a portion of said sensor die bottom surface being bonded to said distal end of said boss;

wherein said sensor die defines a hollow region in said sensor die, and at least one port to permit fluid communication to said hollow region, and wherein said substrate defines at least one through-hole extending from said bottom surface of said substrate and approximately coaxial with a longitudinal axis of said boss, and terminating in cooperative coaxial alignment with said port thereby to permit fluid communication of said through-hole with said port;

wherein said hollow region includes an interior surface and said through-hole includes an interior surface, said sensor assembly further comprising a prophylactic coating deposited on said interior surfaces thereby to substantially isolate said interior surfaces from media disposed within said hollow region and said through-hole.

2. A sensor assembly as in claim 1 wherein said portion of said sensor die bottom surface bonded to said boss distal end is less than about 50% of the total surface area of said sensor die bottom surface.

3. A sensor assembly as in claim 1 wherein said boss comprises a different material than said substrate.

4. A sensor assembly as in claim 3 wherein said boss comprises a material selected from the group consisting of glass, ceramic, metal, sintered metal, silicon, silicon oxide, silicon nitride, silicones, thermosetting polymers, sinterable metals, glass, and ceramic inks, sinterable glass, ceramic, and metal pastes, and combinations thereof.

5. A sensor assembly as in claim 4 wherein said boss is formed from a metal ink.

6. A sensor assembly as in claim 1 wherein said prophylactic coating is selected from the group consisting of silicon dioxide, silicon nitride, polymerized para-xylylene, fluorocarbon polymers, insoluble metal halide salts, and combinations thereof.

7. A sensor assembly as in claim 6 further comprising at least one sampling tube mounted to said substrate bottom surface, said sampling tube defining an open hollow region therein, said sampling tube hollow region being in cooperative, coaxial alignment and in fluid communication with said through-hole.

8. A sensor assembly as in claim 7 wherein said sampling tube hollow region includes an interior surface, said sampling tube interior surface having a prophylactic coating deposited thereon thereby to substantially isolate said sampling tube interior surface from media disposed in said sampling tube hollow region.

9. A substrate for mounting a sensor die thereon, and comprising a boss layer, said boss layer formed on a portion of a top surface of said substrate to provide a rigid, raised structure having a height sufficient to permit attachment of the sensor die thereon in remote, fixed spatial alignment with the substrate, wherein said boss layer is formed of a metal ink and defines a boss relief of at least 50 microns.

10. The substrate of claim 9 wherein said boss layer includes a distal surface for attachment to a bottom surface of the sensor die, said distal surface having an area equal to less than about 50% of said bottom surface of the sensor die.

11. The substrate of claim 10 wherein said distal surface of said boss layer comprises a metal layer to permit solder attachment of said distal surface to the sensor die, the sensor die includes a cooperating opposite solderable surface to permit solder attachment to said boss layer distal surface.

12. The substrate of claim 9 wherein the substrate defines at least one through-hole extending from a bottom surface of said substrate and approximately coaxial with a longitudinal axis of said boss layer, and terminating at said distal surface to permit communication of a fluid through said through-hole.

13. The substrate of claim 9 wherein said boss layer is formed from a material different from the substrate, said material selected from the group consisting of glass, ceramic, metal, sintered metal, silicon, silicon oxide, silicon nitride, silicones, thermosetting polymers, and sinterable metals, glass, and ceramic inks, and sinterable glass, ceramic, and metal pastes, and combinations thereof.

14. The substrate of claim 13 wherein said material is a metal ink.

15. A sensor module for measuring a characteristic of a fluid media comprising:

a) a sensor assembly comprising;

i) a sensor die defining an enclosed hollow region disposed therein for receiving the media, and at least one port to permit fluid communication with said sensor die hollow region, wherein said sensor die includes a transducer responsive to the characteristic of the media disposed in said sensor die hollow region;

ii) a substrate comprising a boss formed on a portion of a top surface of said substrate, said boss extending from said top surface of said substrate and including a distal surface for attachment to a bottom surface of said sensor die, said substrate defining at least one through-hole for conveying media to said hollow region of said sensor die, the through-hole extending from a bottom surface of said substrate and approximately coaxial with a longitudinal axis of said boss, and terminating at said distal surface in cooperative coaxial alignment and in fluid communication with said sensor die port; and

iii) a sampling tube, extending from a bottom surface of said substrate and in coaxial alignment with said through-hole thereby to permit attachment of the sensor module to a fluid media stream;

b) connections for electrical communication to the sensor module

c) a housing to enclose said sensor assembly; and

d) a prophylactic coating disposed on interior surfaces of at least one of said sensor die, said through hole, and said sampling tube thereby to isolate the sensor module from the media.

16. A sensor module as in claim 15 wherein said prophylactic coating is selected from the group consisting of silicon dioxide, silicon nitride, polymerized para-xylylene, fluorocarbon polymers, and combinations thereof.

17. A sensor module as in claim 16 wherein said prophylactic coating is polymerized para-xylylene.

18. A sensor module of claim 15 wherein said boss is formed from a material different from said substrate, said material selected from the group consisting of glass, ceramic, metal, sintered metal, silicon, silicon oxide, silicon nitride, silicones, thermosetting polymers, and sinterable metals, glass, and ceramic inks, and sinterable glass, ceramic, and metal pastes, and combinations thereof.

19. A sensor module as in claim 18 wherein said material is a metal ink.

20. A sensor module as in claim 15 wherein said distal surface of said boss comprises a metal layer to permit solder attachment of said distal surface to said sensor die, and said sensor die includes a cooperating opposite solderable surface thereby to permit solder attachment to said boss distal surface.

21. A method for environmentally isolating an interior of a sensor assembly, comprising the acts of:

a) providing a sensor die defining a hollow region therein for receiving a media, and having at least one port on the bottom surface of said sensor die for permitting fluid communication of the media with said hollow region;

b) providing a substrate;

c) forming a boss on said substrate, said boss having a distal surface, and said substrate defining at least one through-hole extending through said substrate, approximately centrally, coaxially through said boss and terminating at said distal surface;

d) bonding the bottom surface of said sensor die to said distal surface of said boss, whereby the through-hole is in cooperative coaxial alignment with the sensor die port thereby permitting media to enter the hollow region in the sensor die by way of the through-hole; and

e) coating the interior surface of at least one of the sensor die hollow region, the through hole, and the sampling region thereby to substantially isolate the sensor assembly from the media.

22. The method of claim 21 further comprising the act of bonding a sampling tube to the bottom surface of the substrate to permit connection of the sensor assembly to a media stream.

23. A method for environmentally isolating an interior of a sensor assembly, comprising the acts of:

a) providing a sensor die defining a hollow region therein for receiving a media, and having at least one port on the bottom surface of said sensor die thereby permitting a fluid communication of the media with said hollow region;

b) providing a substrate;

c) forming a boss on said substrate, said boss having a distal surface, said substrate defining at least one through-hole extending through said substrate, approximately centrally, coaxially through said boss and terminating at the distal surface;

d) bonding the bottom surface of the sensor die to said distal surface of said boss, whereby the through-hole is in cooperative coaxial alignment with the sensor die port thereby permitting media to enter the hollow region in the sensor die by way of the through-hole; and

e) printing said boss onto said substrate to a thickness sufficient to provide a boss relief of at least 50 microns.