×

Heat pipe with embedded wick structure

  • US 5,947,193 A
  • Filed: 12/15/1997
  • Issued: 09/07/1999
  • Est. Priority Date: 01/29/1996
  • Status: Expired due to Term
First Claim
Patent Images

1. A heat pipe system for removing heat from a heat source comprising:

  • a) a substrate;

    b) a wick structure on a surface of the substrate wherein the length is not less than the width, comprising a plurality of semiclosed channels,i) wherein each channel is characterized by a channel width and a channel length not less than the channel width, andii) wherein every channel length is less than five times the corresponding channel width;

    c) a cap sealably mounted with the substrate so that the wick structure and the cap enclose a volume, the cap further comprising a vapor channel that allows vapor to flow from one region of the cap to another region of the cap;

    d) a fluid within the volume.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×