Heat pipe with embedded wick structure

• US 5,947,193 A
• Filed: 12/15/1997
• Issued: 09/07/1999
• Est. Priority Date: 01/29/1996
• Status: Expired due to Term

• Current Assignee: National Technology & Engineering Solutions Of Sandia LLC (Honeywell International Inc.)
• Original Assignee: Sandia Corporation (Martin Marietta Corporation)
• Inventors: Tuck, Melanie R., Shen, David S., Palmer, David W., Grafe, V. Gerald, Adkins, Douglas Ray
• Primary Examiner(s): Lazarus, Ira S.
• Assistant Examiner(s): ATKINSON, CHRISTOPHER MARK
• Application Number:
  US08/990,555
• Time in Patent Office: 631 Days
• Field of Search: 165/104.26, 165/104.33, 126/96, 126/45, 257/715, 361/700
• US Class Current: 165/104.26
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/04 with tubes having a capillary structure
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure

Abstract

A heat pipe has an embedded wick structure that maximizes capillary pumping capability. Heat from attached devices such as integrated circuits evaporates working fluid in the heat pipe. The vapor cools and condenses on a heat dissipation surface. The condensate collects in the wick structure, where capillary pumping returns the fluid to high heat areas.

Claims

1. A heat pipe system for removing heat from a heat source comprising:

a) a substrate;

b) a wick structure on a surface of the substrate wherein the length is not less than the width, comprising a plurality of semiclosed channels,

i) wherein each channel is characterized by a channel width and a channel length not less than the channel width, and

ii) wherein every channel length is less than five times the corresponding channel width;

c) a cap sealably mounted with the substrate so that the wick structure and the cap enclose a volume, the cap further comprising a vapor channel that allows vapor to flow from one region of the cap to another region of the cap;

d) a fluid within the volume.

2. The heat pipe of claim 1 where the cap is mounted to the substrate by boron-phosphorous-silicate-glass bonding.

3. The heat pipe of claim 1 further comprising a plurality of vapor channels in the cap.

4. The heat pipe of claim 1 further comprising means for mounting a heat dissipation device to the cap.

5. The heat pipe of claim 1 wherein the fluid is chosen from:

alcohol, freon, water, acetone.