Laser beam machining method

• US 5,948,289 A
• Filed: 11/25/1996
• Issued: 09/07/1999
• Est. Priority Date: 11/29/1995
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Noda, Kyoji, Uchinami, Shunichi
• Primary Examiner(s): MILLS, GREGORY L
• Application Number:
  US08/755,164
• Time in Patent Office: 1,016 Days
• Field of Search: 219/121.61, 219/121.68, 219/121.69, 219/121.73, 264/400
• US Class Current: 219/121.69
• CPC Class Codes: B23K 26/066 by using masks
• CPC Class Codes: B23K 26/362 Laser etching
• CPC Class Codes: B33Y 30/00 Apparatus for additive manufacturing; Details thereof or accessories therefor
• CPC Class Codes: B41J 2/1634 laser machining

Abstract

A laser beam machining method includes emitting light from a light source to illuminate a mask which has both openings through which light can pass to the object to be machined and blocking parts through which substantially no light can pass. By utilizing the energy of the light, those portions of the object which are exposed through the openings are machined by ablation. The shape and width of both the openings and the blocking parts can be adjusted so as to provide the energy distribution required to form an object of the desired shape and size.

Claims

1. A laser beam machining method comprising the steps of:

emitting light from a light source so that said light illuminates a mask comprising openings through which light can pass and blocking parts through which substantially no light can pass;

illuminating an object to be machined with light passing through said openings of the mask thereby supplying working light to said object;

forming an energy distribution corresponding to a machining configuration on said object by interfering said light which is diffracted at said openings, wherein each of said openings has a width of from 5 μ

m to 30 μ

m, and each of said blocking parts has a width which is less than or equal to 30 μ

m; and

machining said object by the energy of said working light by means of ablation.

2. A laser beam machining method according to claim 1, wherein the shape of the openings and the shape of the blocking parts of said mask are adjusted in accordance with a desired shape into which said object is to be formed so that the working light passing through said mask has an energy distribution to form said object into the desired shape.

3. A laser beam machining method according to claim 2, wherein said shape is a slit.

4. A laser beam machining method according to claim 3, wherein the slit of the mask is formed of a dielectric material.

5. A laser beam machining method according to claim 1, wherein the width of a blocking part of said mask is adjusted relative to the width of an opening of said mask so that the working light passing through said mask has an energy distribution to form said object into the desired shape.

6. A laser beam machining method according to claim 1, wherein said mask is formed of a metal material including at least one of Cr, Ag, Ti, Pt, or Ni.

7. A laser beam machining method according to claim 1, wherein said blocking part has a thickness of from 800 Å

to 2500 Å

.

8. A laser beam machining method according to claim 1, wherein a distance L1 between the mask and the object to be machined is within the range of from 0.3 m to 2.0 m.

9. A laser beam machining method according to claim 1, wherein said mask comprises a first area having a pattern of openings and blocking parts and a second area having a pattern of openings and blocking parts, and wherein the pattern of said first area is different from the pattern of said second area.