Constrained layer damped loudspeaker enclosure

• US 5,949,033 A
• Filed: 10/30/1996
• Issued: 09/07/1999
• Est. Priority Date: 10/30/1996
• Status: Expired due to Term

• Current Assignee: Sony Corporation (Sony Group Corp.), Sony Electronics Inc. (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.), Sony Electronics Inc. (Sony Group Corp.)
• Inventors: Anagnos, Daniel P.
• Primary Examiner(s): LEE, EDDIE C H
• Application Number:
  US08/741,014
• Time in Patent Office: 1,042 Days
• Field of Search: 181/144, 181/145, 181/146, 181/147, 181/148, 181/151, 181/156, 181/199
• US Class Current: 181/148
• CPC Class Codes: H04R 1/288 for loudspeaker transducers
• CPC Class Codes: H04R 1/2888 for loudspeaker transducers

Abstract

A loudspeaker enclosure having a constrained layer damping system for minimizing the propagation of vibrations and controlling the resonant modes of the enclosure. The enclosure has a front baffle board on which a plurality of transducers are mounted, and a plurality of other walls mounted to the baffle board to form a cabinet structure. The front baffle board comprises an interior substrate, an exterior substrate, and a constrained layer damping material sandwiched between and bonded to the two substrates. The constrained layer damping material comprises an energy absorbing thermoplastic alloy having a very high material loss factor. The other walls of the enclosure also comprise an interior substrate and an exterior substrate with a constrained layer damping material sandwiched therebetween. An extensional damping material may also be bonded to an interior surface of the interior substrates to further control vibrations in the enclosure.

Claims

1. A loudspeaker enclosure, comprising:

a baffle board having at least one opening for mounting a transducer;

a plurality of walls connected to said baffle board which together with said baffle board define an enclosure;

said baffle board comprising a constrained layer damping arrangement having a first substrate, a second substrate, and a layer of isolation material sandwiched between and bonded to said first and second substrates;

wherein said isolation material comprises an energy absorbing thermoplastic alloy having a high material loss factor.

2. The loudspeaker enclosure according to claim 1, wherein said layer of isolation material has a thickness in the range of 3.2 mm to 6.4 mm.

3. The loudspeaker enclosure according to claim 1, wherein said first and second substrates are bonded to said layer of isolation material using a two-part adhesive suitable for bonding PVC films to porous fiberboard.

4. The loudspeaker enclosure according to claim 1, wherein said first and second substrates each comprises a pair of panels of medium density fiberboard bonded together with a layer of adhesive.

5. The loudspeaker enclosure according to claim 1, further comprising at least one transducer secured to said baffle board, said transducer having a mounting frame with a mounting surface extending about a circumference of said at least one opening in the baffle board, and a gasket sandwiched between said mounting surface and said baffle board for providing an airtight seal between the transducer and the baffle board.

6. The loudspeaker enclosure according to claim 1, further comprising a layer of extensional damping material bonded to said first substrate on an interior side of said baffle board.

7. The loudspeaker enclosure according to claim 1, wherein said plurality of walls each comprises an interior substrate, an exterior substrate, and a layer of isolation material sandwiched between and bonded to said interior and exterior substrates.

8. The loudspeaker enclosure according to claim 7, wherein the isolation material in said plurality of walls comprises an energy absorbing thermoplastic alloy having a high material loss factor.

9. The loudspeaker enclosure according to claim 7, further comprising a layer of extensional damping material bonded to said interior substrate on an interior side of each of said plurality of walls.

10. The loudspeaker enclosure according to claim 7, wherein a combined thickness of the first and second substrates of the baffle board is greater than a combined thickness of the interior and exterior substrates of said plurality of walls.

11. A loudspeaker having a constrained layer damped enclosure, comprising:

a baffle board and a plurality of transducers mounted to said baffle board;

a plurality of walls connected to said baffle board which together with said baffle board define an enclosure;

a plurality of internal braces extending between said baffle board and said walls for stiffening the walls of the enclosure to increase a resonance frequency of the enclosure;

said baffle board comprising a constrained layer damping arrangement having a first substrate, a second substrate, and a layer of isolation material sandwiched between and bonded to said first and second substrates;

wherein said isolation material comprises an energy absorbing thermoplastic alloy having a high material loss factor.

12. The loudspeaker according to claim 11, wherein the layer of isolation material has a thickness in the range of 3.2 mm to 6.4 mm.

13. The loudspeaker according to claim 11, further comprising a gasket sandwiched between a mounting frame of said transducer and an exterior surface of said baffle board for providing an airtight seal between the transducer and the baffle board.

14. The loudspeaker according to claim 11, further comprising a layer of extensional damping material bonded to said first substrate on an interior side of said baffle board.

15. The loudspeaker according to claim 11, wherein said plurality of walls each comprises an interior substrate, an exterior substrate, and a layer of isolation material sandwiched between and bonded to said interior and exterior substrates.

16. The loudspeaker according to claim 15, wherein the isolation material in said plurality of walls comprises an energy absorbing thermoplastic alloy having a high material loss factor.

17. The loudspeaker according to claim 15, further comprising a layer of extensional damping material bonded to said interior substrate on an interior side of each of said plurality of walls.

18. The loudspeaker according to claim 15, wherein a combined thickness of the first and second substrates of the baffle board is greater than a combined thickness of the interior and exterior substrates of said plurality of walls.

19. A loudspeaker having a constrained layer damped enclosure, comprising:

a baffle board and a plurality of transducers mounted to said baffle board;

a plurality of walls connected to said baffle board which together with said baffle board define an enclosure;

said baffle board comprising a constrained layer damping arrangement having a first substrate, a second substrate, and a first layer of isolation material sandwiched between and bonded to said first and second substrates, said first layer of isolation material comprising an energy absorbing thermoplastic alloy having a high material loss factor and a thickness in the range of 3.2 mm to 6.4 mm;

said plurality of walls each comprises an interior substrate, an exterior substrate, and a second layer of isolation material sandwiched between and bonded to said interior and exterior substrates, said second layer of isolation material comprising an energy absorbing thermoplastic alloy having a high material loss factor;

a combined thickness of the first and second substrates of the baffle board being greater than a combined thickness of the interior and exterior substrates of said plurality of walls; and

further comprising a first layer of extensional damping material bonded to said first substrate on an interior side of said baffle board, and a second layer of extensional damping material bonded to said interior substrate on an interior side of each of said plurality of walls.