Module mounted with semiconductor device

• US 5,949,135 A
• Filed: 12/16/1997
• Issued: 09/07/1999
• Est. Priority Date: 07/15/1997
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Washida, Tetsuro, Ochi, Katsunori
• Primary Examiner(s): Brown, Peter Toby
• Assistant Examiner(s): POTTER, ROY KARL
• Application Number:
  US08/991,485
• Time in Patent Office: 630 Days
• Field of Search: 257/777, 257/778, 257/723, 257/685, 257/686, 257/724
• US Class Current: 257/685
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2225/1029 the support being a lead frame
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/10515 Stacked components
• CPC Class Codes: H05K 2201/1053 Mounted components directly electrically connected to each other, i.e. not via the PCB
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Abstract

A module mounted in relative high density with semiconductor devices is disclosed. The module includes a mounting substrate which has a hole section; a first semiconductor device having bump electrodes which protrude from one principal surface of a package and lead terminals electrically connected to the bump electrodes; a second semiconductor device which also has bump electrodes that can be structurally and electrically coupled with the bump electrodes of the first semiconductor device and where this second semiconductor device is able to be located in the hole section of the mounting substrate, and where the first semiconductor device is able to be supported on the mounting substrate through the lead terminals; and where the bump electrodes of both semiconductor devices are electrically connected to each other.

Claims

1. A module comprising:

a mounting substrate having a recess/opening therein capable of accepting a semiconductor device;

a first semiconductor device having first bump electrodes which protrude from one principal surface of a package, and lead terminals electrically connected to the first bump electrodes; and

a second semiconductor device having second bump electrodes that can be combined with the first bump electrodes of said first semiconductor device and which is able to be lodged in said recess/opening,

said second semiconductor device being lodged in said recess/opening,

said first semiconductor device being physically supported by the lead terminals connected to said mounting substrate in a position in which the first bump electrodes are superposed on the second bump electrodes of said second semiconductor device, and the

first and second bump electrodes of both said first and second semiconductor devices being electrically connected to each other.

2. A module comprising:

a mounting substrate provided with a hole section which can lodge therein a specified semiconductor device;

a first semiconductor device having upper and lower bump electrodes which are formed as protrusions from an upper surface and a lower surface of a package and lead terminals electrically connected to the bump electrodes;

a second semiconductor device which has bump electrodes to be combined with either one of the upper and lower bump electrodes of said first semiconductor device and is able to be lodged in said hole section; and

a third semiconductor device having bump electrodes to be combined with the other one of the upper and lower bump electrodes of said first semiconductor device,

said second semiconductor device being lodged in said hole section, said first semiconductor device being supported on said mounting substrate by said lead terminals in a position in which either of the upper and lower bump electrodes are superposed on the bump electrodes of said second semiconductor,

said third semiconductor device being located in a position in which its bump electrodes are superposed on the other of the upper and lower bump electrodes of said first semiconductor device, and the one bump electrodes of said first semiconductor device and the other bump electrodes of said first semiconductor device being connected respectively to the bump electrodes of said second semiconductor device and the bump electrodes of said third semiconductor device with electrical connectivity therebetween.

3. A module as claimed in claim 2, wherein, at least either one of said second and third semiconductor devices has upper and lower bump electrodes which are formed as protrusions respectively from the upper and lower surfaces of the package, and at least one other semiconductor device is mounted in a stacked manner.

4. An apparatus comprising:

a mounting substrate provided with a recess which can receive a semiconductor device,

a first semiconductor device having a plurality of bump electrodes which protrude from a principal surface of said first semiconductor device and lead terminals electrically connected to the bump electrodes, and

a second semiconductor device having a plurality of bump electrodes which protrude from a principal surface of said second semiconductor in such position as to be alignable with the bump electrodes of said first semiconductor device,

wherein said second semiconductor device is physically located in the recess of said mounting substrate and wherein the bump electrodes are superposed on the bump electrodes of said first semiconductor and electrically connected thereto, and

wherein said first semiconductor device is physically supported on said mounting substrate by the lead terminals.