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Pre-bond cavity air bridge

  • US 5,949,144 A
  • Filed: 05/20/1996
  • Issued: 09/07/1999
  • Est. Priority Date: 05/20/1996
  • Status: Expired due to Term
First Claim
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1. A method for forming an air bridge in a bonded wafer comprising the steps offorming a cavity having a surface in a handle wafer;

  • covering the surface of the cavity with a dielectric layer;

    covering substantially all of a lower surface of a device wafer with an insulating layer to form an enclosed and dielectrically lined cavity;

    bonding the insulating layer on the lower surface of a device wafer to the handle wafer;

    covering an upper surface of the device layer with a first metal layer lying over the cavity of the handle wafer; and

    forming the first metal layer on the upper surface of the device wafer into a metal lead over the cavity of the handle wafer.

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