×

Saw filter encapsulated in a ceramic package with capacitance incorporated therein

  • US 5,949,305 A
  • Filed: 02/10/1997
  • Issued: 09/07/1999
  • Est. Priority Date: 02/28/1996
  • Status: Expired due to Term
First Claim
Patent Images

1. An electrical component comprising:

  • an insulating package member having a flat surface region;

    a conductive pad affixed to the flat surface region of the package member; and

    a chip having a flat surface with an electrode on it, the chip being mounted on the package member so that the flat surface of the chip faces the flat surface region of the package member and so that the electrode is spaced apart from the conductive pad, the electrode at least partially overlapping the conductive pad to capacitively couple the electrode and the conductive pad,wherein the package member has a shoulder adjacent the flat surface region of the package member, andwherein the chip has a peripheral edge that overlaps the shoulder.

View all claims
  • 7 Assignments
Timeline View
Assignment View
    ×
    ×