Saw filter encapsulated in a ceramic package with capacitance incorporated therein

• US 5,949,305 A
• Filed: 02/10/1997
• Issued: 09/07/1999
• Est. Priority Date: 02/28/1996
• Status: Expired due to Term

• Current Assignee: Hanger Solutions, LLC (IP Investments Group LLC)
• Original Assignee: OKI Electric Industry Company Limited
• Inventors: Shimamura, Hajime
• Primary Examiner(s): Pascal, Robert
• Assistant Examiner(s): Summons, Barbara
• Application Number:
  US08/798,165
• Time in Patent Office: 939 Days
• Field of Search: 333/193-196, 310/313 R, 310/313 B, 310/313 C, 310/313 D, 310/340, 310/344, 310/348, 310/349, 310/350
• US Class Current: 333/193
• CPC Class Codes: H03H 9/1071 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
• CPC Class Codes: H03H 9/6433 Coupled resonator filters

Abstract

In a ceramic package for encapsulating a SAW (surface acoustic wave) filter, a metal pad is formed on the bottom of a recess formed in the package. A SAW filter chip is mounted to the package such that propagation paths formed on the chip face the bottom of the recess with the intermediary of a gap. The gap promotes easy impedance adjustment.

Claims

1. An electrical component comprising:

an insulating package member having a flat surface region;

a conductive pad affixed to the flat surface region of the package member; and

a chip having a flat surface with an electrode on it, the chip being mounted on the package member so that the flat surface of the chip faces the flat surface region of the package member and so that the electrode is spaced apart from the conductive pad, the electrode at least partially overlapping the conductive pad to capacitively couple the electrode and the conductive pad,

wherein the package member has a shoulder adjacent the flat surface region of the package member, and

wherein the chip has a peripheral edge that overlaps the shoulder.

2. An electrical component according to claim 1, wherein the chip additionally has another electrode on its flat surface, the another electrode being spaced apart from the conductive pad, and wherein the another electrode at least partially overlaps the conductive pad to capacitively couple the another electrode and the conductive pad.

3. An electrical component according to claim 1, wherein the package member has a recess with a bottom, the flat surface region of the package member being disposed at the bottom of the recess and the chip being disposed inside the recess.

4. An electrical component according to claim 3, wherein the package member comprises ceramic material.

5. An electrical component according to claim 1, wherein the chip is a surface acoustic wave chip.

6. An electrical component comprising:

an insulating package member comprising ceramic material, the package member having a flat surface region and a recess with a bottom, at which the flat surface region is disposed;

a conductive pad affixed to the flat surface region of the package member; and

a chip having a flat surface with an electrode on it, the chip being mounted inside the recess of the package member so that the flat surface of the chip faces the flat surface region of the package member and so that the electrode is spaced apart from the conductive pad, the electrode at least partially overlapping the conductive pad to capacitively couple the electrode and the conductive pad; and

a lid which is affixed to the package member and which closes the recess,

wherein the package member has a shoulder within the recess and adjacent the flat surface region of the package member, and

wherein the chip has a peripheral edge that overlaps the shoulder.

7. An electrical component according to claim 6, wherein the chip is a surface acoustic wave chip.