Fabrication of small-scale cylindrical articles

• US 5,951,881 A
• Filed: 07/22/1996
• Issued: 09/14/1999
• Est. Priority Date: 07/22/1996
• Status: Expired due to Term

• Current Assignee: President and Fellows of Harvard College (Harvard Corporation)
• Original Assignee: President and Fellows of Harvard College (Harvard Corporation)
• Inventors: Jackman, Rebecca J., Rogers, John A., Whitesides, George M.
• Primary Examiner(s): Nuzzolillo, Maria
• Assistant Examiner(s): WEINER, LAURA S
• Application Number:
  US08/681,235
• Time in Patent Office: 1,149 Days
• Field of Search: 216/8, 216/41
• US Class Current: 216/41
• CPC Class Codes: B05D 1/283 Transferring monomolecular layers or solutions of molecules adapted for forming monomolecular layers from carrying elements
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: G02B 6/02138 based on illuminating a phase mask
• CPC Class Codes: G02B 6/02142 based on illuminating or irradiating an amplitude mask, i.e. a mask having a repetitive intensity modulating pattern
• CPC Class Codes: G02B 6/02152 involving moving the fibre or a manufacturing element, stretching of the fibre G02B6/02147 takes precedence
• CPC Class Codes: G03F 7/00 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using photoresist structures for special production processes, see the relevant places, e.g. B44C, H01L, e.g. H01L21/00, H05K
• CPC Class Codes: G03F 7/161 using a previously coated surface, e.g. by stamping or by transfer lamination
• CPC Class Codes: G03F 7/18 Coating curved surfaces
• CPC Class Codes: G03F 7/24 Curved surfaces G03F7/70 takes precedence
• CPC Class Codes: H01F 41/042 by thin film techniques

Abstract

Techniques for fabrication of small-scale metallic structures such as microinductors, microtransformers and stents are described. A chemically active agent such as a catalyst is applied from an applicator in a pattern to an exterior surface of an article, metal is deposited according to the pattern and optionally, removed from the substrate. Where the substrate is cylindrical, the pattern can serve as a stent. Alternatively, a pattern of a self-assembled monolayer can be printed on a surface, which pattern can dictate metal plating or etching resulting in a patterned metal structure that can be cylindrical. In another embodiment, a structure is patterned on a surface that serves as a phase-modulating pattern or amplitude-modulating pattern. The article subsequently is exposed to radiation that can induce a change in refractive index within the article, and the phase-modulating or amplitude-modulating pattern results in different indices of refraction being created in different portions of the article. By this technique, a grating can be written into a core of an optical fiber.

Claims

1. A method comprising:

forming a pattern of a self-assembled monolayer on an exterior surface of a cylindrical article, the pattern including at least one continuous, isolated portion that encircles the cylinder; and

contacting the article with an etchant that reacts chemically with the article thereby removing a portion of the article in a pattern dictated by the pattern of the self-assembled monolayer.

2. A method as in claim 1, wherein the self-assembled monolayer is a resist to the etchant, and the etchant reacts chemically with the article at portions other than portions at which the self-assembled monolayer is formed.

3. A method as in claim 1, wherein the cylindrical article contains a central passageway.

4. A method as in claim 3, wherein the central passageway is constructed and arranged to receive an NMR sample and the article is constructed and arranged for positioning in NMR analysis equipment.

5. A method as in claim 3, wherein the central passageway contains a ferromagnetic material.

6. A method as in claim 1, wherein the exterior surface is a surface of metal.

7. A method as in claim 6, wherein the article comprises a cylindrical substrate having an exterior surface carrying a layer of metal, the method involving contacting the article with an etchant that reacts chemically with the metal thereby degrading a portion of the metal in a pattern.

8. A method as in claim 7, further comprising removing the self-assembled monolayer and plating a second metal on the metal remaining on the substrate.

9. A method as in claim 1, the forming step involving transferring the self-assembled monolayer to the exterior surface of the cylindrical article in the pattern from an application surface of an applicator.

10. A method as in claim 1, comprising forming the self-assembled monolayer on the exterior surface of the cylindrical article in the pattern, while leaving at least one portion of the exterior surface of the article, other than the pattern, free of the self-assembled monolayer.

11. A method as in claim 1, the contacting step involving removing a portion of the article in the pattern, while leaving a remaining portion of the article on the exterior surface of the cylindrical article defining a coil.

12. A method as in claim 1, the contacting step involving removing a portion of the article in the pattern, while leaving a remaining portion of the article on the exterior surface of the cylindrical article defining a stent.

13. A method comprising:

forming, on an exterior surface of a cylindrical substrate, a discontinuous, interconnected, cylindrical, metallic article by providing a layer of metal on the exterior surface of the substrate and removing a first portion of the layer of metal from the exterior surface of the substrate while allowing a second, discontinuous, interconnected portion of the metal layer to remain on the substrate and to define the discontinuous, interconnected, metallic article, the step of removing the first portion comprising transferring to the second portion of the layer of metal, from an application surface of an applicator, a precursor of an etchant resist, forming the resist at the second portion, and exposing the substrate to an etchant that removes the metal at the first portion; and

removing the metallic article from the substrate.

14. A method as in claim 13, the step of removing the first portion comprising chemically etching the first portion of the layer of metal.

15. A method as in claim 13, wherein the precursor comprises a self-assembled monolayer-forming species, the step of forming the resist involving forming a self-assembled monolayer that is resistant to the etchant at the first portion of the metal layer.

16. A method as in claim 13, wherein the precursor comprises a self-assembled monolayer-forming species, the step of forming the resist involving forming a self-assembled monolayer at the first portion of the metal layer and depositing an etchant resist on the self-assembled monolayer.

17. A method as in claim 13, wherein the precursor comprises an activating agent capable of promoting deposition of a metal, and the step of forming the resist involves depositing the metal, via a reaction involving the activating agent, at the second portion of the layer of metal.

18. A method as in claim 13, wherein the metallic article is a coil.

19. A method as in claim 13, wherein the metallic article is a stent.

20. A method comprising forming, on an exterior surface of a cylindrical substrate, a discontinuous, interconnected, cylindrical, metallic article by providing a layer of metal on the exterior surface of the substrate, removing a first portion of the layer of metal from the exterior surface of the substrate while allowing a second, discontinuous, interconnected portion of the metal layer to remain on the substrate, and depositing a metal that defines the discontinuous, interconnected metallic article on the second portion of the metal layer;

and

removing the metallic article from the substrate.

21. A method as in claim 20, wherein the second portion of the metal layer is a catalyst, the depositing step comprising effecting electroless metal deposition at the second portion of the metal layer thereby depositing a metal that defines the discontinuous, interconnected metallic article on the second portion of the metal layer.

22. A method as in claim 20, the depositing step comprising electrochemically depositing a metal that defines the discontinuous, interconnected metallic article on the second portion of the metal layer.

23. A method as in claim 22, wherein the metal layer and the electrochemically deposited metal are the same.

24. A method as in claim 22, the step of removing the first portion comprising chemically etching the first portion of the layer of metal.

25. A method as in claim 24, the step of removing the first portion comprising transferring to the second portion of the layer of metal, from an application surface of an applicator, a precursor of an etchant resist, forming the resist at the second portion, and exposing the substrate to an etchant that removes the metal at the first portion.

26. A method as in claim 25, wherein the precursor comprises a self-assembled monolayer-forming species, the step of forming the resist involving forming a self-assembled monolayer that is resistant to the etchant at the first portion of the metal layer.

27. A method as in claim 25, wherein the precursor comprises a self-assembled monolayer-forming species, the step of forming the resist involving forming a self-assembled monolayer at the first portion of the metal layer and depositing an etchant resist on the self-assembled monolayer.

28. A method as in claim 24, the step of removing the first portion comprising transferring to the first portion of the layer of metal, from an application surface of an applicator, a self-assembled monolayer-forming species to form a self-assembled monolayer at the first portion, forming the resist at the second portion, and exposing the substrate to an etchant that removes the metal at the first portion.