Passive electronic components from nano-precision engineered materials
First Claim
1. A process for producing a ceramic-layer structure for passive electronic components comprising the following steps:
- preparing a suspension of ceramic material in powder form having particle size smaller than the largest one of mean free path, domain size or skin depth in said ceramic material;
depositing said powder of ceramic material over a substrate to form a nanostructured ceramic layer;
sintering said ceramic layer at a temperature sufficient to densify the ceramic layer;
and processing the ceramic layer to from the passive electronic component.
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Accused Products
Abstract
Nanosize powders with particle size smaller than the critical length for specific material properties are used to form the ceramic layers of passive electronic components. Ceramic substrates are coated with electrodes, which are then coated with a ceramic layer from a suspension, preferably a low viscosity suspension, of nanoscale powders. The ceramic layer is dried at low temperatures (preferably below 200 ° C.) and it is sintered to high density (preferably above 90%) at moderate temperatures (preferably low and less than 1,000 ° C.). Once sintered, an electrode layer is coated on top of the ceramic layer to yield an electrode/ceramic/electrode structure.
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Citations
21 Claims
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1. A process for producing a ceramic-layer structure for passive electronic components comprising the following steps:
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preparing a suspension of ceramic material in powder form having particle size smaller than the largest one of mean free path, domain size or skin depth in said ceramic material; depositing said powder of ceramic material over a substrate to form a nanostructured ceramic layer; sintering said ceramic layer at a temperature sufficient to densify the ceramic layer; and processing the ceramic layer to from the passive electronic component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A process for producing a ceramic-layer structure for passive electronic components from a precursor ceramic material, comprising the following steps:
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evaporating the precursor ceramic material in a gaseous atmosphere in a thermal reactor, thereby creating a vapor/gas mixture; quenching said vapor/gas mixture by effecting its expansion through a pressure drop, thereby causing the formation of a nanopowder of ceramic material in a product gas, the nanopowder having particle size smaller than the largest one of mean free path, domain size or skin depth in said ceramic material; separating said nanopowder of ceramic material from said product gas; depositing the nanopowder of ceramic material over a supporting substrate to form a ceramic layer; sintering said ceramic layer at a temperature sufficient to densify said ceramic layer; and processing the ceramic layer to from the passive electronic component. - View Dependent Claims (13, 14, 15, 16, 17)
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18. A process for producing a dielectric-layer structure for capacitors comprising the following steps:
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depositing a layer of electrode material over a supporting substrate to form a first electrode layer; depositing nanoscale particles of dielectric material over said electrode layer to form a dielectric layer, the nanoscale particles having particle size smaller than the largest one of mean free path, domain size or skin depth in said dielectric material; depositing another layer of electrode material over said dielectric layer to form a second electrode layer; sintering said dielectric layer at a temperature sufficient to densify the dielectric layer; and
processing then dielectric layer structure to form the capacitor. - View Dependent Claims (19, 20, 21)
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Specification