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Passive electronic components from nano-precision engineered materials

  • US 5,952,040 A
  • Filed: 10/11/1996
  • Issued: 09/14/1999
  • Est. Priority Date: 10/11/1996
  • Status: Expired due to Term
First Claim
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1. A process for producing a ceramic-layer structure for passive electronic components comprising the following steps:

  • preparing a suspension of ceramic material in powder form having particle size smaller than the largest one of mean free path, domain size or skin depth in said ceramic material;

    depositing said powder of ceramic material over a substrate to form a nanostructured ceramic layer;

    sintering said ceramic layer at a temperature sufficient to densify the ceramic layer;

    and processing the ceramic layer to from the passive electronic component.

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