Method of forming spray deposit and integrated sealer layer

• US 5,952,054 A
• Filed: 11/25/1997
• Issued: 09/14/1999
• Est. Priority Date: 02/28/1996
• Status: Expired due to Fees

• Current Assignee: Nippon Steel Hardfacing Co., Ltd. (Nippon Steel Corporation)
• Original Assignee: Nippon Steel Hardfacing Co., Ltd. (Nippon Steel Corporation)
• Inventors: Sato, Takao, Tarumi, Kiyohiro, Migita, Atsushi
• Primary Examiner(s): Bareford, Katherine A.
• Application Number:
  US08/945,374
• Time in Patent Office: 658 Days
• Field of Search: 427/447, 427/449, 427/454, 427/455
• US Class Current: 427/449
• CPC Class Codes: C23C 4/12 characterised by the method of spraying
• CPC Class Codes: C23C 4/18 After-treatment

Abstract

A spray deposit is formed by applying a spray deposit on a target object, and applying a sealer onto the spray deposit on the target object immediately after the spray deposit is applied on the target object. Thus, a thin layer of sealer components contained in the sealer is formed immediately on the spray deposit while a liquid component of the sealer volatilizes.

Claims

1. A method of forming a spray deposit, comprising:

applying a spray deposit on a target object, wherein the application of the spray deposit is conducted by a method selected from the group consisting of flame spraying, plasma spraying and wire metallizing, and

applying a sealer onto the spray deposit formed on the target object immediately after the spray deposit has been applied on the target object so that a layer of sealer components contained in the sealer is formed immediately on the spray deposit while a liquid component of the sealer volatilizes as a result of the retained heat of the spray deposit from the application of the spray deposit.

2. A method of forming a spray deposit according to claim 1, wherein while the spray deposit and the sealer are being applied onto the target object, the target object is being rotated so that the spray deposit and the sealer are formed on the target object substantially at a same time.

3. A method of forming a spray deposit according to claim 1, wherein after the layer of the sealer components is formed on the spray deposit, a succeeding spray deposit is formed on the thin layer.

4. A method of forming a spray deposit according to claim 1, wherein the spray deposit contains a spray material selected from a group consisting of metal, cermet and ceramics.

5. A method of forming a spray deposit according to claim 1, wherein the sealer comprises a material forming an oxide selected from a group consisting of Cr₂ O₃, Al₂ O₃, SiO₂ and ZrO₂.

6. A method of forming a spray deposit according to claim 1, wherein said sealer contains at least one material selected from a group consisting of silicon compounds, boron compounds, fluorine compounds, nitrogen compounds and carbon compounds so that the layer of sealer contains at least one material selected from a group consisting of silicides, borides, fluorides, nitrides and carbides.

7. A method of forming a spray deposit according to claim 1, further comprising forming a substrate layer on the target object before the spray deposit is applied, said substrate layer being formed by applying a spray deposit on the target object.

8. A method of forming a spray deposit according to claim 1, further comprising providing a heat treatment onto the target object with the spray deposit and the layer, to improve a binding force of components of the spray deposit.

9. A method of forming a spray deposit according to claim 1, further comprising providing a further finishing sealing processing after formation of the spray deposit and application of the layer of sealer.