Chopper for thermal imaging system and method

• US 5,952,661 A
• Filed: 07/31/1997
• Issued: 09/14/1999
• Est. Priority Date: 08/16/1996
• Status: Expired due to Fees

• Current Assignee: L-3 Communications Corporation (L3Harris Technologies, Inc.), Texas Instruments, Inc.
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Klocek, Paul
• Primary Examiner(s): Hannaher, Constantine
• Assistant Examiner(s): Jiron, Darren M.
• Application Number:
  US08/904,145
• Time in Patent Office: 775 Days
• Field of Search: 250/350, 250/351, 250/505.1, 250/332
• US Class Current: 250/351
• CPC Class Codes: G01J 5/0805 Means for chopping radiation
• CPC Class Codes: G08B 13/19 using infrared-radiation detection systems G08B13/194 takes precedence
• CPC Class Codes: H04N 23/23 from thermal infrared radiation
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20

Abstract

Thermal imaging chopper (20) may comprise a disk (40) formed of a thermally transmitting material. The disk (40) may include a structure (44) operable to randomly scatter thermal radiation of the scene (14).

Claims

1. A thermal imaging chopper, comprising:

a disk formed of thermally transmitting material;

the disk including a structure operable to randomly scatter thermal radiation of a scene.

2. The chopper of claim 1, wherein the structure comprises a phase relief pattern formed on a surface of the disk.

3. The chopper of claim 2, wherein the phase relief pattern comprises a plurality of protuberances of varying heights.

4. The chopper of claim 3, wherein the plurality of protuberances comprise pyramidal shapes of varying heights.

5. The chopper of claim 3, wherein the plurality of protuberances comprise square extensions of varying heights.

6. The chopper of claim 2, wherein the phase relief pattern comprises a plurality of grooves of varying depths and orientations.

7. The chopper of claim 2, wherein the phase relief pattern comprises a plurality of protuberances of varying heights, the heights ranging from about three (3) to five (5) times a length of a lower wavelength of the chopper to about three (3) to (5) times a length of the upper wavelength of the chopper.

8. The chopper of claim 2, wherein the phase relief pattern comprises a plurality of protuberances of varying heights, the heights ranging from about three to five times a length of a lower wavelength of a detector for the thermal radiation to about three to five times a length of the upper wavelength of the detector.

9. The chopper of claim 8, wherein the protuberances have bases which have dimensions approximately equal to a wavelength of the detector.

10. The chopper of claim 1, wherein the structure comprises a plurality of fibers of the disk.

11. The chopper of claim 10, wherein the fibers have diameters in the range from about two times to about five times a wavelength of a detector for the thermal radiation.

12. The chopper of claim 11, including voids between the fibers, the voids having sizes in the range from about 3 times to about 5 times a wavelength of the detector.

13. The chopper of claim 1, wherein the disk is formed of a high infrared transmitting material.

14. The chopper of claim 1, wherein the disk is formed of a low infrared transmitting material, the disk further comprising a high infrared transmitting window.

15. The chopper of claim 1, wherein the disk is formed of a polymer.

16. The chopper of claim 15, wherein the polymer disk has a thickness in the range from about 25 microns to 75 microns.

17. The chopper of claim 15, wherein the polymer passes at least 80% of the thermal radiation.

18. The chopper of claim 1, wherein the disk is formed of polyethylene.

19. The chopper of claim 1, wherein the structure has approximately the shape of a spiral.

20. A thermal imaging system for producing an image of a scene in response to incident thermal radiation from the scene, comprising:

optics for focusing incident thermal radiation emitted by the scene onto a focal plane array;

a chopper disposed between the optics and the focal plane array, the chopper comprising;

a disk formed of thermally transmitting material;

the disk including a structure operable to randomly scatter thermal radiation of the scene incident to the focal plane array;

the focal plane array including a plurality of thermal sensors mounted to a substrate, the thermal sensors operable to detect incident thermal radiation;

the thermal sensors cooperating with the chopper to produce a signal;

electronics for receiving and processing the signal to obtain a video signal representing radiance differences emitted by objects in the scene; and

a display for receiving the video signal and for displaying an image generated in response to the video signal.

21. The system of claim 20, wherein the structure comprises a phase relief pattern formed on a surface of the disk, the phase relief pattern comprises a plurality of protuberances of varying heights.

22. The system of claim 21, wherein the plurality of protuberances comprise pyramidal shapes of varying heights.

23. The system of claim 21 wherein the plurality of protuberances comprise square extensions of varying heights.

24. The system of claim 20, wherein the structure comprises a phase relief pattern of a plurality of grooves of varying depths and orientations.

25. A method of normalizing a thermal sensor, comprising the steps of:

periodically disposing a phase relief pattern in a beam of thermal radiation incident to the thermal sensor; and

randomly scattering the beam of thermal radiation.

26. The method of claim 25, wherein the phase relief pattern comprises a plurality of protuberances of varying heights.

27. The method of claim 25, wherein the phase relief pattern comprises a plurality of pyramidal shapes of varying heights.