Non-contact type IC card

• US 5,952,713 A
• Filed: 12/22/1995
• Issued: 09/14/1999
• Est. Priority Date: 12/27/1994
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Takahira, Kenichi, Murasawa, Yasuhiro, Ohbuchi, Jun
• Primary Examiner(s): Arroyo, Teresa M.
• Application Number:
  US08/577,541
• Time in Patent Office: 1,362 Days
• Field of Search: 257/678, 257/679, 257/723, 257/790, 361/737, 235/492
• US Class Current: 257/679
• CPC Class Codes: G06K 19/0722 comprising an arrangement for testing the record carrier
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0195 : Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 2201/10303 : Pin-in-hole mounted pins
• CPC Class Codes: H05K 2203/0191 : Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
• CPC Class Codes: H05K 2203/063 : of preperforated insulating layer
• CPC Class Codes: H05K 2203/1453 : Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/321 : by conductive adhesives
• CPC Class Codes: H05K 3/386 : by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/4046 : using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
• CPC Class Codes: H05K 3/4626 : characterised by the insulating layers or materials H05K3/4688 takes precedence
• CPC Class Codes: H05K 3/4652 : Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: H05K 3/4655 : by using a laminate characterized by the insulating layer general-purpose insulating materials H05K1/03, H05K3/4673

Abstract

A non-contact IC card and a method and apparatus for manufacturing the IC card. The IC card has a small thickness and is manufactured at a low cost, automatically. Electronic parts are mounted on a circuit pattern on a surface of a resin sheet. A filling resin covers the elcetronic parts and fills gaps between them. An electronically insulating plastic material on the filling resin wraps around the filling resin, contacting its side surfaces and saide surfaces of the resin sheet. The plastic material provides added protection to the electronic parts. In a method of manufacturing the non-contact IC card, the laminated structure of the resin sheet, filling resin, and plastic material is subjected to two sequential severing steps. In the first severing step, only the resin sheet and the filling resin are severed, generally in the shape of an IC card that is to be completed. The plastic material is not severed and extends over side surfaces of the resin sheet and filling that are produced in the first cutting step. The plastic material is severed so that it extends beyond the side surfaces of the resin filling material and resin sheet. Finally, the overhanging parts to the resin material are deformed and bent to cover and protect the side surfaces of the resin sheet and the filling resin.

Claims

1. A non-contact IC card comprising:

a resin sheet having opposed first and second surfaces and side surfaces transverse to the first and second surfaces, the first surface defining a first outer surface of the IC card;

a conductive circuit pattern on the second surface of the resin sheet;

electronic parts mounted on the conductive circuit pattern;

an electrically insulating filling resin covering and filling gaps between the conductive circuit pattern and the electronic parts; and

an electrically insulating plastic material disposed opposite the second surface of the resin sheet, covering and contacting the electrically insulating filling resin, and continuously extending onto and covering side surfaces of the filling resin and the side surfaces of the resin sheet.

2. The non-contact IC card according to claim 1 including an electrically conductive adhesive bonding the electronic parts to the conductive circuit pattern.