Reworkable circuit board assembly including a reworkable flip chip

• US 5,953,210 A
• Filed: 07/08/1997
• Issued: 09/14/1999
• Est. Priority Date: 07/08/1997
• Status: Expired due to Term

• Current Assignee: Hanger Solutions, LLC (IP Investments Group LLC)
• Original Assignee: Hughes Electronics Corporation (Rtx Corporation)
• Inventors: Lo, Ching P.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US08/889,429
• Time in Patent Office: 798 Days
• Field of Search: 361/704, 361/705, 361/706, 361/717, 361/1, 361/719, 361/767, 361/768, 361/749, 361/750, 361/771, 361/751, 361/783, 361/820, 174/16.3, 174/252, 174/254, 174/255, 174/259, 174/260, 174/52.4, 257/706, 257/778, 257/780
• US Class Current: 361/704
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer elastomeric conductor H05K2201/0314
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads

Abstract

A reworkable circuit board assembly including a flip chip adapted for removal in the event of a failure and a method for fabricating the same is disclosed. The reworkable circuit board assembly includes a heat sink having a coefficient of thermal expansion substantially matched to the coefficient of thermal expansion of the flip chip. It also includes a deformable circuit board having a first side and a second side, wherein the first side is secured to a side of the heat sink in thermal communication therewith. The flip chip is bonded to the second side of the deformable circuit board without underfill or with weak bond strength underfill to facilitate removal of the flip chip in the event of a rework.

Claims

1. A reworkable circuit board assembly comprising:

a heat sink;

a deformable circuit board having a first side and a second side, the first side being secured to a side of the heat sink in thermal communication therewith to form a heat sink/deformable circuit board assembly; and

,

a flip chip bonded to the second side of the deformable circuit board without underfill to facilitate removal of the flip chip for replacement in the event of a rework, wherein the heat sink has a coefficient of thermal expansion which substantially matches a coefficient of thermal expansion of the flip chip, the deformable circuit board being deformable to release heat-induced stress in a joint between the flip chip and the heat sink/deformable circuit board assembly.

2. A reworkable circuit board assembly as defined in claim 1 wherein the coefficient of thermal expansion of the heat sink is in a range of approximately 3 PPM/°

C. to 6 PPM/°

C.

3. A reworkable circuit board assembly as defined in claim 1 wherein the flip chip is bonded to the deformable circuit board with electrically conductive adhesive.

4. A reworkable circuit board assembly as defined in claim 1 wherein the flip chip is bonded to the deformable circuit board with solder.

5. A reworkable circuit board assembly as defined in claim 1 wherein the deformable circuit board comprises a direct electrical contact array laminate.

6. A reworkable circuit board assembly as defined in claim 1 wherein the deformable circuit board has a substantially uniform thickness from its first side to its second side of less than approximately 15 mil.

7. A reworkable circuit board assembly as defined in claim 1 wherein the deformable circuit board defines a cavity in its second side for receiving the flip chip.

8. A reworkable circuit board assembly as defined in claim 7 wherein the flip chip includes an IC having bond pads, and a bottom layer of the deformable circuit board disposed in the cavity contacts the bond pads of the IC.

9. A reworkable circuit board assembly as defined in claim 1 wherein the flip chip has an IC having bond pads which are plated with corrosion resistant metal.

10. A reworkable circuit board assembly as defined in claim 1 wherein the flip chip has an IC which is passivated with a protective coating.

11. A reworkable circuit board assembly as defined in claim 10 wherein the protective coating comprises one of the group consisting of:

silicon nitride and silicon carbide.

12. A reworkable circuit board assembly comprising:

a heat sink;

a deformable circuit board having a first side and a second side, the first side being secured to a side of the heat sink in thermal communication therewith; and

,

a flip chip bonded to the second side of the deformable circuit board with a weak bond strength, thermally conductive underfill adhesive to facilitate removal of the flip chip for replacement in the event of a rework, wherein the heat sink has a coefficient of thermal expansion which substantially matches a coefficient of thermal expansion of the flip chip, the deformable circuit board being deformable to release heat-induced stress in a joint between the flip chip and a heat sink/deformable circuit board assembly.

13. A reworkable circuit board assembly as define in claim 12 wherein the underfill adhesive comprises aluminum nitride filled with Uralane.