Apparatus including heat sink structure for removing heat from a printed circuit board

• US 5,953,211 A
• Filed: 05/11/1998
• Issued: 09/14/1999
• Est. Priority Date: 07/22/1996
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Compaq Computer Corporation (HP Inc.)
• Inventors: Donahoe, Daniel N., Mecredy, Henry E. III
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US09/076,305
• Time in Patent Office: 491 Days
• Field of Search: 361/687, 361/690, 361/694-697, 361/702-704, 361/717-720, 165/80.3, 165/80.4, 165/122, 165/126, 454/185, 454/184
• US Class Current: 361/704
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid

Abstract

An apparatus, such as a computer, comprises a housing having an interior portion into which a printed circuit board may be inserted. The printed circuit board, when inserted, is supported by a support structure. A spring mechanism resiliently supports a heat sink structure in contact with a major side portion of the inserted printed circuit board. During operation, fluid flows in thermal transfer relationship with the heat sink structure. In this manner, heat is transferred from the heat sink structure to the fluid.

Claims

1. An apparatus comprising:

a housing having an interior portion into which a printed circuit board may be inserted in an insertion direction;

a support structure to removably support a printed circuit board after insertion into the interior portion of the housing;

a thermally conductive heat sink structure disposed within said housing and positionable against the inserted printed circuit board, wherein the heat sink includes a tapered portion such that when the printed circuit board is inserted the board engages a tapered portion of the heat sink and forces the heat sink to move against the printed circuit board;

a spring mechanism for resiliently supporting said heat sink structure in forcible contact with a major side portion of the inserted printed circuit board to receive heat from the inserted printed circuit board, and

a conduit for flowing fluid in thermal transfer relationship with said heat sink structure, wherein heat is transferred from the heat sink structure to the fluid.

2. The apparatus of claim 1 wherein said spring mechanism comprises an elongated leaf spring member having a first end supported in a fixed relationship to said housing, and a second end secured to said heat sink structure.

3. The apparatus of claim 2 wherein, with the printed circuit board removed from said housing, the heat sink is held in a first position by said leaf spring member in a generally unflexed state thereof, said tapered end portion being positioned to be engaged and deflected by a leading end portion of the printed circuit board during insertion of the printed circuit board into the interior of said housing, to a second position that resiliently deflects said leaf spring member in a manner causing it to resiliently and operatively hold said plate member against the inserted printed circuit board.

4. The apparatus of claim 1 and further comprising a fan disposed within said housing, the fan positioned to flow air against said heat sink structure and then to discharge the air from said housing.

5. The apparatus of claim 1 wherein said heat sink structure includes a heat sink plate member having a first side positionable against the major side of the inserted printed circuit board.

6. The apparatus of claim 5 wherein:

said heat sink plate member has a second side from which a spaced plurality of cooling fin structures outwardly project, and said heat sink structure further includes a shroud member extending over said cooling fin structures and forming with said second side of said heat sink plate member an open-ended passage through which cooling air may be flowed, and

wherein the apparatus further comprises a fan positioned to flow air through said open-ended passage.

7. The apparatus of claim 1 wherein:

said heat sink structure includes a metal plate member having a first side positionable against the major side of the inserted printed circuit board and a flow passage extending internally through said plate member and having an inlet and an outlet, and

said conduit is positioned operative to flow a liquid through said flow passage.

8. The apparatus of claim 7 and further comprising:

a pump disposed within said housing, and

a radiator, and

wherein said conduit communicates said inlet and outlet of said flow passage through said pump and radiator.

9. The apparatus of claim 1 wherein said apparatus is a computer.

10. The apparatus of claim 9 wherein said computer is a portable computer.

11. The apparatus of claim 1 wherein the fluid comprises a gas.

12. The apparatus of claim 1 wherein the fluid comprises a liquid.

13. The apparatus of claim 9 wherein said printed circuit board comprises a PCMCIA card.

14. The apparatus of claim 1 wherein the spring mechanism is positioned between opposite end portions of the printed circuit board.

15. An apparatus comprising:

a housing having an interior portion into which a printed circuit board may be inserted in an insertion direction;

a support structure to removably support a printed circuit board after insertion into the interior portion of the housing;

a thermally conductive heat sink structure disposed within said housing and positionable against the inserted printed circuit board;

a spring mechanism for resiliently supporting said heat sink structure in forcible contact with a major side portion of the inserted printed circuit board to receive heat from the inserted printed circuit board, wherein the spring mechanism causes the heat sink structure to move relative to the housing in a second direction transverse to the insertion direction upon insertion of a printed circuit board; and

a conduit for flowing fluid in thermal transfer relationship with said heat sink structure, wherein heat is transferred from the heat sink structure to the fluid.

16. An apparatus comprising:

a housing having an interior portion into which a printed circuit board may be inserted;

a support structure to removably support a printed circuit board after insertion into said interior portion of said housing;

a heat sink structure disposed within said housing;

a spring mechanism, responsive to the insertion of the printed circuit board into the housing, for causing the heat sink mechanism to forcibly engage the inserted printed circuit board to receive heat therefrom, the spring mechanism resiliently supporting the heat sink structure adjacent the interior portion of the housing for movement relative to the housing; and

a conduit for flowing a fluid in thermal transfer relationship with the heat sink structure to receive heat therefrom.

17. The apparatus of claim 16 wherein the housing has an opening through which the printed circuit board can be inserted, the opening being sized to receive a PCMCIA card.

18. The apparatus of claim 16 wherein the spring mechanism is operative to resiliently press the heat sink structure against a major central side portion of the inserted printed circuit board.

19. The apparatus of claim 16 wherein the heat sink structure includes a tapered portion such that when the printed circuit board is inserted the board engages a tapered portion of the heat sink structure and forces the heat sink structure to move into the engaged position.

20. An apparatus comprising:

a housing including a support structure with a connector for receiving an end surface of a circuit board inserted into an interior of the housing portion, the support structure including an inner end wall portion to be adjacent a major surface of the inserted circuit board, the major surface having a greater surface area than the end surface;

a heat sink disposed within the housing portion, the heat sink including a thermally conductive plate member; and

a spring mechanism interconnected between the inner end wall portion and the heat sink structure and operative to resiliently and releasably hold a side of the thermally conductive plate member in forcible contact with the major surface of the inserted circuit board;

wherein, during operation, a fluid flows in thermal transfer relationship with the heat sink structure to transfer heat from the heat sink structure to the fluid.

21. The apparatus of claim 20 wherein the spring mechanism comprises an elongated leaf spring member connected at one end thereof to the inner end wall portion, and at the other end thereof to the heat sink structure.

22. The apparatus of claim 20 wherein the heat sink structure includes a metal plate member having a first side positionable against the major surface of the inserted printed circuit board by the spring mechanism, and a flow passage extending internally through the plate member and having an inlet and an outlet, and wherein the fluid flows through the flow passage.

23. The apparatus of claim 20 and further comprising a fan disposed within the housing portion, wherein the fluid comprises air that flows against the heat sink structure.

24. The apparatus of claim 20 and further comprising a pump disposed within the housing and a radiator, wherein the fluid comprises a liquid that flows through the pump and radiator.

25. The apparatus of claim 20 wherein the printed circuit board comprises:

a circuit board substrate;

a plurality of integrated circuit chips attached to the circuit board substrate; and

a thermally conductive cover which encloses the integrated circuit chips;

wherein the spring mechanism holds a side of the thermally conductive plate member in contact with the thermally conductive cover of the printed circuit board.

26. A portable computer comprising:

a base housing;

a lid housing hingedly secured at an edge portion of the base housing;

a latch mechanism to releasably hold the lid housing in a closed position against the base housing;

a keyboard disposed upon an upper surface of the base housing;

a display disposed upon an outer surface of the lid housing;

a card support housing disposed within the base housing and to receive a circuit card inserted within the base housing; and

a heat sink structure secured to the card support housing by a spring mechanism, the spring mechanism causing the heat sink structure to resiliently press against a side of the circuit card upon insertion of the circuit card within the card support housing.

27. The computer of claim 26 wherein the circuit card comprises a PCMCIA card.

28. The computer of claim 26 and further comprising a conduit for flowing a fluid in thermally conductive relationship with the heat sink structure in order to transfer heat from the inserted circuit card to the fluid.

29. The computer of claim 28 and further comprising a fan positioned to cause air to flow through the conduit and against the heat sink structure.

30. The computer of claim 28 and further comprising a pump for forcing a liquid against the heat sink structure and a radiator to transfer heat from the liquid.

31. The computer of claim 28 wherein the conduit is formed by the base housing and the heat sink structure.

32. An apparatus comprising:

a housing having an interior portion;

a support structure disposed within the housing adjacent a connector;

a printed circuit board disposed within the support structure and operationally coupled to the connector, the printed circuit board including a plurality of integrated circuit chips attached to a substrate and a thermally conductive cover enclosing the integrated circuit chips;

a thermally conductive heat sink structure disposed within said housing and positioned in thermal contact with the thermally conductive cover of the printed circuit board; and

a pathway through which fluid can flow in thermal transfer relationship with said heat sink structure such that heat is transferred from the heat sink structure to the fluid.

33. The apparatus of claim 32 and further comprising a spring mechanism for resiliently supporting said heat sink structure in contact with the thermally conductive cover of printed circuit board.

34. The computer of claim 32 and further comprising a fan positioned to cause air to flow through the pathway.

35. The computer of claim 32 and further comprising a pump for forcing a liquid through the pathway and a radiator to transfer heat from the liquid.

39. The apparatus of claim 32 wherein the thermally conductive heat sink structure includes a tapered portion such that when the printed circuit board is inserted the board engages a tapered portion of the heat sink structure and forces the heat sink structure to move into thermal contact with the thermally conductive cover of the printed circuit board.

36. A method of operating an electronic apparatus which includes a removable printed circuit board inserted within an apparatus housing, the method comprising:

inserting the printed circuit board within the apparatus housing;

in response to inserting the printed circuit board, resiliently pressing a heat sink structure against a side of the printed circuit board with a spring mechanism which is connected between the heat sink structure and the apparatus housing;

conductively transferring printed circuit board operating heat to the heat sink structure;

flowing a fluid against the heat sink structure;

transferring heat from the heat sink structure to the flowing fluid; and

discharging heat from the flowing fluid to ambient air external to the electronic apparatus.

37. The method of claim 36 wherein the step of flowing a fluid against the heat sink structure is performed using a fan, disposed within a housing portion of the electronic apparatus, to flow air against the heat sink structure, and the step of discharging heat from the flowing fluid to ambient air external to the computer is performed by discharging the air from the electronic apparatus after the air has contacted the heat sink structure.

38. The method of claim 36 wherein the step of flowing a fluid against the heat sink structure is performed using a pump, disposed within a housing portion of the electronic apparatus, to flow a liquid internally through the heat sink structure, and the step of discharging heat from the flowing fluid to ambient air external to the electronic apparatus is performed by pumping liquid discharged from the heat sink structure through a radiator.