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Process of making interposers for land grip arrays

  • US 5,953,816 A
  • Filed: 07/16/1997
  • Issued: 09/21/1999
  • Est. Priority Date: 07/16/1997
  • Status: Expired due to Fees
First Claim
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1. A process for forming an interposer, comprising:

  • forming a laminate comprising a first sheet of electrically insulating material having a top surface and plurality of first apertures therethrough and a second sheet of electrically conductive material laminated to a bottom surface of the first sheet, the first apertures being closed by the second sheet;

    removing material of the second sheet around at least some of the first apertures to form conductive pads that closes the at least some of the first apertures so that the conductive pads are in electrical communication with respective first apertures;

    attaching a third sheet of electrically insulating material to a side of the second sheet opposite the first sheet; and

    displacing material from the third sheet to form a plurality of second apertures in the third sheet and the material displaced from the third sheet fills voids in the second sheet left by removal of material of the second sheet to form the pads, the second apertures are closed by the conductive pads so that each conductive pad is in electrical communication with a respective second aperture.

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