Heat resisting member and its production method

• US 5,955,182 A
• Filed: 02/04/1997
• Issued: 09/21/1999
• Est. Priority Date: 02/05/1996
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Suenaga, Seiichi, Inagaki, Hiroki, Yasuda, Kazuhiro, Wada, Kunihiko, Nakahashi, Masako
• Primary Examiner(s): TURNER, ARCHENE A
• Application Number:
  US08/794,068
• Time in Patent Office: 959 Days
• Field of Search: 428/632, 428/623, 428/472, 428/469, 428/216, 428/334, 428/336, 428/701, 428/702, 428/698, 428/212, 428/217, 428/156
• US Class Current: 428/217
• CPC Class Codes: B32B 15/04 comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042
• CPC Class Codes: C23C 28/00 Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
• CPC Class Codes: C23C 28/04 only coatings of inorganic non-metallic material
• CPC Class Codes: C23C 28/3215 at least one MCrAlX layer
• CPC Class Codes: C23C 28/34 including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
• CPC Class Codes: C23C 28/345 with at least one oxide layer
• CPC Class Codes: C23C 28/3455 with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
• CPC Class Codes: C23C 28/36 including layers graded in composition or physical properties
• CPC Class Codes: Y02T 50/60 Efficient propulsion technologies, e.g. for aircraft
• CPC Class Codes: Y10T 428/12549 Adjacent to each other
• CPC Class Codes: Y10T 428/12611 Oxide-containing component
• CPC Class Codes: Y10T 428/24479 including variation in thickness
• CPC Class Codes: Y10T 428/24942 including components having same physical characteristic in differing degree
• CPC Class Codes: Y10T 428/24975 No layer or component greater than 5 mils thick
• CPC Class Codes: Y10T 428/24983 Hardness
• CPC Class Codes: Y10T 428/263 Coating layer not in excess of 5 mils thick or equivalent
• CPC Class Codes: Y10T 428/265 1 mil or less

Abstract

A heat resisting member having ceramics heat shield layers which is directly formed on a metal base material or formed on it via a metal bonded layer formed on the metal base material. The ceramics heat shield layers comprise a first ceramics layer which is formed on the metal base material or the metal bonded layer and has a high elastic modulus, high hardness and high density, and a second ceramics layer which is formed on the first ceramics layer and has a low elastic modulus, low hardness and low density. Delamination from the neighborhood of the interface or oxidation of the lower layer can be prevented by the first ceramics layer which is formed on the metal base material or the metal bonded layer. Thermal shock resistance and heat shielding effect of the ceramics heat shield layers as the whole can be enhanced by the second ceramics layer. And, if necessary, a third ceramics layer having a high elastic modulus, high hardness and high density may be formed on the second ceramics layer in order to improve the abrasion resistance and the resistance against a damage due to flying substances.

Claims

1. A heat resisting member, comprising:

a metal base material;

ceramics heat shield layers formed on said metal base material, said ceramics heat shield layers including a first ceramics layer formed on said metal base material and having a film thickness of 0.1 to 200 μ

m, a high elastic modulus E₁ of 45 GPa or more, and a high hardness H₁, and a second ceramics layer formed on said first ceramics layer and having a film thickness of 50 to 3,000 μ

m, a low elastic modulus E₂ of less than 45 GPa and a low hardness H₂, wherein H₂ <

H₁.

2. The heat resisting member according to claim 1, wherein a total film thickness of said first ceramics layer and said second ceramics layer is 100 to 3000 μ

m.

3. The heat resisting member according to claim 1, wherein said first ceramics layer has a relative density D₁, and said second ceramics layer has a relative density D₂ satisfying D₂ <

D₁.

4. The heat resisting member according to claim 1, wherein said ceramics heat shield layers comprise at least one member selected from the group consisting of zirconia, alumina, alumina-titania mixed oxide, magnesia, spinel, silicon nitride, sialon, aluminum nitride, titanium nitride, and silicon carbide.

5. The heat resisting member according to claim 1, wherein said first ceramics layer is at least one member selected from the group consisting of alumina, alumina-titania mixed oxide, magnesia, and spinel, and said second ceramics layer consists of stabilized zirconia.

6. The heat resisting member according to claim 1, wherein said first ceramics layer and said second ceramics layer are formed of stabilized zirconia.

7. The heat resisting member according to claim 1, wherein said first ceramics layer has surface roughness R₁, and said second ceramics layer has surface roughness R₂ satisfying R₂ >

R₁.

8. The heat resisting member according to claim 7, wherein said second ceramics layer has surface roughness R₂ which satisfies at least one of a ten-point average roughness R_z ≧

55 μ

m, a maximum height R_max ≧

80 μ

m, and a center line average surface R_a ≧

7.5 μ

m.

9. The heat resisting member according to claim 1, further comprising a third ceramics layer which is formed on said second ceramics layer and has a high elastic modulus E₃ satisfying E₃ ≧

E₂ and a high hardness H₃ satisfying H₃ >

H₂.

10. A heat resisting member, comprising:

a metal base material;

a metal bonded layer formed on said metal base material; and

ceramics heat shield layers formed on said metal base material with said metal bonded layer therebetween, said ceramics heat shield layers including a first ceramics layer formed on said metal bonded layer and having a film thickness of 0.1 to 200 μ

m, a high elastic modulus E₁ of 45 GPa or more, and a high hardness H₁, and a second ceramics layer formed on said first ceramics layer and having a film thickness of 50 to 3,000 μ

m, a low elastic modulus E₂ of less than 45 GPa and a low hardness H₂, wherein H₂ <

H₁.

11. The heat resisting member according to claim 10, wherein said first ceramics layer is a ceramics layer formed by one method selected from the group consisting of a PVD method, a CVD method, and a spin coating method, and said second ceramics layer is a ceramics layer formed by a spray coating method.

12. The heat resisting member according to claim 10, wherein said first ceramics layer is a ceramics layer formed by a high-density spray coating method using fine particle powder, and said second ceramics layer is a ceramics layer formed by a low-density spray coating method using coarse powder.

13. The heat resisting member according to claim 10, wherein said metal bonded layer consists essentially of an M--Cr--Al--Y alloy, wherein M is at least one element selected from the group consisting of Fe, Ni and Co, and an alumina layer is formed in the interface between said first ceramics layer and said metal bonded layer.

14. A heat resisting member, comprising:

a metal base material; and

ceramics heat shield layers formed on said metal base material, said ceramics heat shield layer including a first ceramics layer formed on said metal base material and having a film thickness of 0.1 to 200 μ

m, a high elastic modulus E₁ of 45 GPa or more, a high hardness of H₁, and a relative density of 88% or more, and a second ceramics layer formed on said first ceramics layer and having a film thickness of 50 to 3,000 μ

m, a low elastic modulus E₂ of less than 45 GPa, a low hardness H₂, and a relative density of less than 88%, wherein H₂ <

H₁.